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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
PCI-SIG (Special Interest Group), the organisation responsible for development of PCI specifications announced that generation 3 PCI-Express (PCI-E 3.0), is off its target launch time from late-2009 to Q2 2010. Although work on the bus is almost finished, there seems to be problems with implementing backwards-compatibility with older generations of PCI-E. Assuming PCI-E 3.0 is standardised in Q2 2010, one can expect implementing products (motherboards and expansion cards supporting PCI-E 3.0) only by a year later.
PCI-E 3.0 packs features that overcome the bottlenecks of PCI-E 2.0, such as the removal of the 8P/10b encoding scheme that added at least 20% data overhead for the 5 GT/s PCI-E 2.0, reducing it to 4 GT/s effective. At 8 GT/s the new bus will have effectively twice the bandwidth.
View at TechPowerUp Main Site
PCI-E 3.0 packs features that overcome the bottlenecks of PCI-E 2.0, such as the removal of the 8P/10b encoding scheme that added at least 20% data overhead for the 5 GT/s PCI-E 2.0, reducing it to 4 GT/s effective. At 8 GT/s the new bus will have effectively twice the bandwidth.
View at TechPowerUp Main Site
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