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AMD Confirms Ryzen 3000 "Matisse" Features Soldered IHS

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they better have plenty of stock of 3900x, thats all we in the community care about. if they are sold out for a month straight shame on them. I DESIRE POWER!!!!
Wait for the 3950X then. It'll be the 16c/32t part. Or wait for the new TR parts which will be quad-channel.

With apologies to The Monkeys.
And you should be sorry, using such an awesome song for your fanboy nonsense. Just go away..

After his "in your butts" statement about no PCIe 4.0 on older mobos, I'd take this news with a pinch of salt.
The bandwidth difference between PCIe3 and PCIe4 is there, but no GPU can maximize it and none will for years to come. No one is going to be bottlenecked by PCIe3. Hell, my system is still on PCIe2 and it's still going strong in gaming performance. Mountains out of molehills...
 
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@lexluthermiester I already decided I will wait for pci express 5.0 and ddr5 ram. something tells me intel will be trying to have those in the 10nm gpu launch in summer 2020 as a marketing tactic against AMD, which will then force AMD in x670 chipset 1 year from now to use pci express 5.0

so yeah just going to wait one more year things since things have finally heated up :D
 
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Funny though amd is doing what Intel used to do, launching a 12 core instead of a full 16 cores, milking has started on amd at this time, now is time to see how long amd will be milking, intel has been milking their way for far too long, 11 years or so.
Where did AMD Officially said, they will bring 8 Cores to Ryzen 5 and 12 Cores to Ryzen 7 and 16 Cores to Ryzen 9??
Don't take leak/rumor as official from companies.
AMD said very little about Zen2 based Mattise/Rome Officially. Very little. We don't even know what changed from Zen+ to Zen2 except 256bit floting point. All you see except from IPC, Core count. TDP, clock speed, X570 chipset and launch date are rumor.
 
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That will not happen until 2022 at the earliest.

they just announced they finalized it. and Intel needs leverage. you don't know, and I don't know. but we will see.
 
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@lexluthermiester Why such an angry response top my in jest post? It was all in fun. Did I touch a nerve? That was not the intent.
 
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they just announced they finalized it. and Intel needs leverage. you don't know, and I don't know. but we will see.
Did they? I must have missed that news.. My bad.
@lexluthermiester Why such an angry response top my in jest post? It was all in fun. Did I touch a nerve? That was not the intent.
Not angry, irritated. Honestly, people are getting tired of the fanboy nonsense. Many of us users and pretty much all of the mods. We get it, you love your team. That's great, but is it really necessary to attempt(key word) to tear down the competitors with flaming, passive-aggressive insults and snide comments? And don't deny it either, you went out of your way to not only select but also change the lyrics of a song to make your fanboy point.
 
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Has anyone ever noticed how much thicker Intel lids are compared to AMD heat spreaders? Quite a huge difference.
 
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Has anyone ever noticed how much thicker Intel lids are compared to AMD heat spreaders? Quite a huge difference.
I have. There's got to be a functional reason for it. Heat distribution and dissipation maybe?
 
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I think a bot should post a reply like this in every thread where certain keywords are present in previous posts, like "Intel", "lazy", "ass", "sleeping", "forever", "decade" etc..

We saw that Intel hastily released cfl 6 months before
But that Intel waited so long didn't exactly help them...
 
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What about some kind of graphite/graphene or synthetic diamond surface instead of metal, at least for the area of the spreader directly above CPU dies?

I guess they need more time for that. I'm positive development of such things have already started, now what will determine if is feasible or not is price, metal is cheap, graphene price has been coming down. In 2015, graphene price was "Currently graphene sells for $100 to $200 a gram", but there is a catch that is why development plays a large role, graphene has many varieties and some concern its purity.

"Graphene comes in many varieties so there is not one answer. Do you have an application in mind? If so, I could tell you the type of the graphene and the cost per kilogram.
The cost per kg for >90% monolayer >90% carbon large flake (NSrGO) ranges from $100,000 -$300,000".

 
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I have. There's got to be a functional reason for it. Heat distribution and dissipation maybe?

Yeah I wonder if the extra thickness helps or hurts. Perhaps thicker better if using the flimsy stock heat sink. I'm always amazed by the sheer weight of it so I imagine it can soak up a lot of heat on its own, but with good aftermarket cooling probably thin ihs is better.
 

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Yeah I wonder if the extra thickness helps or hurts. Perhaps thicker better if using the flimsy stock heat sink. I'm always amazed by the sheer weight of it so I imagine it can soak up a lot of heat on its own, but with good aftermarket cooling probably thin ihs is better.

I think it is simpler than that. Intel IHS has to be thick enough to clear the height of the LGA socket retention bracket.
 

maze100X

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i think some people didnt understand the article

this is a picture of an i3 550 for example

not ryzen 3rd gen
 
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Gamers Nexus: 3900X reaching 6Ghz on LN2!

