PC hardware exhibitionists will pleased to discover that NBROS—a Japanese DIY parts specialist—is about to release display stands for CPUs and M.2 SSDs. News outlets were alerted to new retail listings on Yodobashi.com by an ever trusty internet sleuth: momomo_us. The CPU display stand (NB-CPU-DP07) and M.2 SSD display stand (NB-M2SSD-DP06) models are available to purchase, although the shipping date appears to be February 29—implying that you can only pre-order at this stage in time. The made-in-Japan CPU stand is priced at ¥1850 (~$12.34) including VAT, while the M.2-oriented display piece comes in at ¥2180 (~$14.54)—both offered with free delivery options.

The NBROS NB-CPU-DP07 display stand is formed of black-painted iron plating, with a stated thickness of 1.6 mm—overall dimensions seem to be 65 x 65 x 50 mm, and it weighs roughly 80 grams according to the Yodobashi listing. The display surface dimensions are not documented, but accompanying photos indicate that all sorts of CPU footprints are supported—including EPYC and Xeon profiles. The retail package bundles in a few helpful extras: a suction pad, rubber feet and an instruction manual. The NB-M2SSD-DP06 model is a larger and heftier prospect, with 85 x 100 x 95 mm dimensions and an approximate weight of 250 g. The NBROS 1.6 mm thick metal plate construction is once again employed, but the NB-M2SSD-DP06's accessory pack differs slightly—you get a set of mounting screw instead of a suction pad. The chunkiest and most robust M.2 2280 designs can be fastened onto its display stand.

Pat Gelsinger—CEO of Intel Corporation—happily revealed late last month, during an earnings call: "Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." The former is positioned as the natural successor to Team Blue's many-times-delayed Xeon "Sierra Forest" (all E-Core) processor family. Intel's second generation E-core Xeon "Clearwater Forest" design is expected to launch in 2025, with a deployment of "Darkmont" efficiency-oriented cores. Official product roadmaps and patch notes have revealed basic "Clearwater Forest" information, but we have not seen many leaks. Bionic_Squash has a history of releasing strictly internal Intel presentation slides—Meteor Lake (MTL-S) desktop SKUs were uncovered last April.

Their latest discovery does not include any photo or documented evidence—Bionic_Squash's concise social media post stated: "Clearwater Forest uses 3D stacking with hybrid bonding." This claim points to the possible deployment of Foveros Direct advanced packaging—this technology was expected to be ready at some point within the second half of 2023, although a mid-December technology showcase implied that things were behind schedule. The fanciest "Clearwater Forest" Xeon processors could arrive with a maximum total of 288 E-core count (and 288 threads)—according to Wccftech analysis: "The CPU package is going to consist of a base tile on top of the interposer which is connected through a high-speed I/O, EMIB, and the cores will be sitting on the topmost layer...Foveros Direct technology will allow direct copper-to-copper bonding, enabling low resistance interconnects and around 10-micron bump pitches. Intel itself states that Foveros Direct will blur the boundary between where the wafer ends and the package begins."

The mysterious Zen 6 "Morpheus" processor architecture was leaked accidentally by an AMD engineer's LinkedIn profile—news outlets picked up on this information last April. Naturally, Team Red's next priority is Zen 5—the latest reports suggest that two different chiplet designs are penciled in for mass production within the second quarter of 2024. Last September, insiders claimed that a proposed EPYC 9006 "Venice" CPU series was based on the sixth-gen microarchitecture. Everest/Olrak_29 has revealed various bits of speculative material regarding futuristic "Ryzen Client" processor designs since the start of 2024.

