NVIDIA's next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA's own Grace Arm CPU in models such as the GB200, represents a significant development. TrendForce points out that the GB200 and its predecessor, the GH200, both feature a combined CPU+GPU solution, primarily equipped with the NVIDIA Grace CPU and H200 GPU. However, the GH200 accounted for only approximately 5% of NVIDIA's high-end GPU shipments. The supply chain has high expectations for the GB200, with projections suggesting that its shipments could exceed millions of units by 2025, potentially making up nearly 40 to 50% of NVIDIA's high-end GPU market.

Although NVIDIA plans to launch products such as the GB200 and B100 in the second half of this year, upstream wafer packaging will need to adopt more complex and high-precision CoWoS-L technology, making the validation and testing process time-consuming. Additionally, more time will be required to optimize the B-series for AI server systems in aspects such as network communication and cooling performance. It is anticipated that the GB200 and B100 products will not see significant production volumes until 4Q24 or 1Q25.

AMD's Instinct family has welcomed a new addition—the MI388X AI accelerator—as discovered in a lengthy regulatory 10K filing (submitted to the SEC). The document reveals that the unannounced SKU—along with the MI250, MI300X and MI300A integrated circuits—cannot be sold to Chinese customers due to updated US trade regulations (new requirements were issued around October 2023). Versal VC2802 and VE2802 FPGA products are also mentioned in the same section. Earlier this month, AMD's Chinese market-specific Instinct MI309 package was deemed to be too powerful for purpose by the US Department of Commerce.

AMD has not published anything about the Instinct MI388X's official specification, and technical details have not emerged via leaks. The "X" tag likely implies that it has been designed for AI and HPC applications, akin to the recently launched MI300X accelerator. The designation of a higher model number could (naturally) point to a potentially more potent spec sheet, although Tom's Hardware posits that MI388X is a semi-custom spinoff of an existing model.

TrendForce highlights the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3. NVIDIA's upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology. The challenge, however, is the supply bottleneck caused by both CoWoS packaging constraints and the inherently long production cycle of HBM—extending the timeline from wafer initiation to the final product beyond two quarters.

The current HBM3 supply for NVIDIA's H100 solution is primarily met by SK hynix, leading to a supply shortfall in meeting burgeoning AI market demands. Samsung's entry into NVIDIA's supply chain with its 1Znm HBM3 products in late 2023, though initially minor, signifies its breakthrough in this segment.

According to the latest report from Bloomberg, AMD has hit a roadblock in offering its top-of-the-line AI accelerator in the Chinese market. The newest AI chip is called Instinct MI309, a lower-performance Instinct MI300 variant tailored to meet the latest US export rules for selling advanced chips to China-based entities. However, the Instinct MI309 still appears too powerful to gain unconditional approval from the US Department of Commerce, leaving AMD in need of an export license. Originally, the US Department of Commerce made a rule: Total Processing Performance (TPP) score should not exceed 4800, effectively capping AI performance at 600 FP8 TFLOPS. This rule ensures that processors with slightly lower performance may still be sold to Chinese customers, provided their performance density (PD) is sufficiently low.

However, AMD's latest creation, Instinct MI309, is everything but slow. Based on the powerful Instinct MI300, AMD has not managed to bring it down to acceptable levels to acquire a US export license from the Department of Commerce. It is still unknown which Chinese customer was trying to acquire AMD's Instinct MI309; however, it could be one of the Chinese AI labs trying to get ahold of more training hardware for their domestic models. NVIDIA has employed a similar tactic, selling A800 and H800 chips to China, until the US also ended the export of these chips to China. AI labs located in China can only use domestic hardware, including accelerators from Alibaba, Huawei, and Baidu. Cloud services hosting GPUs in US can still be accessed by Chinese companies, but that is currently under US regulators watchlist.

NVIDIA is anticipating supply issues for its upcoming Blackwell GPUs, which are expected to significantly improve artificial intelligence compute performance. "We expect our next-generation products to be supply constrained as demand far exceeds supply," said Colette Kress, NVIDIA's chief financial officer, during a recent earnings call. This prediction of scarcity comes just days after an analyst noted much shorter lead times for NVIDIA's current flagship Hopper-based H100 GPUs tailored to AI and high-performance computing. The eagerly anticipated Blackwell architecture and B100 GPUs built on it promise major leaps in capability—likely spurring NVIDIA's existing customers to place pre-orders already. With skyrocketing demand in the red-hot AI compute market, NVIDIA appears poised to capitalize on the insatiable appetite for ever-greater processing power.

