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Thermal Paste aplication guide and explanation

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Hello guys i've been lurking (jejeje) around for a year or so but haven't posted yet so this is my first post. I've found a comparison betwen the diferent application of thermal paste. It was done by a company calle Innovation cooling (they make diamond thermal paste) so here it is

Proper Application Method
Figure 1 - Correct application amount

5-5.JPG




Figure 1-Proper Application of an approximately 5.0-5.5 mm bead on center example on left utilizing a synthetic IHS. The primary reason we recommend a compression type spreading is that we have found that the best results are attained with a compression type spreading.

The grease spreads uniformly and minimizes the introduction of air bubbles in to the thermal interface joint, a potential cause of grease failure that will affect long term reliability which can be observed in the following examples

Figure 2 - Full mount coverage

proper%2520application.JPG





Figure 2-Here we have the simulated IHS clamped between two slides with 50 psi force applied with the 5.0mm-5.5mm bead application spread pattern by compression.

Simulated mount was heated heated in an oven @ 100C for 20 min to flow the compound. Paste is smooth and even with no visible air pockets.

Wrong Methods With an Explanation

Figure 3 - Example of Air Pocket formation




halo.JPG






In this example IC Diamond was applied between two glass slides and stress tested in an oven @ 150C for 20 hours. Applied 5mm bead of ICD. Photoshopped to highlight the air bubble halo.

Note the halo of air bubbles, this is why it is important to apply enough compound, because as the paste thins it spreads it reaches a maximum zone where air is reformed into the paste application between the sink and IHS

In essence you need enough compound to extend the air pocket zone outside the area of IHS contact
Figure 4 - Competition grease air pocket example


bubbleexample1.JPG



Not unique to IC Diamond Figure 4 is a compression spread of a popular competition compound to show the halo effect is not limited to IC Diamond. Demonstrated here between 2 glass slides and heated @ 125C for 1 hour clamped under pressure it shows initial void formation. The Slide moved a bit by accident, but the air pockets are still visible as the lighter gray spot just inboard of the outer edge.

Air pockets that were not visible in the initial application expanded under heat and pressure so the TIM Joint thickness now has an element of the mount riding on a cushion of air with the potential to affect thermal performance.
Figure 5 - Early grease failure

bubbleexample2.JPG


This is a second popular competition grease mounted between two glass slides and run @ 150C for 20 hours under accelerated testing.

Here the air pockets have migrated together and formed larger voids. the halo is still visible.

This effectively is an early failure of the compound.
Figure 6- Incorrect 3.5 mm bead application

approx3.JPG

This is approximately a 3.5 bead application and not enough to do the Job as it allows the air bubble zone to form inside TIM joint
Figure 7 - "Raw Halo" with trapped air

3.JPG


Here is the same 3.5 bead clamped between two slides. note the TIM application was light with the formation of the extensions which have closed in on itself creating the halo effect on the edges where the "flowers" or "extensions" have reformed trapping air. The "Raw Halo" is clearly visible
Figure 8- Full spread
Fuulspreadapplication.JPG

Figure 8 is the commonly used method that covers the entire IHS
Figure 9 - Full spread with Air Pockets
Fullspreadclampedwithairbubbles.JPG

Same application as above clamped between two glass slides note the white spots these are the initial air bubbles. Again the issue or problems with air bubbles is that air is very difficult to compress and will expand under heat and pressure which will displace the TIM with voids
Figure 10 - Incorrect line method

lineapplication.JPG

Line Application of IC Diamond. Generally single, multiple lines, multiple beads are not recommended as they have a tendency to introduce more air as the separate applications join together closing off opportunities for the air to escape.
Figure 11 - Incorrect line spread
lineclamped.JPG

Line application Of IC Diamond between two glass slides shows good coverage top to bottom, however side to side the formation of cauliflower like extensions that can be seen to be closing or reforming in on itself trapping air.