The latest postings to social media posit that AMD has selected an RDNA 5-based integrated graphics solution (possibly occupying a tile), thus "skipping RDNA 4" on their "Medusa" lineup of Ryzen Client processors. Leaked Microsoft documents revealed that its Xbox hardware design division was considering RDNA 5 for next-gen console specs. Medusa's CPU aspect is allegedly populated by Zen 6 "Morpheus" cores—as claimed in a January tweet. A new package design was also riffed on at the time: "Yes, I have teased this before...Medusa will use 2.5D interconnect with a much higher bandwidth," instead of a "traditional" multi-die design. Industry speculation has AMD's Zen 6 client architecture linked to a loose 2025/2026 launch window.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced a collaboration to deliver optimized next generation Arm Cortex -X CPU developed on Samsung Foundry's latest Gate-All-Around (GAA) process technology. This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry.

This collaboration sets the stage for a series of announcements and planned innovation between Samsung and Arm. The companies have bold plans to reinvent 2-nanometer (nm) GAA for next-generation data center and infrastructure custom silicon, and a groundbreaking AI chiplet solution that will revolutionize the future generative artificial intelligence (AI) mobile computing market.

NVIDIA today announced that Australia's Pawsey Supercomputing Research Centre will add the NVIDIA CUDA Quantum platform accelerated by NVIDIA Grace Hopper Superchips to its National Supercomputing and Quantum Computing Innovation Hub, furthering its work driving breakthroughs in quantum computing.

Researchers at the Perth-based center will leverage CUDA Quantum - an open-source hybrid quantum computing platform that features powerful simulation tools, and capabilities to program hybrid CPU, GPU and QPU systems - as well as, the NVIDIA cuQuantum software development kit of optimized libraries and tools for accelerating quantum computing workflows. The NVIDIA Grace Hopper Superchip - which combines the NVIDIA Grace CPU and Hopper GPU architectures - provides extreme performance to run high-fidelity and scalable quantum simulations on accelerators and seamlessly interface with future quantum hardware infrastructure.

We are likely to see even more Intel Core i9-14900KS pre-release leaks as its rumored mid-March launch window approaches—hardware sleuth, momomo_us, has spent the weekend following any Team Blue breadcrumb trails. Their latest discovery points to "BX8071514900KS" and "CM8071504820506" product codes, and two listings on PC21 France's web shop. Intel seems to be offering its upcoming limited edition Raptor Lake Refresh über-flagship unit in two different guises—the first being a traditional boxed package, and the second appears to be a tray option (for system integrators). As pointed out by VideoCardz, it is not unusual to see OEM parts reach retail channels—similar cases have leaked in the past. The no frills tray choice: "offers a more cost-effective option for users who don't require fancy packaging or bundled coolers, making it a budget-friendly choice for the new CPU."

The Core i9-14900KS is far from being a wallet friendly prospect, yet the untimely listings indicate that the OEM option shaves off a grand total of €16 (~$17.25) when lined up against its fancy boxed sibling. The French retailer states that both items are on order, with zero stock in their warehouses. The boxed Core i9-14900KS seems to cost €768.34 (~$828) including taxes, while the tray variant's entry indicates a charge of €752.62 (~$811), with VAT factored in. These leaked prices are subject to change—perhaps the current figures are based on a distributor's pre-launch estimation. PC21 France does not display any pricing for the already released Core i9-14900K and 14900KF SKUs, but VideoCardz has checked other retail listings in the country—they reckon that the gulf between "K" and "KS" is €146 (best case scenario).

HXL (@9550pro) has highlighted an intriguing pinned post on the Chinese Zhihu community site—where XZiar, a self described "Central Processing Unit (CPU) expert," has shared a very fuzzy/low quality screenshot of a Windows Task Manager session. The information on display indicates that a "Genuine Intel(R) 0000 1.0 GHz" processor was in use—perhaps a very early Lunar Lake (LNL) engineering sample (ES1). XZiar confirmed the pre-release nature of the onboard chip, and teased its performance prowess: "It's good to use the craftsmanship that others have stepped on. It can run 2.8 GHz with only A1 step, and it is very smooth."

