Indigo Xtreme Thermal Interface

[Durvelle27]

Anyone used this before

I got some for my build and so far I'm not having any good luck with it. Even after doing a burn in to allow the reflow process the CPU idles around 62*C with my custom loop that has a 360mm rad. Is there a trick to this thermal compound ?

 

[FR@NK]

62C at idle is like the block isnt mounting flush with the CPU.

 

[TheoneandonlyMrK]

Anyone used this before

I got some for my build and so far I'm not having any good luck with it. Even after doing a burn in to allow the reflow process the CPU idles around 62*C with my custom loop that has a 360mm rad. Is there a trick to this thermal compound ?

I got a kit but wasn't up for metal reflowing at high temps, it is the Tim you get specifically for the socket ,a metal reflowing type?
Sorry it's like the pic just appeared ,you have to force your system into very high temps to get the initial reflow done right and obviously fit it so it melts downward into the gap of hsf and CPU, I chickened out I read 90 degree temps are needed.

 

[Durvelle27]

I got a kit but wasn't up for metal reflowing at high temps, it is the Tim you get specifically for the socket ,a metal reflowing type?
Sorry it's like the pic just appeared ,you have to force your system into very high temps to get the initial reflow done right and obviously fit it so it melts downward into the gap of his and CPU, I chickened out I read 90 degree temps are needed.

Yep socket specific (1366)

I let it hit 94°C for a few mintues and then shutdown and let it cool for about 20 mintues

Booted back up and temps were still high. Like mentioned 40-60°C at idle

 

[TheoneandonlyMrK]

Yep socket specific (1366)

I let it hit 94°C for a few mintues and then shutdown and let it cool for about 20 mintues

Booted back up and temps were still high. Like mentioned 40-60°C at idle

It doesn't sound like it has set right then, you clearly got it hot enough , might be worth retrying setting it ,is the Pc built or on a cardboard box.

 

[Arrakis9]

You have to stress test it until you see a very sharp drop in Temps across all cores. Sounds like you didn't completely reflow the material. You don't need to reapply it just bench it again until the temp drops sharply.

ALSO VERY IMPORTANT if your using a waterblock with this stuff you do not want ANY liquid in the block while reflowing.

 

[Durvelle27]

It doesn't sound like it has set right then, you clearly got it hot enough , might be worth retrying setting it ,is the Pc built or on a cardboard box.

PC is built

You have to stress test it until you see a very sharp drop in Temps across all cores. Sounds like you didn't completely reflow the material. You don't need to reapply it just bench it again until the temp drops sharply.

ALSO VERY IMPORTANT if your using a waterblock with this stuff you do not want ANY liquid in the block while reflowing.

Yes i have water in blocks and the pump was running

 

[peche]

how was the application method, was easy to spread? tell us moar about the paste, i havent used but i like the topic....! And have several questions.. about it ..!!



Regards,

 

[Durvelle27]

Found the problem

The indigo didn't spread at all

Honestly the details aren't clear enough to fully explain how to install when ulitizing blocks.

Persoanlly i will stick to normal TIM

 

[TheoneandonlyMrK]

Found the problem

The indigo didn't spread at all

Honestly the details aren't clear enough to fully explain how to install when ulitizing blocks.

Persoanlly i will stick to normal TIM

That's what I thought had happened , I think water cooling it limits the heat put into the Tim , personally I doubted it was worth the effort of using it over normal Tim ,but I still have it so I'm keen for you to test it , seriously I wouldn't bother but if you do I'm interested in the results.
I asked about the case because on cardboard box would generate more socket heat I'd expect and you might be able to see the CPU to IHS seem to gauge flow success, i expect it has to flow down into it though which excludes a cardboard box being used come to think of it.

 

[Durvelle27]

That's what I thought had happened , I think water cooling it limits the heat put into the Tim , personally I doubted it was worth the effort of using it over normal Tim ,but I still have it so I'm keen for you to test it , seriously I wouldn't bother but if you do I'm interested in the results.
I asked about the case because on cardboard box would generate more socket heat I'd expect and you might be able to see the CPU to IHS seem to gauge flow success, i expect it has to flow down into it though which excludes a cardboard box being used come to think of it.

The one i had was one application so i have no way of testing another

 

[TheoneandonlyMrK]

I'm taking that as a double dare, ,and chickening out again

 

[biffzinker]

Since you were interested in a liquid metal TIM would you be up for going with Thermal Grizzly Conductonaut? I myself would have used it in place of CooLaboratory Ultra liquid metal if I'd of known of Thermal Grizzly.
http://thermal-grizzly.com/en/products/26-conductonaut-en

 

[peche]

Since you were interested in a liquid metal TIM would you be up for going with Thermal Grizzly Conductonaut? I myself would have used it in place of CooLaboratory Ultra liquid metal if I'd of known of Thermal Grizzly.
http://thermal-grizzly.com/en/products/26-conductonaut-en

you use it the processor you have listed as delidded gues... OP cannot do a delid on a 1366 xeon ... its soldered lad, thats why he might tried that weird cr*p


Regards,

 

[Durvelle27]

I'm taking that as a double dare, ,and chickening out again

If you send one this way I'll be more then happy to test again

 

[biffzinker]

Could still use the liquid metal TIM on top of the heatspreader, and heatsink.

For me, I placed the heatspreader back on top of the die with the liquid metal as the TIM for the bare die.

Edit: Durvelle27 could still delid, he just needs a blow torch is all.

Edit2: I tried running without the heatspreader, temperatures were phenomenal but there wasn't enough downward pressure from the heatsinks mounting bar when I flipped the case upright. I forgot something I was using pads similar to what the bare die Athlon XP used to prevent the heatsink from crunching the corners of exposed die.

 

[Mussels]

Since you were interested in a liquid metal TIM would you be up for going with Thermal Grizzly Conductonaut? I myself would have used it in place of CooLaboratory Ultra liquid metal if I'd of known of Thermal Grizzly.
http://thermal-grizzly.com/en/products/26-conductonaut-en

i used CLU as well, and my next paste will be conductonaut as well. Same benefits, easier to apply.

 

[Durvelle27]

Well guys

Thanks to the help of stinger I'll be using IC TIM

Won't be looking at anything else for awhile

 

[Caring1]

OP cannot do a delid on a 1366 xeon ... its soldered lad, thats why he might tried that weird cr*p


Regards,

That sounds like a challenge

 

[peche]

Well guys

Thanks to the help of stinger I'll be using IC TIM

Won't be looking at anything else for awhile

Arctic MX4 or Thermal Grizzly!

Regards,

 

[Durvelle27]

That sounds like a challenge

accept the challenge

Arctic MX4 or Thermal Grizzly!

Regards,

IC Diamond

 

[Mussels]

accept the challenge


IC Diamond

IC diamond is somewhat hated around here on TPU. Loooong history.

 

[dorsetknob]

IC diamond is somewhat hated around here on TPU. Loooong history.

And don't forget liq gallium the Aluminum eating Stuff

 

[biffzinker]

And don't forget liq gallium the Aluminum eating Stuff

Nickel plated copper for the heatspreader/heatsink, so nothing to worry about.

 

[Durvelle27]

IC diamond is somewhat hated around here on TPU. Loooong history.

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