This 6Ghz on Ryzen 3900X means that it's going to break most of i9-7920X/9920X WR's = Very popular on Extreme overclocking community !
*6Ghz on CB =~6.8Ghz for i9-7920X while the max Clock in hwbot is 5980 MHz on i9-7920X.
 
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If this is true and solder is being used on all dice, I seriously wonder how AMD can ensure lonegvity of the CPU. One of the reasons for using thermal grease is that it doesn't suffer from cracking through heat cycling. For one die it's manageable, but when you have three (or even 9 in EPYC) separate dice spread over a large area, soldering them all to one IHS seems to me like a recipe for early failure.
 
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Not angry, irritated. Honestly, people are getting tired of the fanboy nonsense. Many of us users and pretty much all of the mods. We get it, you love your team. That's great, but is it really necessary to attempt(key word) to tear down the competitors with flaming, passive-aggressive insults and snide comments? And don't deny it either, you went out of your way to not only select but also change the lyrics of a song to make your fanboy point.

Well the "like" was the angry one.

It was totally meant as a bit of fun as Clarkdale popped into my head as sounding like Clarksville and it went from there.

If Intel come out with a faster, secure CPU at a better price point I'd be all over it too.

I ran a 4790K for 4 years and a C2D before that, I've had 8800Ultra etc. too. So it was a tongue in cheek take on the situation at the moment.

I hope that makes sense?

I can see how people can be a bit sensitive at the moment as some of the posts around the web are indeed over the top/aggressive/bullying and should be moderated, but certain sites (not TPU in this case) are more interested in traffic than civil commenting.

So sorry if you mis-interpreted my attempt at humour.
 
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I believe an 8 core is a totally safe buy in terms of "future proofing".
I've put the above in quotes because I heard it so many times from people who know bollocks about hardware, and others who, even if they know their CPU from the GPU, insist on making predictions as if that was possible. As if you could formulate the present in an equation and thus extrapolate to the next 10 or 15 years: yeah, sure, just like Economists and Sociologists do with such success (I'm being sarcastic folks :rolleyes: )
Just buy your f***ing processor, 6 or 8 core and get on with it. Oh, and spend more time using it for gaming instead of benchmarks.
considering a core 2 quad with a decent oc is still completely playable past 30fps in most new titles id say a current 8 core will last a LONG time
 
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Not angry, irritated. Honestly, people are getting tired of the fanboy nonsense.

Do you know the phrase 'Beauty is in the eye of the beholder'?

It applies here. You are the one dropping the fanboy bomb now, spending multiple posts in this topic with it (and equally as many responses that evokes, its half a page now ;)). Reflect... This is seriously only a problem with those that feel it is one. Statements are getting torn out of context all the time over here, and that gets the ball rolling. This right here is the perfect example of it. You even speak for the mods now with this sentiment... interesting.

If you want that to change, stop pointing at it and use a different pair of glasses.
 
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Benchmark Scores I once had +100 dorfs in DF, so yeah pretty great
they better have plenty of stock of 3900x, thats all we in the community care about.

Naah. Depends on the community though.
 

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To all shills on both sides, this is a topic about thermal transfer, and the new CPU's being soldered and not with paste.
Not about which company makes more cores.

So... let's see.
If the IHS for 3900X is soldered and one slaps a 200W high-perf water cooler on it... I wonder what that 105W TDP cpu can do with (near) double the headroom?
I run my 2700x peakinfg 232w in IBT with my daily overclock. Tahts over 200% of stock one :D
 
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I hope that makes sense?
Actually it does. Thank You for clarifying.
You even speak for the mods now with this sentiment...
I spoke OF the mods, not for them. The difference might seem subtle but it is distinct.

Yeah I wonder if the extra thickness helps or hurts.
I wonder that as well. And it's not something that's new, Intel has been doing this for a long time, but not always consistently
Perhaps thicker better if using the flimsy stock heat sink. I'm always amazed by the sheer weight of it so I imagine it can soak up a lot of heat on its own, but with good aftermarket cooling probably thin ihs is better.
There's got to be some science behind it or they wouldn't have started making IHS's that way and continue to do so.
 
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So that die in the CES presentation was offset to the side just to tease us. The final 8 core die package has it centered.

@lexluthermiester Why such an angry response top my in jest post? It was all in fun. Did I touch a nerve? That was not the intent.
Look at their post history, they're just being adversarial period.
 

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So that die in the CES presentation was offset to the side just to tease us. The final 8 core die package has it centered.

The picture in the first post is not a Ryzen CPU, it's not even an AMD CPU.
 
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The picture in the first post is not a Ryzen CPU, it's not even an AMD CPU.
True and this was brought to the attention of the admins..
 
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