Figure 12 - Example of manual grease wetting
manualsurfacewetting.JPG

Application Recommendation

A component to paste application to be mindful of is the roughness of the mating surfaces. If you have only lapped up to an 800 grit or less it may be necessary to manually wet the surface the surfaces prior to applying a bead of compound. In this example a light haze of compound was applied to push out any air bubbles or air pockets that may have found purchase in scratches or surface finish


So this it the original link i stracted it : http://www.innovationcooling.com/applicationinstructions.htm

All the copyright belong to them i don't held any of these nor i made any of these test just posting them here as a matter of study and comparison

Tnx all (forgive me if i mispeled something im slowly lossing my english without everyday usage :cry:)

PS: it would also be great to test the different temperatures from each application but im sorry i can't do that because the artic silver 5grms in here (venezuela) cost 50$ and i can't realy afford that (yeah i know it only cost 5$ but our economy it's a long story to tell)
 
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Welcome to TPU. Nice first post. I've always wanted to see TIM under glass.
 
Wow good guide. Bookmarked
 
excellent writeup
 
jejej thnx it's not only under glass and pressure its also heated to emulate a real life usage of the paste. If we know that air and gaps difficult the heat trasnfer, then I can assure that the spot its the best way. Hehehe they solved the long question of "whats the best way to apply"
Would love to se some test so we can have a better comparison
 
Welcome Onderon nice find now i know why i apply the tim this way
 
the only concern i have is that at 100C and 150C its not a valid test. PC's dont get that hot, and for all we know the components used degrade or seperate at such high temperatures.

if they tested at say... 80C, for a longer period i'd trust it. but such high temps in short bursts is very unrealistic, as thermal pastes will not be designed to survive that

the rest of it, talking about application methods and the air bubble formation is quite good.
 
I would say that I don't use enough thermal paste. My TIM apps on processors don't cover the whole heatspreader, but they do cover the die area. Some processors have 2 or more dies so full coverage would be important, but I've never used any of those so I've never had any really bad temps on any of my machines.
 
I would say that I don't use enough thermal paste. My TIM apps on processors don't cover the whole heatspreader, but they do cover the die area. Some processors have 2 or more dies so full coverage would be important, but I've never used any of those so I've never had any really bad temps on any of my machines.

this is also the reason easier to spread thermal pastes like MX2 are popular, its thinner so its more likely to spread evenly rather than spread unevenly and leave the air pockets.
 
I don't spread, I crush the blob with pressure from the heatsink.
 
I've tried spreading and squishing; I think squishing is better. The base of the cooler is much flatter than my credit card and the mounting system applies much more even pressure than I can.
 
There's lots of room for human error when spreading it yourself. I'd rather let the heatsink do the work.
 
There's lots of room for human error when spreading it yourself. I'd rather let the heatsink do the work.


Only one problem with that method though, it leaves all 4 corners of the IHS without TIM on them thus causing the loss of upwards of 25% of heat transfer area that isn't getting proper contact with the heatsink. A thin even layer over the entire IHS of the CPU is the way to go.
 
Only one problem with that method though, it leaves all 4 corners of the IHS without TIM on them thus causing the loss of upwards of 25% of heat transfer area that isn't getting proper contact with the heatsink. A thin even layer over the entire IHS of the CPU is the way to go.

that 25% of the heatspreader probably only contains 1% of the heat. the heat is focused directly above the core.
 
well if you see the examples the bigger the spot of tim you use it's proportional to the amount of coverage, and also if you see when you apply a thin layer after the pressure and the heat applied it creates air bubbles thus decreasing heat transfer capacibility, but well i can only guess at the moment that these tiny bubbles only make if munch 1 degree difference, Personaly i've always used the spot and i can say it's been working great for me.

In two week or so my brother returns from his trip to portugal and he's going to bring me a new heatsink (currently on intel stock) maibe a true or another one good that he finds, when he arrives i will test it with the spot it would be nice if you all in your responses also post the temps reading you get, you HS and what technique you used


for now im
Q6600 B0 @3.0Ghz 1.2 volts MB reports 40°c ambient and Cpu reports 50+-2°c (iddle) loads get's the procesor to 70-78°c


http://valid.canardpc.com/show_oc.php?id=700153
 
Ok so wait what do i follow??
 
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