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TSMC Begins Experimenting with Rectangular Panel-Like Chip Packaging

I'm pretty certain this news item is about packaging alone - making interposers in particular. ie: The rectangular wafers are not for making dies.
Yeah, that's how I interpret it too.

The actual die wafers are still going to be round, because they're sliced pure silicon crystals. You don't get to choose the shape of the crystals, that's predetermined by the polarity and bond arrangement of silicon atoms.
 
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