The "A1" designation implies that the leaked sample is among the first LNL processor prototypes to exit manufacturing facilities—Intel previewed its "Lunar Lake-MX" SoC package to press representatives last November. XZiar's followers have pored over the screenshot and ascertained that the leaked example sports a "8-core + 8-thread, without Hyperthreading, 4P+4LPE" configuration. Others were confused by the chip's somewhat odd on-board cache designations—L1: 836 KB, L2: 14 MB and L3: 12 MB—XZiar believes that prototype's setup "is obviously not up to par," when a replier compares the spec to an N300 series processor. It is theorized that Windows Task Manager is simply not fully capable of detecting the sample's full makeup, but XZiar reckons that 12 MB of L3 cache is the correct figure.

A MyDrivers news report suggests that Loongson's LS3C6000 server processor has reached the tape-out phase of development—the article's author appears to be quite excited about this chip's prospects; a performance uptick could position it closer to past generation Intel and AMD parts. The company's proprietary LA664 "LoongArch" instruction set will be deployed on a chip design that accommodates 16 cores with simultaneous multi-threading technology (SMT) and 32 threads. In-house engineers think that the 3C6000 processor series is just as performant as Zen 3 and Tiger Lake (11th-gen Core) architectures, in terms of instructions per clock (IPC).

Loongson has reportedly deployed its Dragon Chain interconnect technology with the 3C6000 generation—the I/O interface is said to be much improved over current 3C5000-based server products. Company engineers have: "solved the bottleneck in the expansion of the number of processor cores. In the future, the company will also seal 32-core processors on the basis of 3C6000. 64-core products are possibly incoming later on." The MyDrivers article proposes that Loongson is targeting growing demand within China's server market, but LS3C6000 remains a "big project" that requires further compatibility and performance optimizations.

China's homegrown Loongson 3A6000 CPU shows promise but still needs to catch up AMD and Intel's latest offerings in real-world performance. According to benchmarks by Chinese tech reviewer Geekerwan, the 3A6000 has instructions per clock (IPC) on par with AMD's Zen 4 architecture and Intel's Raptor Lake. Using the SPEC CPU 2017 processor benchmark, Geekerwan has clocked all the CPUs at 2.5 GHs to compare the raw benchmark results to Zen 4 and Intel's Raptor Lake (Raptor Cove) processors. As a result, the Loongson 3A6000 seemingly matches the latest designs by AMD and Intel in integer results, with integer IPC measured at 4.8, while Zen 4 and Raptor Cove have 5.0 and 4.9, respectively. The floating point performance is still lagging behind a lot, though. This demonstrates that Loongson's CPU design can catching up to global leaders, but still needs further development, especially for floating point arithmetic.

However, the 3A6000 is held back by low clock speeds and limited core counts. With a maximum boost speed of just 2.5 GHz across four CPU cores, the 3A6000 cannot compete with flagship chips like AMD's 16-core Ryzen 9 7950X running at 5.7 GHz. While the 3A6000's IPC is impressive, its raw computing power is a fraction of that of leading x86 CPUs. Loongson must improve manufacturing process technology to increase clock speeds, core counts, and cache size. The 3A6000's strengths highlight Loongson's ambitions: an in-house LoongArch ISA design fabricated on 12 nm achieves competitive IPC to state-of-the-art x86 chips built on more advanced TSMC 5 nm and Intel 7 nm nodes. This shows the potential behind Loongson's engineering. Reports suggest that next-generation Loongson 3A7000 CPUs will use SMIC 7 nm, allowing higher clocks and more cores to better harness the architecture's potential. So, we expect the next generation to set a bar for China's homegrown CPU performance.

