mikamilover
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- Nov 30, 2009
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Hello,
I have been reading about how the heat sink on x1950xt stinks
. I have been reading about all the aftermarket heat sinks for it. Zalman 900cu and the Arctic Cooling X2 type heat sink. One vents hot air back into case(arctic) and the other vents the hot air onto the 7 arrayed chips in a L formation, and into case as well.
I am looking at my x850xt Pe, and note that it has a similar setup. I have not yet recieved my x1950xt, but looking at the photos of it I can see it has a larger heatsink and opening for it. Me being a old school gearhead, remember hearing stories about header sizing. Some people were putting headers with bigger primaries(i.e) the area around the exhaust port near the header flange(or near the head). The problem was that the larger surface area caused bad scavenging.
I.e. the exhaust gasses were not flowing out of the header any better than a smaller one, and actually worse.
So my point number one is, I would glue a strip of some plastic, or semi rigid material, overthe hole to make the intake area smaller at the rear of the intake plastic case. Theoretically this should increase the flow, and channel the air to the base of the heatsink, and hopefully improve cooling coefficeint or whatever you would call it.
Next the Zalman cooler worked by directing airflow over the L pad area of the chips, and having metal tubes for the main chip. The next flaw it seems to me in the stock fan heat sink assembly would be it draws no air from beneath the plate. If the Zalman is so good at cooling the outer L shaped chips, 8 of them i believe. What i would do here is
to drill some holes on the inside area of the L, and placed strategically so the fan would draw some from under the heatsink, and through the 8 chips. This I believe would be a
a good mod.:shadedshu
I do not think drilling a hold for the main chip situated ahead of the main Cpu chip would help anything as at this point it looks to me like the air would be vented out this hole.
being insde the rotation of the fan this hole would blow air under the card, i think.
Once again I am looking at a x850xt pe at this point and do not know the exact orientation of the fan on a x1950xt. But they look to be of the same fan placement architecture. perhaps a hole here might help, but I would make it smaller than the other holes so as not to disrupt the airflow impetus.(flow direction)
My main question is what would be the ideal size of the drillhole to induce airflow, without
making a reverse blow out the hole airflow. It seems that as long as the holes are outside the fan operating diameter they would suck and not blow. So why not have the best of both worlds, direct L-chip air circulation, and improved air mass movement out of case?
Well that is my thesis, anyone think I have a decent idea going?
I have been reading about how the heat sink on x1950xt stinks
. I have been reading about all the aftermarket heat sinks for it. Zalman 900cu and the Arctic Cooling X2 type heat sink. One vents hot air back into case(arctic) and the other vents the hot air onto the 7 arrayed chips in a L formation, and into case as well.I am looking at my x850xt Pe, and note that it has a similar setup. I have not yet recieved my x1950xt, but looking at the photos of it I can see it has a larger heatsink and opening for it. Me being a old school gearhead, remember hearing stories about header sizing. Some people were putting headers with bigger primaries(i.e) the area around the exhaust port near the header flange(or near the head). The problem was that the larger surface area caused bad scavenging.
I.e. the exhaust gasses were not flowing out of the header any better than a smaller one, and actually worse.So my point number one is, I would glue a strip of some plastic, or semi rigid material, overthe hole to make the intake area smaller at the rear of the intake plastic case. Theoretically this should increase the flow, and channel the air to the base of the heatsink, and hopefully improve cooling coefficeint or whatever you would call it.
Next the Zalman cooler worked by directing airflow over the L pad area of the chips, and having metal tubes for the main chip. The next flaw it seems to me in the stock fan heat sink assembly would be it draws no air from beneath the plate. If the Zalman is so good at cooling the outer L shaped chips, 8 of them i believe. What i would do here is
to drill some holes on the inside area of the L, and placed strategically so the fan would draw some from under the heatsink, and through the 8 chips. This I believe would be a
a good mod.:shadedshu
I do not think drilling a hold for the main chip situated ahead of the main Cpu chip would help anything as at this point it looks to me like the air would be vented out this hole.
being insde the rotation of the fan this hole would blow air under the card, i think.
Once again I am looking at a x850xt pe at this point and do not know the exact orientation of the fan on a x1950xt. But they look to be of the same fan placement architecture. perhaps a hole here might help, but I would make it smaller than the other holes so as not to disrupt the airflow impetus.
(flow direction)My main question is what would be the ideal size of the drillhole to induce airflow, without
making a reverse blow out the hole airflow. It seems that as long as the holes are outside the fan operating diameter they would suck and not blow. So why not have the best of both worlds, direct L-chip air circulation, and improved air mass movement out of case?
Well that is my thesis, anyone think I have a decent idea going?
![[I.R.A]_FBi](https://tpucdn.com/forums/data/avatars/l/39/39344.jpg?1384761935){kind=avatar}
Once again I would have to see x1950 to get the general length of taper, and any possible inner copper heat sink interference.
kickass!
You might also put in a tapered plastic piece on inside base of fan housing,(under fan) making a ramp so that air will exit more forcefully or cleanly, Ie reference 90 degree angle makes a low pressure area, ie cavitating, ie poor air flow. make insert taper cover area from 6 to 9 o'clock under fan. that should also help!!!!!! Remember how some of the ATI cards had a slanted cpu heat sink attachment? Kinda like that angle YEAH!!
It is cooling not warming!!! Get em Lord Monten. Moncton? 
Download FOI2009. zip if you want to read that. Rules of the Game is my favorite thing in there. Sooooo pink