The high-end CPU-Cooler from the newcomer PHANTEKS is available immediately at Caseking.de. This cooler with the name "TC14PE" already managed to receive numerous awards for its excellent performance. PHANTEKS employs multiple features to achieve such extraordinary results: a patented surface at the nano-level, twin tower design and two high-performance 140 mm fans. For the perfect looks to go with the installed hardware, the cooler is available in blue, orange red or silver.

The young company PHANTEKS has invested more than two years into the development of the TC14PE CPU coolers, as their goal was not simply to produce a good CPU cooler, but to lead the performance charts. Instead of focusing on the best heat dissipation of an open test bench, PHANTEKS has made sure that the TC14PE performs best in its intended setting - a closed system.

With clever ideas and technical novelties, Enermax brings a breath of fresh air into the CPU cooler market - in the true sense of the word, because the innovative construction of the Enermax CPU coolers significantly enhances the air stream conduction and heat dissipation. The manufacturer integrated small spoilers, the so-called Vortex Generators, on the fins of the new ETD-T60 cooler to lead the air stream closely along the heat pipes and to avoid the development of hot spots in the back of the heat pipes (so-called Vortex Generator Flow/VGF).

By utilizing the difference in pressure between the warm air inside the heat sink and the colder air outside, Enermax further improved the air supply: The CPU cooler sides are not fully closed, so that additional fresh air can be sucked into the heat sink (so-called Vacuum Effect Flow/VEF). Both effects, VGF and VEF, have been proved successfully with the side-flow series ETS-T40.

Japanese cooling expert Scythe announces the successor of Big Shuriken CPU Cooler. Big Shuriken 2 had to undergo further development on the heatsink and axial-fan side to provide better even performance and compatibility.

Applied improvements of heatsink are not obvious at first sight because main heatsink structure was inherited from Big Shuriken (1) CPU Cooler. Total amount of copper-heatpipes was increases from four to five pieces. Curved heatpipes are connecting the nickel-plated copper-base with the two upper layers of aluminum fins. Big Shuriken (1) was equipped with a solid heatsink on top of the copper-base which has been removed in the new version.

GlacialTech Inc., a diverse provider of cooling, power supply and PC enclosure solutions for consumer and industrial applications and a world-class provider of cost effective cooling components and chassis launches the latest Igloo H46 & H58 Series CPU coolers with Intel LGA1155/1156 and AMD FM1 / AM2 / AM2+ / AM3 sockets. The unique design provides good cooling effect to the components around the CPU.

As is usual, GlacialTech comes out with a product that provides highest quality materials and workmanship. The design is clear and functional. The manufacturer decided to waive all creative elements that may have negative influence on the cooling performance. Users can choose out of two different models. The attached PWM fan is certainly equipped with the durable and silent bearing. Price performance, noise performance and weight performance are GlacialTech's three principle design philosophies.

Alpenföhn is aiming at the performance crown under the CPU coolers with the K2. For this, Alpenföhn is employing two cooling towers and ships the unit with two, potent Wing Boost fans. The middle fan with 140 mm is intended to keep the air flow at a maximum, while the smaller 120 mm unit in front is meant to offer maximal compatibility to modern mainboards, while still providing impressive air flow. Those wanting to go even further may install a third fan in the rear of the cooler. The Alpenföhn K2 CPU cooler is available immediately at Caseking.

The cooler utilizes an incredible amount of materials with a massive weight of 1050 grams. Using more mass does not simply equate to greater performance, as only an intelligent use of such will make for a great cooler and this is something the Alpenföhn engineers are certainly experts in. Eight heatpipes are embedded in a Copper, with both aspects featuring a high-quality Nickel plating. On top of that, all contact points between cooling fins, heatpipes and ground plate feature high-quality solder points to maximize the potential of the K2.

Thermal Solutions specialist GELID Solutions reveals the GX-7 CPU cooler of its GAMER product line. Engineers at GELID Solutions have created an outstanding new CPU cooler with 7 power heat pipes. Contrary to traditional heat pipe arrangement for this GAMER CPU cooler "GX-7", a special array of heat pipes was used to take full advantage of all 7 heat pipes heat transfer capacity. Further V-shaped aluminum fins were used in the center of the heat sink to allow airflow to reach the heat sink more evenly. Openings inside of the heat sink and near the heat pipes let fresh-air flows in from the top and the bottom to zones normally poorly ventilated, and eliminate the creation of hotspots. The unique heat sink shape supports dual fans.