China's National Supercomputer Center (NUDT) introduced their Tianhe-3 system as a prototype back in early 2019—at the time it had been tested by thirty local organizations. Notable assessors included the Chinese Academy of Sciences and the China Aerodynamics Research and Development Center. The (previous generation) Tianhe-2 system currently sits in a number seven position of world-ranked Supercomputers—offering a measured performance of 33.86 petaFLOPS/s. The internal makeup of its fully formed successor has remained a mystery...until now. The Next Platform believes that the "Xingyi" monikered third generation supercomputer houses the Guangzhou-based lab's MT-3000 processor design. Author, Timothy Prickett Morgan, boasted about acquiring exclusive inside knowledge ahead of international intelligence agencies—many will be keeping an eye on the NUDT, since it is administered by the National University of Defence Technology (itself owned by the Chinese government).

The Next Platform has a track record of outing intimate details relating to Chinese-developed scientific breakthroughs—the semi-related "Oceanlight" system installed at their National Supercomputer Center (Wuxi) was "figured out" two years ago. Tianhe-3 and Oceanlight face significant competition in the form of "El Capitan"—this is the USA's prime: "supercomputer being built right now at Lawrence Livermore National Laboratory by Hewlett Packard Enterprise in conjunction with compute engine supplier AMD. We need to know because we want to understand the very different—and yet, in some ways similar—architectural path that China seems to have taken with the Xingyi architecture to break through the exascale barrier."

A new forecast from International Data Corporation (IDC) shows shipments of artificial intelligence (AI) PCs - personal computers with specific system-on-a-chip (SoC) capabilities designed to run generative AI tasks locally - growing from nearly 50 million units in 2024 to more than 167 million in 2027. By the end of the forecast, IDC expects AI PCs will represent nearly 60% of all PC shipments worldwide.

"As we enter a new year, the hype around generative AI has reached a fever pitch, and the PC industry is running fast to capitalize on the expected benefits of bringing AI capabilities down from the cloud to the client," said Tom Mainelli, group vice president, Devices and Consumer Research. "Promises around enhanced user productivity via faster performance, plus lower inferencing costs, and the benefit of on-device privacy and security, have driven strong IT decision-maker interest in AI PCs. In 2024, we'll see AI PC shipments begin to ramp, and over the next few years, we expect the technology to move from niche to a majority."

Intel has begun rolling out software binaries compiled with support for upcoming Advanced Performance Extensions (APX) and Advanced Vector Extensions 10 (AVX10) instruction set extensions in their Clear Linux distribution, ahead of any processors officially supporting these capabilities launching. Clear Linux is focusing first on optimized APX and AVX10 versions of foundational software libraries like glibc and Python. This builds on Clear Linux's existing support for optimized x86-64-v2, v3, and v4 code paths, leveraging the latest microarchitectural features of each Intel CPU generation. The rationale is to prepare Clear Linux to fully leverage the performance potential of next-generation Intel Xeon server processors, code-named Granite Rapids, expected to launch later this year.

Granite Rapids will introduce AVX10.1/512 instructions as well as the new APX capabilities, which are currently not well documented implementation wise. By rolling out APX/AVX10 support in software now, Clear Linux aims to have an optimized ecosystem ready when the new processors officially ship. Initially, APX and AVX10 support is being added using the existing GCC compiler. Still, Clear Linux notes they will transition to using the upcoming GCC 14 release with more mature support for these instruction sets. The goal is to eventually have many Clear Linux packages compiled with APX/AVX10 code paths to maximize performance on future Intel CPUs. This continues Clear Linux's strategy of leveraging Intel's latest hardware capabilities in software.

Supply chain insiders have claimed that Intel is working on extending the lifespan of its LGA 1700 platform—a BenchLife report proposes that the "Bartlett Lake-S" processor family is due soon, courtesy of Team Blue's Network and Edge (NEX) business group. Only a few days ago, the rumor mill had placed "Bartlett Lake-S" CPUs in a mainstream desktop category, due to alleged connections with the Raptor Lake-S Refresh series—the former is also (supposedly) based on the Intel 7 processor process. BenchLife believes that DDR4 and DDR5 memory will be supported, but with no mention of possible ECC functionality. Confusingly, chip industry tipsters believe that the unannounced processors could be launched as 15th Gen Core parts.