However, the scarcity of NVIDIA's products may present an excellent opportunity for significant rivals like AMD and Intel. If both companies can offer a product that could beat NVIDIA's current H100 and provide a suitable software stack, customers would be willing to jump to their offerings and not wait many months for the anticipated high lead times. Intel is preparing the next-generation Gaudi 3 and working on the Falcon Shores accelerator for AI and HPC. AMD is shipping its Instinct MI300 accelerator, a highly competitive product, while already working on the MI400 generation. It remains to be seen if AI companies will begin the adoption of non-NVIDIA hardware or if they will remain a loyal customer and agree to the higher lead times of the new Blackwell generation. However, capacity constrain should only be a problem at launch, where the availability should improve from quarter to quarter. As TSMC improves CoWoS packaging capacity and 3 nm production, NVIDIA's allocation of the 3 nm wafers will likely improve over time as the company moves its priority from H100 to B100.

During the recent IEDM conference, TSMC previewed its process roadmap for delivering next-generation chip packages packing over one trillion transistors by 2030. This aligns with similar long-term visions from Intel. Such enormous transistor counts will come through advanced 3D packaging of multiple chipsets. But TSMC also aims to push monolithic chip complexity higher, ultimately enabling 200 billion transistor designs on a single die. This requires steady enhancement of TSMC's planned N2, N2P, N1.4, and N1 nodes, which are slated to arrive between now and the end of the decade. While multi-chipset architectures are currently gaining favor, TSMC asserts both packaging density and raw transistor density must scale up in tandem. Some perspective on the magnitude of TSMC's goals include NVIDIA's 80 billion transistor GH100 GPU—among today's largest chips, excluding wafer-scale designs from Cerebras.

Yet TSMC's roadmap calls for more than doubling that, first with over 100 billion transistor monolithic designs, then eventually 200 billion. Of course, yields become more challenging as die sizes grow, which is where advanced packaging of smaller chiplets becomes crucial. Multi-chip module offerings like AMD's MI300X and Intel's Ponte Vecchio already integrate dozens of tiles, with PVC having 47 tiles. TSMC envisions this expansion to chip packages housing more than a trillion transistors via its CoWoS, InFO, 3D stacking, and many other technologies. While the scaling cadence has recently slowed, TSMC remains confident in achieving both packaging and process breakthroughs to meet future density demands. The foundry's continuous investment ensures progress in unlocking next-generation semiconductor capabilities. But physics ultimately dictates timelines, no matter how aggressive the roadmap.

Huawei's subsidiary HiSilicon has made significant strides in the independent R&D of AI chips, launching the next-gen Ascend 910B. These chips are utilized not only in Huawei's public cloud infrastructure but also sold to other Chinese companies. This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers. Additionally, in August, Chinese company iFlytek, in partnership with Huawei, released the "Gemini Star Program," a hardware and software integrated device for exclusive enterprise LLMs, equipped with the Ascend 910B AI acceleration chip, according to TrendForce's research.

TrendForce conjectures that the next-generation Ascend 910B chip is likely manufactured using SMIC's N+2 process. However, the production faces two potential risks. Firstly, as Huawei recently focused on expanding its smartphone business, the N+2 process capacity at SMIC is almost entirely allocated to Huawei's smartphone products, potentially limiting future capacity for AI chips. Secondly, SMIC remains on the Entity List, possibly restricting access to advanced process equipment.

Supermicro, Inc., a Total IT Solution Manufacturer for AI, Cloud, Storage, and 5G/Edge, is announcing three new additions to its AMD-based H13 generation of GPU Servers, optimized to deliver leading-edge performance and efficiency, powered by the new AMD Instinct MI300 Series accelerators. Supermicro's powerful rack scale solutions with 8-GPU servers with the AMD Instinct MI300X OAM configuration are ideal for large model training.

