NVIDIA has been offering its GPU IP for more than a decade now ever since the introduction of Kepler uArch, and its IP has had relatively low traction in other SoCs. However, that trend seems to be reaching an inflection point as NVIDIA has given MediaTek a license to use its GPU IP to produce the next generation of processors for the auto industry. The newest MediaTek Dimensity Auto Cockpit family consists of CX-1, CY-1, CM-1, and CV-1, where the CX-1 targets premium vehicles, CM targets medium range, and CV targets lower-end vehicles, probably divided by their compute capabilities. The Dimensity Auto Cockpit family is brimming with the latest technology, as the processor core of choice is an Armv9-based design paired with "next-generation" NVIDIA GPU IP, possibly referring to Blackwell, capable of doing ray tracing and DLSS 3, powered by RTX and DLA.

The SoC is supposed to integrate a lot of technology to lower BOM costs of auto manufacturing, and it includes silicon for controlling displays, cameras (advanced HDR ISP), audio streams (multiple audio DSPs), and connectivity (WiFi networking). Interestingly, the SKUs can play movies with AI-enhanced video and support AAA gaming. MediaTek touts the Dimensity Auto Cockpit family with fully local AI processing capabilities, without requiring assistance from outside servers via WiFi, and 3D spatial sensing with driver and occupant monitoring, gaze-aware UI, and natural controls. All of that fits into an SoC fabricated at TSMC's fab on a 3 nm process and runs on the industry-established NVIDIA DRIVE OS.

In a world where challenges meet innovation, 8849, a leading innovator in mobile technology, is thrilled to announce the launch of its latest innovation, the TANK 3 Pro, designed to revolutionize the way you experience technology. With a perfect blend of cutting-edge features, unparalleled performance, and futuristic design, the TANK 3 Pro is set to redefine the standards of excellence in the tech industry.

Ultimate Projection Experience
Elevate user's viewing experience with TANK 3 Pro's 120 Hz, 100 lumens DLP Laser Projector, delivering unparalleled clarity and immersive visuals. Whether it's for work presentations or entertainment, take user's projections to the next level with exceptional precision and brightness.

ARM's in-progress fifth generation "Blackhawk" Cortex design is allegedly going through a troubled phase of development, according to Chinese insider sources. A Revegnus (@Tech_Reve) social media post highlights ongoing issues: "It's reported that the Cortex X5 architecture is underperforming compared to expectations. It's speculated that the high-frequency power consumption has surged explosively. Therefore, if performance is reduced for lower power consumption, the Geekbench 6 multi-core score of Dimensity 9400 may not achieve a score of 9,400 points." A recent Moor Insights & Strategy analysis piece proposed that "Blackhawk" would become "the most powerful option available at launch" later this year—mobile chipsets leveraging ARM's Cortex-X5 design are touted to face tough next-gen competition from Qualcomm and Apple corners.

Revegnus pulled in a rival SoC: "While Snapdragon 8 Gen 4 is seen to have minor issues, there is no evidence to support this claim. There might be a problem with low-frequency power consumption not showing clear superiority over ARM's middle cores." Qualcomm's next flagship model is performing admirably according to insiders—an engineering sample managed to score 10,628 points in alleged Geekbench 6 multi-core gauntlets. Late last month prototype clocks were leaked—Digital Chat Station claimed that a Snapdragon 8 Gen 4 High-Performance "Big" core was capable of reaching 4.0 GHz. Prior to the latest news, MediaTek's Dimensity 9400 SoC was observed achieving ~10,000 multi-core Geekbench 6 scores—leaked CPU cluster details present a single "Big" Cortex-X5 unit operating alongside three Cortex-X4 cores.

MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Based on TSMC's 2nd generation 4 nm process, the Dimensity 8300 has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm's latest v9 CPU architecture. With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. Additionally, the Dimensity 8300's Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Plus, the chipset's impressive memory and storage speeds ensure users can enjoy smooth and dynamic experiences in gaming, lifestyle applications, photography, and more.

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3 nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

"We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek. "TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market."

MediaTek has been unveiling some new mobile chipsets this week, but keen-eyed news outlets have noticed that the Taiwanese fabless semiconductor company is simply renaming and relaunching hardware from last year, with some tweaks here and there. Today's announcement of the Dimensity 8050 SoC was almost immediately questioned - GSMArena noticed that this "new" model was a near dead ringer, in terms of specifications, for last year's mid-range Dimensity 1300 and 1200 smartphone chipsets. There are some upgrades in terms of memory bandwidth, and MediaTek boasts that the 8050 has been updated with its sixth generation HyperEngine technology.

Alarm bells were ringing when folks realized that the much older Dimensity 8000 SoC was built on a 5 nm process - the supposedly superior (in terms of model number hierarchy) 8005 is a 6 nm chip. Last week the mobile specialist site also spotted that MediaTek's Dimensity 7050 chipset was yet another example of the smartphone tech company rolling out a "rebranding phase." The news outlet pointed out that this newly revealed mobile CPU was just a renamed Dimensity 1080 - with the original model having hit the market in November 2022. MediaTek seems to renaming several older chipsets based on TSMC's 6 nm process - it is possible that this effort is part of a company drive to clear surplus silicon.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.

MediaTek today announced the Dimensity 7200, its inaugural chipset in the new Dimensity 7000 series. The Dimensity 7200 boasts cutting-edge AI imaging features, powerful gaming optimizations, and impressive 5G speeds, all with deeply engrained power savings for extended battery life.