BenchLife has a history of discovering and reporting on Intel product roadmaps—apparently Bartlett Lake-S can leverage the same core configurations as seen on Raptor Lake-S; namely 8 Raptor Cove P-Cores and 16 Gracemont E-Cores. An insider source claims that a new pure P-Core-only design could exist, sporting up to twelve Raptor Cove units. According to a leaked Bartlett Lake-S series specification sheet: "the iGPU part will use (existing) Intel Xe architecture, up to Intel UHD Graphics 770." The publication alludes to some type of AI performance enhancement as a distinguishing feature for Bartlett Lake-S, when lined up against 14th Gen Core desktop SKUs. Folks salivating at the prospect of a mainstream DIY launch will have to wait and see (according to BenchLife's supply chain insider): "judging from various specifications, this product belonging to the Intel NEX business group may also be decentralized to the consumer market, but the source did not make this part too clear and reserved some room for maneuver."

In 2024, the tech industry remains steadfastly focused on AI, with the continued rollout of advanced AI chips leading to significant enhancements in processing speeds. TrendForce posits that this advancement is set to drive growth in both DRAM and NAND Flash across various AI applications, including smartphones, servers, and notebooks. The server sector is expected to see the most significant growth, with content per box for server DRAM projected to rise by 17.3% annually, while enterprise SSDs are forecast to increase by 13.2%. The market penetration rate for AI smartphones and AI PCs is expected to experience noticeable growth in 2025 and is anticipated to further drive the average content per box upward.

Looking first at smartphones, despite chipmakers focusing on improving processing performance, the absence of new AI functionalities has somewhat constrained the impact of AI. Memory prices plummeted in 2023 due to oversupply, making lower-priced options attractive and leading to a 17.5% increase in average DRAM capacity and a 19.2% increase in NAND Flash capacity per smartphone. However, with no new applications expected in 2024, the growth rate in content per box for both DRAM and NAND Flash in smartphones is set to slow down, estimated at 14.1% and 9.3%, respectively.

Intel, Microsoft, and a fabless semiconductor company making analog, mixed-signal, and audio DSP, Cirrus Logic, have collaborated on a new reference laptop design to showcase the upcoming Lunar Lake mobile CPUs. The goal is to enable "cool, quiet, and high-performance" laptops that push the boundaries of efficiency, thickness, and acoustics. The reference design incorporates three key components from Cirrus Logic - the CP9314 power converter chip, CS42L43 audio codec, and CS35L56 amplifier. The CP9314 is the most critical element, using advanced power conversion technology to improve Lunar Lake's power efficiency significantly. This enables thinner and quieter laptops with longer battery life. The codec and amplifier chips also play a role, providing high-quality audio with next-generation features like spatial audio support.

Together, these Cirrus Logic components aim to highlight Lunar Lake's capabilities for efficiency, performance, and immersive experiences in a thin and light form factor. While details remain scarce on the Lunar Lake CPUs themselves, they are expected to arrive later this year, likely in the second half. If the reference laptops live up to their promises, Lunar Lake could help Intel regain leadership in mobile computing efficiency, which has been lacking since the introduction of Apple's M series SoCs, which have superior battery life. With expert collaboration from Microsoft and Cirrus Logic on the peripheral hardware and software, Lunar Lake may usher in a new generation of cool, quiet, and powerful laptops.

An interesting Intel document leaked out last month—it contained detailed pre-release information that covered their upcoming 15th Gen Core Arrow Lake-S desktop CPU platform, including a possible best scenario 8+16+1 core configuration. Thorough analysis of the spec sheet revealed a revelation—the next generation Core processor family could "lack Hyper-Threading (HT) support." The rumor mill had produced similar claims in the past, but the internal technical memo confirmed that Arrow Lake's "expected eight performance cores without any threads enabled via SMT." These specifications could be subject to change, but tipster—InstLatX64—has uprooted an Arrow Lake-S engineering sample: "I spotted (CPUID C0660, 24 threads, 3 GHz, without AVX 512) among the Intel test machines."