Included in the GX-7 is the multi-award winning Wing 12 PL fan, allowing the cooler to reach remarkable temperature. The Wing 12 PL Blue features blue LEDs and unique Nanoflux bearing which ensures a friction-free and silent operation. Thanks to the clever design and magnetic bearing, the impeller can be detached for easy cleaning. Additionally, fan blade winglets were designed to achieve larger airflow and greater static pressure. The fan also includes a premium PWM control, so the temperature can be controlled precisely by the BIOS.

ENERMAX is proud to announce the release of all new CPU Cooler line, ETS-T40 series. It has world leading thermal resistance value down to an incredible 0.09°C/W. With patented VGF, SEF, HDT, and VEF design, plus ENERMAX renowned Twister-bearing fan, ETS-T40 can easily cool down hot-spoil heavy-duty CPU without adding system noise. The unique spoilers design redirects the air through the windless area behind the heat pipes of 52 fins to maximize air convection rate and remove the heat that conventional design cannot reach.

GELID today announced a revision of its Tranquillo CPU cooler. Revision 2 of this aluminum fin tower-type cooler comes with three major changes, an updated heat pipe profile; a new AMD socket clip that allows 4x 90° installation; and an improved heatsink shape. To begin with, the four exposed-copper heat pipes project out of the fanned out better, with the heat pipes almost reaching the periphery of each of the fins. Next, a new AMD socket clip allows you to orient the heatsink in the same way you can with the square bolt layout of Intel sockets (90° in any direction). Lastly, in the space between the CPU base and the bottom of the aluminum fin stack, GELID put a larger heatsink than the one found on the original Tranquillo. The Tranquillo Rev. 2 is certified to work on Intel sockets LGA1366, LGA1156, LGA1155, and LGA775; AMD sockets AM3, AM2+, and AM2. The company did not give out pricing information, but usually revised SKUs carry the same market prices as the originals they're revisions of.

Prolimatech released a new variant of its iconic Megahalems CPU heatsink, called the Black Series Megahalems. With the same exact dimensions as the original at 130 x 158.7 x 74 mm (LxWxH), the new variant uses black colored aluminum fins. The coating doesn't make for a polished, glossy surface, but a grainy one, which increases surface area. The design remains the same: six nickel-plated copper heat pipes pass through a base, conveying heat to two aluminum fin stacks that are arranged along each arm of the U-shape the heat pipes make. The Black Series Megahalems is compatible with all the current CPU socket types, including AMD AM3+, AM3, AM2+, AM2; Intel LGA1155, LGA1156, LGA1366, and LGA775. The Prolimatech Megahalems Black Series is listed on Caseking.de for €54.90.

Japanese cooling expert Scythe is announcing today the successor of popular Mugen 2 CPU Cooler. Mugen 2 CPU Cooler was awarded many times and is well known world-wide to mainstream users, Overclocker and Enthusiasts. During the development process main focus was set on improvement of performance and mounting mechanism as well as shrinking the heatsink dimensions. New Mugen 3 CPU Cooler is ready to take on the legacy.

While optimizing the performance the whole heatsink design of Mugen 3 CPU Cooler was re-worked which resulted in creation the improved fin-structure M.A.P.S. (Multiple Airflow Pass-Through Structure). Enhancements were achieved by reducing the aerodynamic resistance as well as improving of the overall heatsink stability. Furthermore Mugen 3 is equipped with total of six high-quality copper-heatpipes where the predecessor had only five. Typical for Scythe is the excellently processed and flat surface of the copper base which was refined by a thin nickel layer to prevent corrosion.

iChill CPU Coolers are the ultimate thermal solution for the heat, especially in summer, that can damage your PC's CPU (main brain). A CPU that constantly runs too hot will have a shorter life than one that runs cooler, and could also cause problems like random shutdowns and the loss of important data. iChill brings you the X5, XXX and Storm CPU thermal solution!