The Dimensity 7200 delivers the same TSMC 4 nm second-generation process found in the Dimensity 9200, and is ideal for ultra-slim designs in a variety of form factors. The octa-core CPU integrates two Arm Cortex-A715 cores, featuring operating speeds of up to 2.8 GHz, with six Cortex-A510 cores, so users can effortlessly multitask and take advantage of peak performance in every app. To further optimize power and performance, MediaTek's built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI-fusion processing.

A new Android tablet has launched today, courtesy of Chinese phone maker OnePlus. However, the name leaves a lot to be desired, as OnePlus decided to call its new tablet, the Pad. There were enough jokes going around when the iPad was launched and we can only guess the OnePlus Pad isn't going to fare much better, although, as it's a much smaller brand, they might get away with it. Regardless of the naff product name, the OnePlus Pad is powered by MediaTek's Dimensity 9000 SoC, which has been paired with 8 GB of RAM and 128 GB of UFS 3.1 flash memory.

The standout feature of the Pad is its 11.61-inch 2800 x 2000 pixel resolution IPS display, with a refresh rate of up to 144 Hz. The odd resolution means that it has a 7:5 aspect ratio, something never before seen in a tablet and it places it somewhere between a 3:2 and a 4:3 display in terms of the aspect ratio. The panel offers up to 500 nits brightness and a 1400:1 contrast ratio and the Pad is said to have an 88.14 percent screen-to-body ratio. The back of the Pad is home to a 13 Megapixel camera that can shoot 4K video and around the front is an 8 Megapixel camera with 1080p video support. OnePlus has kitted out the Pad with a 9,510 mAh battery which is said to be good for 14 and a half hours of usage and a full charge from empty takes only 80 minutes thanks to support for 67 W SuperVOOC charging. The housing is made of aluminium and OnePlus offers an optional magnetic keyboard and a stylus for the Pad. No pricing was announced.

MediaTek today announced the Dimensity 8200, the company's newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences - including connectivity, gaming, multimedia, displays and imaging - at a more accessible price point. Built on the 4 nm-class process, the new chipset delivers unparalleled power efficiency. It also integrates an octa-core CPU with four Arm Cortex-A78 cores operating at up to 3.1 GHz, along with a powerful Mali-G610 graphics engine, for better performance across applications.

To enhance gaming performance, the chipset takes advantage of MediaTek's HyperEngine 6.0 gaming technologies so users can enjoy smooth high framerate gameplay without suffering connection drops, FPS jitter, or gameplay hiccups. MediaTek's Intelligent Display Sync 2.0 technology intelligently adjusts the display refresh rate according to the game frame rate detected, which helps provide smoother viewing experiences.

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

ASUS Republic of Gamers (ROG) today premieres Dare to be Ultimate: Building a World-Leading Gaming Phone, the design story video that reveals the genesis of the new ROG Phone 6D series of gaming smartphones. The ROG Phone 6D and ROG Phone 6D Ultimate are powered by the latest flagship MediaTek Dimensity 9000+ 5G chipset. Clocking up to 3.2 GHz CPU speeds, and boasting up to 16 GB of LPDDR5X RAM and 512 GB ROM of storage, the Dimensity 9000+ chipset provides flagship 5G experiences, perfect for mobile gamers.

"The pursuit of the ultimate performance and gaming experience has always been central for the ROG Phone. With each iteration, we consistently strive to surpass ourselves, achieving the spirit of For Those Who Dare," said S.Y. Hsu, Co-CEO, ASUS. "We are thrilled that this first collaboration with MediaTek has achieved such stunning performance, and we will continue to strive for continuous performance improvements."

MediaTek today announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.20 GHz (compared to 3.05 GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6 GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas. The Dimensity 1050 combines mmWave 5G and sub-6 GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6 nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

"The Dimensity 1050, and its combination of sub-6 GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. "With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines." In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek's HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band - 2.4 GHz, 5 GHz and 6 GHz - that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

The global smartphone applications processor (AP) market grew 23 percent to $30.8 billion in 2021, according to Strategy Analytics' Handset Component Technologies (HCT) service report. According to this Strategy Analytics' Handset Component Technologies (HCT) research report, " Smartphone Apps Processor Market Share Tracker Q4 2021: Qualcomm Increases Revenue Share Lead", Qualcomm, MediaTek, Apple, Samsung LSI and Unisoc grabbed the top-five revenue share ranking spots in the smartphone applications processor (AP) market in 2021.

Sravan Kundojjala, author of the report and Director of Handset Component Technologies service at Strategy Analytics, commented, "For the first time on an annual basis, MediaTek overtook Qualcomm in units and established over 75 million unit-lead in smartphone APs 2021. MediaTek capitalized on Qualcomm's defocus on mid and low tier 4G LTE APs and gained volume share. Despite the loss of unit share crown, Qualcomm exited 2021 with over 43% higher revenue than MediaTek, thanks to an increased mix of higher-priced premium and high-tier APs. Both companies performed well in the 5G AP segment and posted a 13-year high in their AP average selling prices (ASPs)."

MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology - connectivity, displays, gaming, multimedia and imaging features - to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek's powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the ultra-efficient TSMC 5 nm production process with an octa-core CPU. The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85 GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75 GHz.

"You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market," said CH Chen, Deputy General Manager of MediaTek's Wireless Communications Business Unit. Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek's HyperEngine 5.0 gaming technologies for exceptional power-efficiency that extends play time, and best-in-class frame rates - 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.