| Monday, August 17 2009 |

Mushkin is readying a new series of PC memory kits named Copperhead. The series circles around a new heatspreader design that heavily makes use of copper, to enhance its thermal characteristics. The company has in the the past worked on similar heatspreader innovations including a vapor-chamber technology based Ascent series. Considering that copper is an expensive (if not precious) metal, these kits could be positioned in the higher-end category, consisting of triple-channel and dual-channel DDR3 memory kits. Owing to its still sizable market, DDR2 kits in the series cannot be written off at this point. Expect product launches very soon.
Source: Hartware.de
Source: Hartware.de
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