- Joined
- Mar 16, 2017
- Messages
- 258 (0.08/day)
- Location
- behind you
Processor | Threadripper 1950X |
---|---|
Motherboard | ASRock X399 Professional Gaming |
Cooling | IceGiant ProSiphon Elite |
Memory | 48GB DDR4 2934MHz |
Video Card(s) | MSI GTX 1080 |
Storage | 4TB Crucial P3 Plus NVMe, 1TB Samsung 980 NVMe, 1TB Inland NVMe, 2TB Western Digital HDD |
Display(s) | 2x 4K60 |
Power Supply | Cooler Master Silent Pro M (1000W) |
Mouse | Corsair Ironclaw Wireless |
Keyboard | Corsair K70 MK.2 |
VR HMD | HTC Vive Pro |
Software | Windows 10, QubesOS |
I've recently been working on a project to figure out how to "decap" integrated circuits using cheap and available tools and chemicals. This has mostly been with smaller chips but I decided to do an old socket 478 Pentium 4 as a surprise to my followers. But I was surprised myself to find that the die wasn't soldered to the IHS and used TIM instead! I thought this was a recent trend and that Intel started using TIM because "the dies were becoming too small to solder." The Pentium 4's die however is fairly large. The one I've torn apart is a 1.7 GHz model manufactured in '01 making it a Willamette chip.
Does anyone know when Intel was using solder, and if they always used TIM on lower end models?
Does anyone know when Intel was using solder, and if they always used TIM on lower end models?