The new 2U liquid-cooled and 4U air-cooled servers with the AMD Instinct MI300A Accelerated Processing Units (APUs) accelerators are available and improve data center efficiencies and power the fast-growing complex demands in AI, LLM, and HPC. The new systems contain quad APUs for scalable applications. Supermicro can deliver complete liquid-cooled racks for large-scale environments with up to 1,728 TFlops of FP64 performance per rack. Supermicro worldwide manufacturing facilities streamline the delivery of these new servers for AI and HPC convergence.

Today at the "Advancing AI" event, AMD was joined by industry leaders including Microsoft, Meta, Oracle, Dell Technologies, HPE, Lenovo, Supermicro, Arista, Broadcom and Cisco to showcase how these companies are working with AMD to deliver advanced AI solutions spanning from cloud to enterprise and PCs. AMD launched multiple new products at the event, including the AMD Instinct MI300 Series data center AI accelerators, ROCm 6 open software stack with significant optimizations and new features supporting Large Language Models (LLMs) and Ryzen 8040 Series processors with Ryzen AI.

"AI is the future of computing and AMD is uniquely positioned to power the end-to-end infrastructure that will define this AI era, from massive cloud installations to enterprise clusters and AI-enabled intelligent embedded devices and PCs," said AMD Chair and CEO Dr. Lisa Su. "We are seeing very strong demand for our new Instinct MI300 GPUs, which are the highest-performance accelerators in the world for generative AI. We are also building significant momentum for our data center AI solutions with the largest cloud companies, the industry's top server providers, and the most innovative AI startups ꟷ who we are working closely with to rapidly bring Instinct MI300 solutions to market that will dramatically accelerate the pace of innovation across the entire AI ecosystem."

Today, AMD announced the availability of the AMD Instinct MI300X accelerators - with industry leading memory bandwidth for generative AI and leadership performance for large language model (LLM) training and inferencing - as well as the AMD Instinct MI300A accelerated processing unit (APU) - combining the latest AMD CDNA 3 architecture and "Zen 4" CPUs to deliver breakthrough performance for HPC and AI workloads.

"AMD Instinct MI300 Series accelerators are designed with our most advanced technologies, delivering leadership performance, and will be in large scale cloud and enterprise deployments," said Victor Peng, president, AMD. "By leveraging our leadership hardware, software and open ecosystem approach, cloud providers, OEMs and ODMs are bringing to market technologies that empower enterprises to adopt and deploy AI-powered solutions."

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, and IT infrastructure, today announced the GIGABYTE G383-R80 for the AMD Instinct MI300A APU and two GIGABYTE G593 series servers for the AMD Instinct MI300X GPU and AMD EPYC 9004 Series processor. As a testament to the performance of AMD Instinct MI300 Series family of products, the El Capitan supercomputer at Lawrence Livermore National Laboratory uses the MI300A APU to power exascale computing. And these new GIGABYTE servers are the ideal platform to propel discoveries in HPC & AI at exascale.⁠

Marrying of a CPU & GPU: G383-R80
For incredible advancements in HPC there is the GIGABYTE G383-R80 that houses four LGA6096 sockets for MI300A APUs. This chip integrates a CPU that has twenty-four AMD Zen 4 cores with a powerful GPU built with AMD CDNA 3 GPU cores. And the chiplet design shares 128 GB of unified HBM3 memory for impressive performance for large AI models. The G383 server has lots of expansion slots for networking, storage, or other accelerators, with a total of twelve PCIe Gen 5 slots. And in the front of the chassis are eight 2.5" Gen 5 NVMe bays to handle heavy workloads such as real-time big data analytics and latency-sensitive workloads in finance and telecom. ⁠

TrendForce's latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung's HBM3 (24 GB) is anticipated to complete verification with NVIDIA by December this year. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24 GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.

Given the intricacy of the HBM verification process—estimated to take two quarters—TrendForce expects that some manufacturers might learn preliminary HBM3e results by the end of 2023. However, it's generally anticipated that major manufacturers will have definite results by 1Q24. Notably, the outcomes will influence NVIDIA's procurement decisions for 2024, as final evaluations are still underway.

