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OCZ Cooperates with Shuttle, ASUSTeK, and ABIT to Host the 2006 Asia Pacific Technology Summit

Discussion in 'News' started by malware, Dec 7, 2006.

  1. malware New Member

    Nov 7, 2004
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    OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today hosts a special APAC Summit with key platform partners to address overclocking and introduce the new products, the latest platforms and total solutions for the coming year. This event takes place on Dec 7th, and is co-hosted by leading edge manufacturers Shuttle, ASUSTeK, and ABIT.

    Overclocking and cross platform cooperation are the key topics at the event. OCZ, Shuttle, and ASUSTeK will kick off the event by releasing a number of new products aimed at gamers and enthusiasts. In addition, OCZ has partnered up with numerous motherboard manufacturers to deliver the very best performance and compatibility to high end users. These motherboard platform partners also showcase their latest platforms at the conference. Platform providers that are participating in the event include ASUSTeK, ABIT, Albatron, DFI, Gigabyte, BIOSTAR, SiS and Shuttle.

    “At OCZ we are excited to cooperate with Shuttle, ASUSTeK, and the top industry platform partners to deliver advanced products and solutions,” commented Alex Mei, VP of Marketing and Communications, OCZ Technology Inc. “The APAC Summit in Taipei is an opportunity for us to co-develop overclocking and gaming solutions on next generation platforms and ultimately deliver a superior total offering to consumers in all regions.”

    “ASUSTeK is the industry leader in high performance motherboards, and a pioneer in supporting overclocking friendly features” commented Richard Liu, Director of motherboard product managers at ASUSTeK Computer Inc. “We are excited to work closely with OCZ Technology to provide customers with an even richer total overclocking experience.”

    OCZ Technology Group will cooperate at the product and marketing level with Shuttle and ASUSTeK to provide next generation solutions. By doing so the three companies alongside the leading motherboard manufacturers will introduce new overclocking and gaming total solutions to the enthusiast market in the coming year. In addition OCZ announced that branded memory, power management, and cooling solutions will be made available to customers in the APAC region starting in January 07.

    “OCZ APAC’s goal is to provide the best products and technical support to our customers and end-users in the Asia Pacific Region.” stated Scott Suo, OCZ APAC General Manager. “OCZ APAC will start to ship a wide range of branded products to the major APAC distributors and channels in January 2007.”

    Source: OCZ Technology
    10 Year Member at TPU

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