HellasVagabond
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- Jan 19, 2007
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| System Name | SECONDARY RIG / PRIMARY RIG / THIRD RIG |
|---|---|
| Processor | i920@3.6GHz / i920@4GHz / AMD Phenom II 955 |
| Motherboard | Gigabyte EX58-UD4P / Gigabyte EX58-UD7 / ASRock 890GX3 |
| Cooling | CoolIT Domino ALC / Thermalright Silver Arrow / Thermalright VenomousX |
| Memory | 12GB DDR3 @ 1800MHZ / 6GB DDR3 @ 2250MHZ / 4GB DDR3 @ 1600MHZ |
| Video Card(s) | XFX ATI RADEON 5970 / GAINWARD NVIDIA GTX 580 / 2xGEFORCE GTX295 |
| Storage | 1550GB / 6TB SAS - SSD / 160GB SSD |
| Display(s) | NEC 26WUXi2 / NEC 3090WQXi / SONY 55A2000 (1080P 55inch) |
| Case | COOLER MASTER HAF 932 / COOLER MASTER ATCS 840 / ANTEC DARKFLEET DF85 |
| Audio Device(s) | Soundblaster X-Fi Xtreme Music / SoundBlaster X-Fi Fatal1ty Pro / Realtek Onboard |
| Power Supply | CWT 1200W / Enermax Revolution 85+ 1250W / Ikonik Vulcan 1200W |
| Software | Windows 7 x64 / Windows 7 x64 / Windows 7 x64 |
Toshiba announced today a dedicated 3D graphics LSI that promises unseen levels of realism and excitement to games played on mobile phones.
The new LSI, "TC35711XBG", is able to render 100 mega-polygons a second a number that is many times over better than the ones we find in handheld consoles.
Toshiba's new chip integrates a new developed 3D graphics processor that achieves 38 times the performance of existing products. Its advanced capabilities open the way to further development of software applications of mobile phones. The new chip is also compatible with programmable shader, and its rendering capabilities will bring realistic shading and reflectivity to mobile phones for the first time.
Alongside the new 3D graphics processor, the new LSI also integrates Toshiba's "Media Embedded Processor" (MeP) to handle sound, a host processor, a WVGA LCD controller for wide-screen displays, and brings all the essential components of a game console onto a single chip dedicated to enhancing mobile phone game performance.
Toshiba stated that it would start mass production of the new LSI in the 2Q of CY2008.
View at TechPowerUp Main Site
The new LSI, "TC35711XBG", is able to render 100 mega-polygons a second a number that is many times over better than the ones we find in handheld consoles.
Toshiba's new chip integrates a new developed 3D graphics processor that achieves 38 times the performance of existing products. Its advanced capabilities open the way to further development of software applications of mobile phones. The new chip is also compatible with programmable shader, and its rendering capabilities will bring realistic shading and reflectivity to mobile phones for the first time.
Alongside the new 3D graphics processor, the new LSI also integrates Toshiba's "Media Embedded Processor" (MeP) to handle sound, a host processor, a WVGA LCD controller for wide-screen displays, and brings all the essential components of a game console onto a single chip dedicated to enhancing mobile phone game performance.
Toshiba stated that it would start mass production of the new LSI in the 2Q of CY2008.
View at TechPowerUp Main Site