AMD's lineup of Radeon and Instinct GPUs, including the flagship RX 7900 XTX/XT, the professional-grade PRO W7900, and the upcoming Instinct MI300, are facing sales prohibitions in China, according to an alleged sales advisory guide from Dell. This restriction mirrors the earlier ban on NVIDIA's RTX 4090, underscoring the increasing export limitations U.S.-based companies face for high-end semiconductor products that could be repurposed for military and strategic applications. Notably, Dell's report lists several AMD Instinct accelerators, which are integral to data center infrastructure, and Radeon GPUs, which are widely used in PCs, indicating the broad impact of the advisory.

The ban includes discrete GPUs like AMD's Radeon RX 7900 XTX and 7900 XT, which, despite their data-center potential, may still be sold under specific "NEC" eligibility. This status allows for continued sales in restricted regions like sales of NVIDIA's RTX 4090. However, the process to secure NEC eligibility is lengthy, potentially leading to supply shortages and increased GPU prices—a trend already observed with the RX 7900 XTX in China, where it's become a high-end alternative in light of the RTX 4090's scarcity and inflated pricing. The Dell sales advisory also lists that sales of the aforementioned products are banned in 22 countries, including Russia, Iran, Iraq, and others listed below.

Today at Microsoft Ignite, AMD and Microsoft featured how AMD products, including the upcoming AMD Instinct MI300X accelerator, AMD EPYC CPUs and AMD Ryzen CPUs with AI engines, are enabling new services and compute capabilities across cloud and generative AI, Confidential Computing, Cloud Computing and smarter, more intelligent PCs.

"AMD is fostering AI everywhere - from the cloud, to the enterprise and end point devices - all powered by our CPUs, GPUs, accelerators and AI engines," said Vamsi Boppana, Senior Vice President, AI, AMD. "Together with Microsoft and a rapidly growing ecosystem of software and hardware partners, AMD is accelerating innovation to bring the benefits of AI to a broad portfolio of compute engines, with expanding software capabilities."

During its Ignite conference, Microsoft introduced a duo of custom-designed silicon made to accelerate AI and excel in cloud workloads. First of the two is Microsoft's Azure Cobalt 100 CPU, a 128-core design that features a 64-bit Armv9 instruction set, implemented in a cloud-native design that is set to become a part of Microsoft's offerings. While there aren't many details regarding the configuration, the company claims that the performance target is up to 40% when compared to the current generation of Arm servers running on Azure cloud. The SoC has used Arm's Neoverse CSS platform customized for Microsoft, with presumably Arm Neoverse N2 cores.

The next and hottest topic in the server space is AI acceleration, which is needed for running today's large language models. Microsoft hosts OpenAI's ChatGPT, Microsoft's Copilot, and many other AI services. To help make them run as fast as possible, Microsoft's project Athena now has the name of Maia 100 AI accelerator, which is manufactured on TSMC's 5 nm process. It features 105 billion transistors and supports various MX data formats, even those smaller than 8-bit bit, for maximum performance. Currently tested on GPT 3.5 Turbo, we have yet to see performance figures and comparisons with competing hardware from NVIDIA, like H100/H200 and AMD, with MI300X. The Maia 100 has an aggregate bandwidth of 4.8 Terabits per accelerator, which uses a custom Ethernet-based networking protocol for scaling. These chips are expected to appear in Microsoft data centers early next year, and we hope to get some performance numbers soon.

Today, AMD released the findings from a new survey of global IT leaders which found that 3 in 4 IT leaders are optimistic about the potential benefits of AI—from increased employee efficiency to automated cybersecurity solutions—and more than 2 in 3 are increasing investments in AI technologies. However, while AI presents clear opportunities for organizations to become more productive, efficient, and secure, IT leaders expressed uncertainty on their AI adoption timeliness due to their lack of implementation roadmaps and the overall readiness of their existing hardware and technology stack.

AMD commissioned the survey of 2,500 IT leaders across the United States, United Kingdom, Germany, France, and Japan to understand how AI technologies are re-shaping the workplace, how IT leaders are planning their AI technology and related Client hardware roadmaps, and what their biggest challenges are for adoption. Despite some hesitations around security and a perception that training the workforce would be burdensome, it became clear that organizations that have already implemented AI solutions are seeing a positive impact and organizations that delay risk being left behind. Of the organizations prioritizing AI deployments, 90% report already seeing increased workplace efficiency.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.

