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AMD IHS not Flat

you get a polish with a circular motion and it rubs in
you can get lines and groves with a up down motion

people often think you can sand anyway you like often best to do the last sand with a circular motion

get a block and piece of paper bigger than the cpu either way you wont get a concave or convex cpu, i dont even see how doing that would make it rounded? or bulge in or out aka concave convex

on metal it polishes when sanded round, leaves lines and crap dont make me scan the SQA certificate to make me prove you wrong i do have the qualification
 
MilkyWay said:
you get a polish with a circular motion and it rubs in
you can get lines and groves with a up down motion

people often think you can sand anyway you like often best to do the last sand with a circular motion

get a block and piece of paper bigger than the cpu either way you wont get a concave or convex cpu, i dont even see how doing that would make it rounded? or bulge in or out aka concave convex

on metal it polishes when sanded round, leaves lines and crap dont make me scan the SQA certificate to make me prove you wrong i do have the qualification
Click to expand...

I will have to try this I get my new board today umm I hope it arrives today. See if i can get some even lower temps will do the CPU cooler. :D
 
Last edited by a moderator:
I thought I would follow up with my results and thoughts.

After the lapping, I re assembled my comp as usual. First thing I noticed when I stuck my HSF on was that there was alot of suction. Similar to the water drop test to check HSF flatness. I had never felt that before. That inspired me right there.

After firing my rig up I noticed about a 8-9c drop in temps at idle. And the two cores were only 1-2c off from one another, where they had been around 5-6c difference.

So, last night after giving the TIM time to set up and break in, I ran OCCT to see where my temps were at full load. After 20 mins of testing my Temps were 39-41c. This was at least 8c drop from my previous readings. Voltages and temps were damn near a str8 line across the OCCT graphs.

I will do some OC'ing this weekend. See if the lower temps translate into a higher OC ceiling.

Edit: I forgot to mention I had also done a clean up pass on the HSF too. It didnt take much though at all to bring to flat.
 
Congrats mate. i need to lapp mine again, i want a thinner layer of copper :)
 
Most of the 939 IHS's that have the very squared off edges are slightly concave. I used a piece of the black cpu packing foam to protect the pins on my a64 socket 939 chip. Just pressed the foam onto the pins, then pressed on the foam while lapping the IHS.
 
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