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IBM and 3M team up to create 3D chips

Discussion in 'Science & Technology' started by twilyth, Sep 10, 2011.

  1. twilyth Guest

    The idea is to stack chips, as many as 1000, and separate the individual slabs of silicon with a heat conducting adhesive.

    3M and IBM want to build silicon towers - TG Daily

    Last edited by a moderator: Nov 20, 2013
    10 Year Member at TPU
  2. FordGT90Concept

    FordGT90Concept "I go fast!1!11!1!"

    Oct 13, 2008
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    IA, USA
    I had a very similar idea back in 2006. I'm glad to see it happening. I'm sure it substantially increases production costs though.
    Crunching for Team TPU
  3. Drone


    Sep 1, 2010
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    Ah this again. Would like to see some 4D chips. It's like when a cpu already finishes calculations before it gets instructions. Now that'd be really cool.

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