The distinctions between HBM generations primarily lie in their speed. The industry experienced a proliferation of confusing names when transitioning to the HBM3 generation. TrendForce clarifies that the so-called HBM3 in the current market should be subdivided into two categories based on speed. One category includes HBM3 running at speeds between 5.6 to 6.4 Gbps, while the other features the 8 Gbps HBM3e, which also goes by several names including HBM3P, HBM3A, HBM3+, and HBM3 Gen2.

When Lawrence Livermore National Laboratory (LLNL) announced the creation of a two-ExaFLOP supercomputer named El Capitan, we heard that AMD would power it with its Instinct MI300 accelerator. Today, LNLL published a Tweet that states, "We've begun receiving & installing components for El Capitan, @NNSANews' first #exascale #supercomputer. While we're still a ways from deploying it for national security purposes in 2024, it's exciting to see years of work becoming reality." As published images show, HPE racks filled with AMD Instinct MI300 are showing up now at LNLL's facility, and the supercomputer is expected to go operational in 2024. This could mean that November 2023 TOP500 list update wouldn't feature El Capitan, as system enablement would be very hard to achieve in four months until then.

The El Capitan supercomputer is expected to run on AMD Instinct MI300A accelerator, which features 24 Zen4 cores, CDNA3 architecture, and 128 GB of HBM3 memory. All paired together in a four-accelerator configuration goes inside each node from HPE, also getting water cooling treatment. While we don't have many further details on the memory and storage of El Capitan, we know that the system will exceed two ExFLOPS at peak and will consume close to 40 MW of power.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

Today, AMD (NASDAQ: AMD) showcased its high performance computing (HPC) leadership at ISC High Performance 2023 and celebrated, along with key partners, its first year of breaking the exascale barrier. AMD EPYC processors and AMD Instinct accelerators continue to be the solutions of choice behind many of the most innovative, green and powerful supercomputers in the world, powering 121 supercomputers on the latest TOP500 list.

"AMD's mission in high-performance computing is to enable our customers to tackle the world's most important challenges," said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. "Our industry partners and the global HPC community continue to leverage the performance and efficiency of AMD EPYC processors and Instinct accelerators to advance their groundbreaking work and scientific discoveries."

Atos today announces a contract to build and install a new high-performance computer for the Max Planck Society, a world-leading science and technology research organization. The new system will be based on Atos' latest BullSequana XH3000 platform, which is powered by AMD EPYC CPUs and Instinct accelerators. In its final configuration, the application performance will be three times higher than the current "Cobra" system, which is also based on Atos technologies.

The new supercomputer, with a total order value of over 20 million euros, will be operated by the Max Planck Computing and Data Facility (MPCDF) in Garching near Munich and will provide high-performance computing (HPC) capacity for many institutes of the Max Planck Society. Particularly demanding scientific projects, such as those in astrophysics, life science research, materials research, plasma physics, and AI will benefit from the high-performance capabilities of the new system.

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Today we got information that AMD's upcoming Instinct MI300 will be allegedly available as an Accelerated Processing Unit (APU). AMD APUs are processors that combine CPU and GPU into a single package. AdoredTV managed to get ahold of a slide that indicates that AMD Instinct MI300 accelerator will also come as an APU option that combines Zen4 CPU cores and CDNA3 GPU accelerator in a single, large package. With technologies like 3D stacking, MCM design, and HBM memory, these Instinct APUs are positioned to be a high-density compute the product. At least six HBM dies are going to be placed in a package, with the APU itself being a socketed design.

The leaked slide from AdoredTV indicates that the first tapeout is complete by the end of the month (presumably this month), with the first silicon hitting AMD's labs in Q3 of 2022. If the silicon turns out functional, we could see these APUs available sometime in the first half of 2023. Below, you can see an illustration of the AMD Instinct MI300 GPU. The APU version will potentially be of the same size with Zen4 and CDNA3 cores spread around the package. As Instinct MI300 accelerator is supposed to use eight compute tiles, we could see different combinations of CPU/GPU tiles offered. As we await the launch of the next-generation accelerators, we are yet to see what SKUs AMD will bring.