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Intel Shows Off Industry's First Fully-Patterned 450 mm Wafer

btarunr

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btarunr

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#2
Many Thanks to NHKS for the tip.
 
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#3
It looks to be as if cookie monster had taken a bite out of that wafer.


lol oh crap its a reflection and I just now see it.
 
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#4
Out of curiosity, why weren't large wafers used a long time ago? Hasn't it always made economic sense to have large wafers?
 
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#5
Out of curiosity, why weren't large wafers used a long time ago? Hasn't it always made economic sense to have large wafers?
From the good folks at Wiki:
Other initial technical problems in the ramp up to 300 mm included vibrational effects, gravitational bending (sag), and problems with flatness. Among the new problems in the ramp up to 450 mm are that the crystal ingots will be 3 times heavier (total weight a metric ton) and take 2-4 times longer to cool, and the process time will be double. All told, the development of 450 mm wafers require significant engineering, time, and cost to overcome.
[source]
 

de.das.dude

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#6
so you slice this up like a pizza to get ivy bridge chips?
 
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#7
No. In a matrix.
 

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#8
i know its in a matrix. :rolleyes:
 
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#10
From the good folks at Wiki:

[source]
Additionally, one of the biggest problem points is polishing operations. It's not easy to get a wafer to polish evenly when you scale up the size...
 
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#11
He's wearing gloves but resting it on his shirt. I would have gotten in so much poop if I did that.
 
Last edited:

btarunr

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#12
He's wearing gloves but resting it on his shirt. I would have gotten in so much shit if I did that.
That wafer is already expendable after it's come in contact with normal air (normal SPM). It can't be diced, bumped, or packaged anymore. He's using gloves just to prevent ugly fingerprints.