The leaker had uncovered several pre-launch Meteor Lake SKUs last year—with 14th Gen laptop processors hitting the market recently, InstLatX64 has turned his attention to seeking out next generation parts. Yesterday's Arrow Lake-S find has chins wagging about the 24 thread count aspect (sporting two more than the fanciest Meteor Lake Core Ultra 9 processor)—this could be an actual 24 core total configuration—considering the evident lack of hyper-threading, as seen on the leaked engineering sample. Tom's Hardware reckons that the AVX-512 instruction set could be disabled via firmware or motherboard UEFI—if InstLatX64's claim of "without AVX-512" support does ring true, PC users (demanding such workloads) are best advised to turn to Ryzen 7040 and 8040 series processors, or (less likely) Team Blue's own 5th Gen Xeon "Emerald Rapids" server CPUs.

Graid Technology, an industry trailblazer in GPU-based RAID for NVMe, proudly announces the groundbreaking release of SupremeRAID SR-1001. This innovative GPU-based RAID solution is designed to maximize NVMe SSD performance while eliminating CPU cycle consumption and avoiding throughput bottlenecks. Utilizing patented out-of-path RAID protection technology, data travels directly from the CPU to the NVMe SSDs, ensuring unmatched flexibility, unprecedented performance, and overall superior value.

NVMe SSDs, with their high-speed performance and low latency, significantly enhance tasks across CAD, video editing, IoT, and gaming. Faster loading times, improved rendering, quick file transfers, smooth playback, efficient data processing, and reduced latency contribute to overall superior performance. But traditional RAID methods introduce bottlenecks, limiting the performance of NVMe SSDs in critical applications.

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

Intel Corporation today reported fourth-quarter and full-year 2023 financial results. "We delivered strong Q4 results, surpassing expectations for the fourth consecutive quarter with revenue at the higher end of our guidance," said Pat Gelsinger, Intel CEO. "The quarter capped a year of tremendous progress on Intel's transformation, where we consistently drove execution and accelerated innovation, resulting in strong customer momentum for our products. In 2024, we remain relentlessly focused on achieving process and product leadership, continuing to build our external foundry business and at-scale global manufacturing, and executing our mission to bring AI everywhere as we drive long-term value for stakeholders."

David Zinsner, Intel CFO, said, "We continued to drive operational efficiencies in the fourth quarter, and comfortably achieved our commitment to deliver $3 billion in cost savings in 2023. We expect to unlock further efficiencies in 2024 and beyond as we implement our new internal foundry model, which is designed to drive greater transparency and accountability and higher returns on our owners' capital." For the full year, the company generated $11.5 billion in cash from operations and paid dividends of $3.1 billion.

Intel has released the latest version of its Arc GPU Graphics Drivers, version 101.5234 WHQL. This appears to be a major update as it brings Game On Driver support for Arc A-Series Graphics for plenty of new games including Enshrouded, Suicide Squad: Kill the Justice League, Like a Dragon: Infinite Wealth, Tekken 8, and the recently released and quiet popular Palworld, as well as Game On Driver support on Intel Core Ultra CPUs with Intel Arc Graphics for Like a Dragon: Infinite Wealth, Tekken 8, and Palworld.