When looking for ways to cool a PC's CPU, the first thing to do is reduce the overall temperature inside the PC's case, because that's where the CPU "lives." The best way to do that is to create an airflow that brings in cool air from the lower front of the case and exhausts hot air out the back of the case. After all, the fan that cools your PC's CPU can't work very well if it's blowing hot air onto your CPU. Don't make the mistake of thinking that your power supply's fan will cool your entire PC, like it did in older PCs.

The Japanese manufacturer Scythe Co. Ltd. (Tokyo, Japan) officially announces the availability of new low profile Top-Flow CPU Cooler Kozuti. Unlike regular coolers, the fan is positioned below the fins, reducing the total height of the cooler significantly.

The Kozuti CPU Cooler is equipped with a total of three 6mm heat pipes. Applying the newly developed S.F.M.S (Stealth Fan Mounting Structure) the heatpipes are arranged in a low profile oval structure. This enables to provide space for the 80 x 80 x 10mm fanmotor in between the oval structure and below the fins, making it merely 40mm in height. This positions the cooler to be our most compact and slim cooler fit for HTPCs and slim chassis systems. Active cooling is achieved by the 80 x 80 x 10 mm slim fan the speed of 800 rpm (± 30%) - 3.300 rpm (± 10%), generating an air flow of 6.0 CFM ~ 24.82CFM = 10.2 m³ / h ~ 42.2 m³ / h at a noise level of 8.2 ~ 32.5 dBA.

Today AMD released to market its latest quad-core processor, the Pheonom II X4 980 Black Edition. The new, faster SKU was first reported to be taking shape back in March. Based on the 45 nm "Deneb" silicon and K10.5 architecture, the X4 980 BE is yet another speed-bump, clocked at 3.70 GHz (18.5 x 200 MHz), with room for some overclocking thanks to its unlocked BClk multiplier.

The Deneb die packs four x86-64 cores with 512 KB caches each, and a shared 6 MB L3 cache. Despite its high clock speed, the processor maintains TDP of 125W. Its IMC supports dual-channel DDR3/DDR2 memory, and is backwards compatible with AM2+ socket apart from its native AM3 socket. HyperTransport 4 GT/s is its chipset interconnect. The new processor is priced at US $195.

Apart from the 3.70 Phenom II X4 980, AMD's next, and probably (hopefully) final wave of Phenom II processors will include a 3.50 GHz clocked dual-core part, the Phenom II X2 570 Black Edition. This socket AM3 chip will be based on the "Callisto" silicon, which is essentially a "Deneb" quad core die used in X4 parts, with two of its four cores disabled. The chip features two cores clocked at 3.50 GHz (17.5 x 200 MHz), 512 KB dedicated L2 caches per core, and 6 MB shared L3 cache. The integrated dual-channel memory controller supports DDR3-1333 MHz on AM3 socket, and DDR2-1066 MHz on AM2+. As a Black Edition part, the BClk multiplier is unlocked, to help with overclocking. At these speeds, the TDP is rated at 80W.

AMD is looking to give its Phenom II series a finale, with a new quad-core Phenom II X4 model, the Phenom II X4 980 Black Edition. The new chip will be clocked at 3.70 GHz out of the box (18.5 x 200 MHz). It achieves this speed while staying within the 125W TDP envelope. Based on the 45 nm "Deneb" silicon, the X4 980 BE features four x86-64 cores with 512 KB dedicated L2 cache each, and a 6 MB shared cache. Compatible with AM3 and AM2+ sockets, the chip packs a dual-channel memory controller that supports DDR3-1333 MHz or DDR2-1066 MHz memory standards. AMD will unveil the new chip soon, as the company gears up to launch next-generation chips in June.

Prolimatech, the master of cooling is going a step further after the success of the Prolimatech Megahalems by presenting another revolution in CPU cooling with the Prolimatech Genesis. Besides the immaculate quality - which is present across their entire product line-up - the Genesis sets new standards in cooling capability.

Prolimatech continues the trend set forth by the Megahalems and Super Mega by utilizing two separate towers, but instead of placing them next to each other, they have been rearranged for maximum performance. The large array of cooling fins can hold up to three 120 or 140 mm fans, two of which can be installed right out of the box with the included mounting materials. Besides keeping the CPU cool, the construction allows for direct air flow across critical areas like the memory and power phases of the system.

