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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
The next big heatsink design at Warm Tek is called Pangolin C1-6. Its design stays true to the design principle of the Hedgehog series, in which each individual heat dissipation surface makes direct contact with the CPU, eliminating the need for heat-pipes (Warm Tek calls this seamless direct conduction). While the Hedgehog series heatsinks uses copper rods, the Pangolin C1-6 uses copper sheets which are tightly stacked up at the base, and fan-out upwards. The exposed copper sheets are treated with anti-oxidants at the factory. Like with the Hedgehog, it's purely pressure holding the sheets together, and the heatsink is weld-free. Although designed primarily for fan-less setups, a fan-clip is being worked on.

View at TechPowerUp Main Site


View at TechPowerUp Main Site