The new drivers also bring plenty of game performance improvements for a rather extensive list of games for both Arc A-series Graphics and Intel Core Ultra CPUs with Arc Graphics. These improvements range anywhere from 4 percent, up to 268 percent, and include both DirectX 11 and DirectX 12 titles. You can check out the full list below. Intel also fixed a couple of issues, including Alan Wake 2 white corruption issue on reflective surfaces, Sons of the Forest corruption on the item text issue, and issues with Intel Smooth Sync in some DirectX 11 titles. It also fixes issues with on Intel Core Ultra CPUs with Arc Graphics where The Talos Principle may experience an application crash with certain upscaling presets, Call of Duty Modern Warfare III application crash issues, and Blackmagic Fusion application crash during render operations.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.5234 WHQL

Intel presented its next generation Xeon "Clearwater Forest" processor family during September's Innovation Event—their roadmap slide (see below) included other Birch Stream platform architecture options. Earlier this week, Team Blue's software engineers issued a Linux kernel patch that contains details pertaining to codenamed projects: Sierra Forest, Grand Ridge and the aforementioned Clearwater Forest. All E-Core Xeon "Sierra Forest" processors are expected to launch around the middle of 2024—this deployment of purely efficiency-oriented "Sierra Glen" (Atom Crestmont) cores in enterprise/server chip form will be a first for Intel. The Sierra Forest Xeon range has been delayed a couple of times; but some extra maturation time has granted a jump from an initial maximum 144 E-Core count up to 288. The latest patch notes provide an early look into Clearwater Forest's basic foundations—it seems to be Sierra Forest's direct successor.

The Intel Xeon "Granite Rapids" processor family is expected to hit retail just after a Sierra Forest product launch, but the former sports a very different internal configuration—an all "Redwood Cove" P-Core setup. Phoronix posits that Sierra Forest's groundwork is clearing the way for its natural successor: "Clearwater Forest is Intel's second generation E-core Xeon...Clearwater Forest should ship in 2025 while the open-source Intel Linux engineers begin in their driver support preparations and other hardware enablement well in advance of launch. With engineers already pushing Sierra Forest code into the Linux kernel and related key open-source projects like Clang and GCC since last year, their work on enabling Sierra Forest appears to be largely wrapping up and in turn the enablement is to begin for Clearwater Forest. Sent out...was the first Linux kernel patch for Sierra Forest. As usual, for the first patch it's quite basic and is just adding in the new model number for Clearwater Forest CPUs. Clear Water Forest has a model number of 0xDD (221). The patch also reaffirms that the 0xDD Clearwater Forest CPUs are using Atom Darkmont cores."

erial leaker @yuuki_ans on X/Twitter has released details on Intel's upcoming Barlow Rridge Thunderbolt 5 controller which will be known as the JHL9580 or JHL9540 depending on the SKU. The good news is that Intel has finally moved to PCIe 4.0 for the bus interface, which was expected due to the increased bandwidth on offer by Thunderbolt 5 over Thunderbolt 3 and 4. Barlow Ridge will use a PCIe 4.0 x4 interface to connect to the host and it appears that the earlier leak that suggested native Thunderbolt support in Arrow Lake-S might be incorrect, as there are diagrams showing Barlow Ridge connected to Arrow Lake-S CPUs.

Besides the faster bus, Thunderbolt 5 brings asymmetrical data transmission support which means that for display applications there will be a 120/40 Gbps mode, whereas for data only applications Thunderbolt 5 will deliver a symmetrical 80 Gbps mode. We should point out that this only appears to apply to the JHL9580 SKU, which also supports 40 Gbps USB4 speeds, whereas the JHL9540 for some reason remains a Thunderbolt 4 controller. That said, both of the Barlow Ridge SKUs get support for 20 Gbps USB 3.2 Gen 2x2, something that was lacking in previous Thunderbolt implementations. There will also be support for DisplayPort 2.1 via DP Alt Mode with full UHBR20 support when used with a DP80 certified cable. Actual data transfers are limited to the 64 Gbps PCIe 4.0 interface to the host system, just like USB4, but this does at least give Thunderbolt 5 extra head room for display data even in symmetrical mode. The Barlow Ridge controllers appear to be connected directly to the Arrow Lake-S CPUs via the PCIe 4.0 x4 interface, much in the same way USB4 host controllers connect to AMD's Ryzen 7000-series CPUS.