Japanese cooling specialist Scythe hereby officially announces the launch the new high-end CPU Cooler Mine 2. The Mine 2 CPU Cooler is based on a twin cooler Layout. Eight copper heatpipes transport heat to two generously dimensioned cooling blocks. By placing the fan in between the 2 heatsink towers, intake as well as exhale airflows are optimized to provide high performance. Furthermore, the lower part of the installed fan is designed to cool the devices around the CPU socket, such as voltage regulators and RAM. The structure of the heat sink makes it possible to use a total of up to three fans by purchasing separately sold fan clips. In this manner, the air flow and thus the cooling capacity of the Mine 2 will be significantly increased by using the push / pull principle.

By default, the Mine 2 will be delivered with a centrally placed, adjustable 140 mm Slip Stream PWM & VR fan. Although the fan supports the PWM feature, the user can manually adjust the PWM bandwidth between 470 to 1,370 rpm and 740 to 1,900 rpm. Despite the changed bandwidth, the fan is still controlled by the PWM signal from the motherboard, allowing an individual but also dynamic fan control. Alternatively it is possible to disable the PWM function. Instead the fan can be controlled manually in a range of 500 to 1,700 rpm. This gives every user the option to optimize the Mine 2 CPU cooler for performance or low noise according to own preferences.

Scythe Corporation, a renowned cooling manufacturer, today announced the release of its third version of the Universal Retention Kit. This enhanced version comes with several improvements and wide multi-socket compatibility for both AMD and Intel sockets. The list of compatible sockets contains Intel Socket T / LGA775, LGA1156 LGA1366 and the brand-new socket LGA1155. It furthermore supports the AMD Sockets 754, 939, AM2, AM2+, AM3 and 940. Universal Retention Kit 3 is once again based on a backplate mounting system and allows firm contact pressure as well as secure mounting of even big and heavy CPU Coolers.

Commonly supplied retention bracket of AMD Mainboards are made of plastic which has a downside of giving risk of breaking when using with an on-market High-End CPU Cooler. This problem doesn't accrue with the supplied retention bracket of the Universal Retention Kit 3 which is made of solid steel and thereby provides the necessary sturdiness even for big High-End CPU Coolers. For Intel architecture this kit allows pushpin mounting to be converted to backplate mounting, thereby providing high mechanical stability hence also providing the necessary sturdiness even for big High-End CPU Coolers with a pushpin solution. In order to ease the detachment process of Push-Pins, a convenient Push-Pin Removal Tool is supplied along in the accessory.

Cooler Master displayed its next performance CPU cooler, the H-B6. It features an aluminum fin tower design, but with its heat-pipes passing along the length of the fins rather than breadth (like on most tower-type heatsinks). This approach spreads heat more evenly, and adds to the turbulence. The heatsink measures 136 x 127 x 163 mm; the fan is a typically-sized 120 mm spinner with S-shaped blades. All modern CPU sockets are supported, including LGA1366, LGA1155/LGA1156, LGA775, AM3/AM2+/AM3.

Zalman showed off its latest mid-range CPU cooler, the CNPS7X LED. The CNPS7X sits between the value CNPS5X and the high-performance CNPS10X. It uses an aluminum fin tower design, making use of trapezoid aluminum fins to which heat is conveyed by three 8 mm thick copper heat pipes. It makes use of an LED-lit 130 mm high-flow fan. The CNPS7X is suited for all modern socket types, including AM3+/AM3/AM2+, LGA1366, LGA1155/LGA1156, and LGA775.

Noctua today officially introduced its new NH-C14 CPU cooler. Sporting an exquisite, uniquely flexible 140mm dual fan setup of two Noctua NF-P14, the NH-C14 is a highly customisable, premium-class top-flow solution that further boosts the renowned quiet cooling performance of the company's much acclaimed NH-C12 series.

"Our NH-C12 coolers are renowned to rank among the most capable top-flow cooling solutions on the market, so we're truly proud to offer a further substantial improvement in quiet cooling performance with the new NH-C14", says Mag. Roland Mossig, Noctua CEO. "This model really closes the gap to good tower coolers while being much lower in height and ensuring better component cooling."

