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SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.
While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.
SMART's MIP is an ideal memory solution for the emergence of new cube computing applications in networking, telecom and computing segments, as it leverages SMART's long-term, off-the-shelf stacking expertise. Offered in 2GB and 4GB densities, the MIP runs at speeds up to DDR3-2133.
"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," stated Mike Rubino, SMART's Vice President of Engineering. "The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."
SMART will be showcasing its new MIP at the Embedded World 2014 Exhibition & Conference in Nuremburg, Germany at stand 4-360 starting on February 25, 2014.
View at TechPowerUp Main Site
While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.
SMART's MIP is an ideal memory solution for the emergence of new cube computing applications in networking, telecom and computing segments, as it leverages SMART's long-term, off-the-shelf stacking expertise. Offered in 2GB and 4GB densities, the MIP runs at speeds up to DDR3-2133.
"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," stated Mike Rubino, SMART's Vice President of Engineering. "The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."
SMART will be showcasing its new MIP at the Embedded World 2014 Exhibition & Conference in Nuremburg, Germany at stand 4-360 starting on February 25, 2014.
View at TechPowerUp Main Site