A leaked Intel documentation we reported on a few days ago covered the Arrow Lake-S platform and some implementation details. However, there was an interesting catch in the file. The leaked document indicates that the upcoming 15th-Generation Arrow Lake desktop CPUs could lack Hyper-Threading (HT) support. The technical memo lists Arrow Lake's expected eight performance cores without any threads enabled via SMT. This aligns with previous rumors of Hyper-Threading removal. Losing Hyper-Threading could significantly impact Arrow Lake's multi-threaded application performance versus its Raptor Lake predecessors. Estimates suggest HT provides a 10-15% speedup across heavily-threaded workloads by enabling logical cores. However, for gaming, disabling HT has negligible impact and can even boost FPS in some titles. So Arrow Lake may still hit Intel's rumored 30% gaming performance targets through architectural improvements alone.

However, a replacement for the traditional HT is likely to come in the form of Rentable Units. This new approach is a response to the adoption of a hybrid core architecture, which has seen an increase in applications leveraging low-power E-cores for enhanced performance and efficiency. Rentable Units are a more efficient pseudo-multi-threaded solution that splits the first thread of incoming instructions into two partitions, assigning them to different cores based on complexity. Rentable Units will use timers and counters to measure P/E core utilization and send parts of the thread to each core for processing. This inherently requires larger cache sizes, where Arrow Lake is rumored to have 3 MB of L2 cache per core. Arrow Lake is also noted to support faster DDR5-6400 memory. But between higher clocks, more E-cores, and various core architecture updates, raw throughput metrics may not change much without Hyper-Threading.

Courtesy of X/Twitter user @yuuki_ans, we now have what should be very detailed information on Intel's next generation consumer desktop platform, assuming the leaked information is real. The leaker not only provided confirmation on the CPU specs of the Arrow Lake-S desktop CPUs, which will feature up to an 8+16+1 core configuration. However, it appears that it's not all smooth sailing for Intel to get Arrow Lake-S up and running, as a note points out that the pre-alpha hardware has the performance cores disabled due to a hardware bug that is expected to be fixed in a future hardware revision. We can also see that the official memory support is DDR5-6400 from the block diagram, which is quite a jump from DDR5-5600 which is what the current 14th gen CPUs officially support.

That said, the rest of the documentation shared is very detailed and provides us with a ton of details in terms of the various platform interfaces we can expect. For starters, the Arrow Lake-S CPUs will feature native Thunderbolt 4/USB4 support (once again an odd mistake here stating USB4.0), as well as DisplayPort 2.0 (UHBR20 only) and HDMI 2.1 support. The CPU is said to deliver 24 PCIe lanes, of which 16 are PCIe 5.0 lanes for the GPU and the remaining eight are for NVMe SSDs, with half being PCIe 5.0 and half PCIe 4.0.

AEWIN is glad to announce our latest High-Performance Network Appliance powered by Intel latest 5th Gen Xeon Scalable Processors, SCB-1942 Series. It is a series of flagship products powered by dual Intel Emerald Rapids CPUs, having up to 128 CPU cores (64 cores per CPU) for the extreme computing power pursued in the market. SCB-1942 series has multiple SKU with various PCIe slots options for great expandability to fulfill customer's solutions.

The SCB-1942A is a 2U, 2-socket network computing platform having 16x memory socket of DDR5 up to 5600 MHz, and 8x PCIe 5.0 expansion slots for AEWIN wide coverage NIC cards with 1G/10/25/40/100G copper/fiber interfaces or other Accelerators & NVMe SSDs for flexible functionality enhancement. The SCB-1942A provides the flexibility to change the 2x PCIe slots to 1x PCIe x16 slot for standard PCIe form factor which can install off-the-shelf add-on card for additional function required. It can support 400G NIC card installed such as Mellanox PCIe 5.0 NIC. In addition, the SCB-1942 series support 10 SATA which make it also suitable for various kinds of storage applications.