Zalman announced its latest CPU cooler, the CNPS5X. Its design is a fusion between traditional tower-type and Zalman's own nested fan design heatsink. The CNPS5X is designed for medium-thru-heavy thermal loads, more like highly overclocked dual-core or mildly overclocked quad-core chips. The company excluded support for LGA1366 for this reason, but added support for Intel's upcoming LGA1155 socket. Other sockets supported include LGA1156, LGA775, and AM3/AM2+/AM2.

Its design consists of Y-shaped aluminum fins, to which heat is conveyed evenly by three 8 mm thick copper heat pipes. The heat pipes converge at a copper CPU base. The 92 mm fan is nested inside the aluminum fins. It spins at 1400~2800 rpm, with a rated noise level of 20~32 dBA. Together, the CNPS5X measures 127(L) x 62(W) x 134(H) mm, weighing 320 g. Installation is made easy by push-pins for Intel sockets, and a fixed clip for AMD sockets, requiring no access to the back of the motherboard. Slated for market release in December, the CNPS5X from Zalman is priced at €26.90.

After AMD's recent mass-release of Athlon II and Phenom II series processors that included the Phenom II X6 1070T Black Edition priced at around $250, AMD is working on a new flagship processor that's even faster than the Phenom II X6 1090T Black Edition (the current flagship), given the model number Phenom II X6 1100T Black Edition (surprise!), and as always, it's yet another speed-bump. This chip is based on the 45 nm Thuban die, and is clocked a whole 100 MHz faster, at 3.30 GHz, with a Turbo Core frequency of 3.70 GHz. Surprisingly, it retains its TDP rating of 125W. As with every other chip based on this die, it features six cores with 128 KB L1, 512 KB L2 dedicated caches, and 6 MB L3 shared cache, it comes in the AM3 package and is backwards compatible with AM2+, supporting dual-channel DDR3-1333 and DDR2-1066 memory standards.

The 1100T Black Edition isn't the only new Phenom II series member down the line, there's the Phenom II X6 1065T (2.90 GHz, non-BE, 3.40 GHz Turbo); the slower Phenom II X6 1045T (2.50 GHz, non-BE, 3.20 GHz Turbo), and the company's next fastest quad-core chip, the Phenom II X4 975 (3.60 GHz, Deneb). It's not known whether the X4-975 is a Black Edition SKU.

Japanese manufacturer Scythe officially announces the new CPU Cooler Rasetsu. This cooler, already shown at the CeBit 2010, combines the outstanding design of the Yasya CPU Cooler with a top-flow layout. The heatsink is divided into two blocks, and each is equipped with the T.M.L.F. (Trident Multi Layer Fin) structure. Because of this irregular lamellar structure and the unparallel arrangement of six copper heatpipes, surface directly cooled by the fan is highly increased and thus maximum heat dissipation is achieved.

New 120 mm "Slip Stream 120 PWM Adjustable" fan is supplied for optimized airflow. Although the fan supports the PWM feature, user can manually adjust the bandwidth between 470 to 1,370 rpm and 740 to 1,900 rpm. Easy mounting is available by the famous V.T.M.S. (Versatile Tool-Free Multiplatform System) which requires no motherboard removal for the heatsink mounting. Rasetsu CPU Cooler is compatible to all current sockets, including the new socket LGA 1156, LGA 1366 and AM3.

AMD has expanded its Phenom II X6 market lineup with the Phenom II X6 1075T Black Edition model (model number: HDT75ZFBGRBOX), which has started hitting stores in Europe for as low as 227.35 EUR. Although the 1075T model has stayed in leaks and BIOS support lists ever since the series first surfaced, it is only now that we get to know that it's a Black Edition part. The chip carries a clock speed of 3.00 GHz, and with its unlocked BClk multiplier, helps with overclocking the chip. AMD already has a higher-priced, higher-clocked model, the 3.20 GHz Phenom II X6 1090T, and there's no indication that 1090T will be displaced from its current price point of ~250 EUR.

Based on the 45 nm "Thuban" die, the Phenom II X6 1075T features six cores, with a nominal speed of 3.00 GHz, that can increase by up to 400 MHz with load thanks to the TurboCore feature, the cores have dedicated L2 caches of 512 KB, and share an L3 cache of 6 MB. The chip comes in the AM3 package, and is backwards compatible with AM2+ socket, it supports both DDR3-1333 MHz and DDR2-1066 memory types, with room for higher frequencies. It has a TDP rated at 125W.