Saturday, July 5th 2008

AMD Chipset Roadmap for 2009 Uncovered

As of today, AMD is close to over a year and a half behind Intel with the implementation of the DDR3 system memory standard, and it doesn't look like we are going to see a DDR3 AMD platform only until late this year or early next year. Chilian website CHW.net published slides of the roadmaps for AMD chipsets in the months to come, also published are slides refering to the details of the next generation southbridge by AMD, even though the latest entry, the SB700 is only teething and only the latest motherboards with 7-Series chipsets feature this.

The roadmap shows that the immediate entry into the market would be the AMD 790GX northbridge. Think of it as a fusion between 780G and 790X. Or better put, a 790X with an integrated graphics processor (IGP), or even better put, AMD's response to NVIDIA's flagship AM2+ chipset, the NForce 750a that supports SLI and also features an IGP. The companion southbridge, SB700 has come a tad-late into the market, we had expected 7-series chipset featured boards to come with this but it's known that a clock-generator fault was detected with early batches of the SB700 and AMD had recalled it before it could feature with premium 7-series boards, that's part of the reason why flagship 790FX boards such as ASUS M3A32-MVP Deluxe and Gigabyte GA-790FX-DQ6 featured the dated SB600 with an additional SATA controller for two or more extra SATA ports. We already find SB700 with some of the recent 780G boards.

The roadmap shows the presence of a SB750, which simply put is all the features of SB700 plus an added SATA RAID 5 mode along with the advanced clock caliberation support for Overdrive. This will feature only with the high-end 790FX and 790GX northbriges. Speaking of northbridge, a DDR3-'supportive' variant of the RD790 (AMD 790FX/GX) is slated for Q1 2009. By 'supportive', we mean that the boards this chipset features in have DDR3 or DDR3+DDR2 slots. It's important to note that memory standard compatibility is a function of the memory controller AMD processors (CPU) carry. On a AM3 board that features both DDR3 and DDR2 slots, you will be able to use both current Phenom processors and those future Phenoms with DDR3 support. The current Phenom processors will not work on boards with only the DDR3 slots since today's Phenom doesn't feature a DDR3 IMC.

An evolution of this northbridge would be the RD890 and RS880 which are slated for Q2 2009. These parts come with support for G3MX, that allows support for fully-buffered DRAM in its server/workstation variants. These northbridges are likely to be accompanied by a newer SB800 southbridge. The third slide provides insight into what edge this SB offers over the current SB700 series. The most important of them being an evolved 'A-Link'. A-Link is the chipset bus (that which connects the NB to SB) that AMD (formerly ATI) has been using since they entered the chipset business. Simply put, this is a 4-lane PCI-Express connection that offers 1000 MB/s (each direction) of bandwidth, that makes the SB a PCI-E device that connects to the PCI-E switch located in the northbridge. As times pass, with southbridges coming with as many as 14 USB 2.0 ports and 6 SATA ports, there has been an increasing need to expand this bus. Intel uses the age old Direct Media Interface in its current chipset, which apparently could be bottlenecking it even now. This can be advocated by the fact that in the D5400XS "Skulltrail", the NB connects to the SB using 4 PCI-E lanes as supplimentry connections apart from DMI. With QuickConnect however, things could change. NVIDIA uses a strong HyperTransport link as its chipset bus. With the SB800, the A-Link gets a revamp, the SB800 now connects to the system using PCI-E 2.0 x4, double the bandwidth.

AMD also plans to revamp its Overdrive system performance management software, with users and experts pointing out limits and flaws with its current model.

I will conclude my wrap on this roadmap saying that it looks impressive, lot of features that were begging to be added are in, but all that remains is that there has to be a good processor to go with all that. With newer processors on the cards, we have to hope for the best, and fear the worst (or wait for CHW to leak another set of slides so we could tell you more :-)

With inputs from CHW
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28 Comments on AMD Chipset Roadmap for 2009 Uncovered

#26
btarunr
Editor & Senior Moderator
I wish I was that USB fetish.

14 USB ports isn't a demerit. If some see it as PR crap, go on. It is PR crap, but it's not something to crib about. Additionally, AMD is too small an player to make major changes to the USB specifications and come up with 'double power' or altered polling rates.
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#27
blueskynis
Having more USB ports is a good thing, not a bad one. Every high power device should have a separate power adapter.

And: put the darn USB behind us already!
Posted on Reply
#28
lemonadesoda
btarunr...AMD is too small an player to make major changes to the USB specifications and come up with 'double power' or altered polling rates.
Actually, no. USB specifications dont need to change. Just think about a USB hub. It provides tons more power to a USB device than a mainboard socket. Nearly every external 2.5" HDD will work from a powered hub, but will fail when connected directly to many mainboard sockets.

In fact, different mainboards + chipsets provide subtly different power
specifications/capabilities, especially regarding Vbus droop.

With USB 1.0 let alone within USB 2.0 there are plenty of options for increasing the power available for any device.
USB specification notesUSB 2.0: Released in April 2000.
  • Added higher maximum speed of 480 Mbit/s (now called Hi-Speed). Further modifications to the USB specification have been done via Engineering Change Notices (ECN). The most important of these ECNs are included into the USB 2.0 specification package available from USB.org:
  • Mini-B Connector ECN: Released in October 2000.
  • Specifications for Mini-B plug and receptacle. These should not be confused with Micro-B plug and receptacle.
  • Errata as of December 2000: Released in December 2000.
  • Pull-up/Pull-down Resistors ECN: Released in May 2002.
  • Errata as of May 2002: Released in May 2002.
  • Interface Associations ECN: Released in May 2003.
  • New standard descriptor was added that allows multiple interfaces to be associated with a single device function.
  • Rounded Chamfer ECN: Released in October 2003.
  • A recommended, compatible change to Mini-B plugs that results in longer lasting connectors.
  • Unicode ECN: Released in February 2005.
  • This ECN specifies that strings are encoded using UTF-16LE. USB 2.0 did specify that Unicode is to be used but it did not specify the encoding.
  • Inter-Chip USB Supplement: Released in March 2006.
  • On-The-Go Supplement 1.3: Released in December 2006.
  • USB On-The-Go makes it possible for two USB devices to communicate with each other without requiring a separate USB host. In practice, one of the USB devices acts as a host for the other device.
  • Battery Charging Specification 1.0: Released in March 2007.
  • Adds support for dedicated chargers (power supplies with USB connectors), host chargers (USB hosts that can act as chargers) and the No Dead Battery provision which allows devices to temporarily draw 100 mA current after they have been attached. If a USB device is connected to dedicated charger or host charger, maximum current drawn by the device may be as high as 1.5 A. (Note that this document is not distributed with USB 2.0 specification package.)
  • Micro-USB Cables and Connectors Specification 1.01: Released in April 2007.
  • Link Power Management Addendum ECN: Released in July 2007.
  • This adds a new power state between enabled and suspended states. Device in this state is not required to reduce its power consumption. However, switching between enabled and sleep states is much faster than switching between enabled and suspended states, which allows devices to sleep while idle.
  • High-Speed Inter-Chip USB Electrical Specification Revision 1.0: Released in September 2007.
www.beyondlogic.org/usbnutshell/usb2.htm
www.usbpluspower.org/specs/index.jsp
www.usb.org/developers/usbfaq/#pow1
www.ibm.com/developerworks/power/library/pa-spec7.html
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