DisplayLink, the leading provider of technology for virtual graphics and USB-connected computing, today announced its support for 3rd generation Intel Core processors and supporting mobile Intel HM76 and Intel B75 express chipsets with SuperSpeed USB 3.0.

DisplayLink's DL-3000 chip platform with USB 3.0 is shipping today in adapters, monitors and docking stations from leading vendors. The broad availability of onboard USB 3.0 in systems using 3rd generation Intel Core processors means that a huge new segment of the market now has access to easy-to-use docking, and multi-display possibilities.

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first 100 Gbps full duplex network processor unit (NPU). Enabling the next wave of 100GbE optimized switches and routers for service provider networks, the fully programmable BCM88030 family features 64 custom processors running at 1GHz, delivering more than 2X the throughput of any NPU on the market. With the industry's highest level of integration, the BCM88030 solution eliminates costly external components, dramatically reducing system cost and power by up to 80 percent per 10 GbE port.

In 2012, the number of connected devices is set to exceed the world's population with an estimated 7 billion devices connected to the network(1). By 2015, 90 percent of content viewed on mobile devices will be streaming video and application downloads are expected to reach 47 billion per year(1). To satisfy this overwhelming appetite for bandwidth, service providers around the globe are racing to transform their networks by adopting higher bandwidth links. Analysts estimate a compound annual growth rate (CAGR) of more than 170 percent from 2011 to 2016 for 100G Ethernet ports as service providers rush to meet this demand(2).

Intel is planning to launch a line of low-power Xeon processors in Q2-2012, which will be the company's first Xeon processors built on the 22 nm fab process, with 3D transistors. It is quite likely that these chips are built in the LGA1155 package, however Intel is only releasing low-power variants, which ensures performance-segment Xeon E3-1200 family isn't disturbed, and more importantly, it doesn't have to pull out the best bins of its 22 nm Ivy Bridge silicon just yet (for use in higher clock-speed Xeon parts).

Intel has another emerging problem. With the advent of "micro-servers" (low power independent servers in high-density data-centers, which provide better cost-performance and manageability than virtual servers), ARM processor architecture is making inroads to the enterprise computing market. Intel's answer to that is refining the same silicon that goes into making low-power Atom processors, and making it enterprise-grade. This part is codenamed "Centerton", and Intel expects an entire micro-server platform based on these chips to be out in the second half of 2012.

While we're fairly certain about the launch-schedule of Intel's "Ivy Bridge" Core processor family and 7-series chipset from an older article, which pin-points at April 29 to be the day full-fledged reviews (including overclocking performance, and benchmarks that cover new features) can be published, there's still a looming doubt over that day being the one on which you could buy say, a Core i7-3770K off Newegg.com. A latest slide, probably sourced from Intel's Retailedge, lays that doubt to rest. April 29 is indeed the day you will be able to buy most significant "Ivy Bridge" Core i7 and Core i5 models. Certain other models are slated for June 3. Dual-core Core i3 and Pentium processors based on Ivy Bridge silicon are slated for "Holiday". As on April 29, you also be able to buy motherboards based on 7-series chipset, which support Ivy Bridge processors out of the box.

TYAN, an industry-leading server platform manufacturer and subsidiary of MiTAC International Corp., announces 8 cutting-edge platforms based on the Intel Xeon processor E5-2600 product family. These platforms are designed to deliver the benefits of Intel's latest processor architecture. They offer high peak performance along with outstanding power efficiency and are designed for today's HPC/GPU and general server applications. These products help channel customers build solutions for applications ranging from the largest data centers all the way down to the smallest server room implementations in a quick and efficient way.

TYAN's full array of 8 Intel Xeon processor E5-2600 product family-based platforms help users build systems that both increase IT capacity and reduce the total IT cost of ownership. TYAN's Intel Xeon processor E5-2600 product family-based platform portfolio includes 5 motherboards and 3 barebones systems that meet demands ranging from general small business computing to mission-critical applications such as virtualization or GPGPU. TYAN motherboards such as the S7050, S7055, or S7056, and barebones servers such as the GN70-B7056, FT48-B7055 and FT77-B7059, help customers address mission critical and massive workload requirements found in GPGPU and HPC applications. For memory intensive applications such as virtualization, TYAN presents the S7052 motherboard with a total of 24 DIMM slots. The S7053 is an excellent choice for applications requiring multiple expansion slots such as embedded and automation.

US chip giant Intel has now added seven new processors to its portfolio, the Core i5-2550K, i5-2450P and i5-2380P targeting desktops, and the Celeron B815, B720, 867 and 797 for mobile PCs.

The Core i5-2550K costs $225 ($9 more than the i5-2500K) and features four cores @ 3.4 GHz (the 2500K has a base clock of 3.3 GHz), four threads, 6 MB of L3 cache and a TDP of 95W. The i5-2450P ($195) and i5-2380P ($177) have similar specs, expect their base clock is 3.2 GHz and 3.1 GHz, respectively.

A multi-purpose optical chip which generates, manipulates and measures entanglement and mixture - two quantum phenomena which are essential driving forces for tomorrow's quantum computers - has been developed by researchers from the University of Bristol's Centre for Quantum Photonics. This work represents an important step forward in the race to develop a quantum computer.

The fundamental resource that drives a quantum computer is entanglement - the connection between two distant particles which Einstein famously called 'spooky action at a distance'. The Bristol researchers have, for the first time, shown that this remarkable phenomenon can be generated, manipulated and measured entirely on a tiny silica chip. They have also used the same chip to measure mixture - an often unwanted effect from the environment, but a phenomenon which can now be controlled and used to characterize quantum circuits, as well as being of fundamental interest to physicists.

Nordic Hardware has scored an exclusive interview with Pat Bliemer, Managing Director of Intel Northern Europe to discuss the technology following on from the 22 nm one used in the upcoming Ivy Bridge processors. Unfortunately, Bliemer was light on the technical details of this technology and didn't say when it would see the light of day, except to say that it will make fuller use of the Tri-Gate tech being used in the Ivy Bridge processors and that test circuits are running.

We need to keep going and you can trust me that in our labs we actually have the next generation after 22nm running, so we need to keep going.[...]I cannot really disclose more about that other than that in a laboratory-environment, absolutely we do have the path, our engineers do have the path to actually go and produce 14nm products. There are many variables that you can play with of course it is not the right name for it and the engineers would not like it when I say play, that you can influence to actually go and stay to that model. And I think the breakthrough we had now with the 3D metal gates, just the design of the gate will actually allow for much more efficient thermals and power.

Back in July, we looked even further ahead and reported that Intel aims to have 10 nm-based processors by 2018 and that the 14 nm tech is due for release around 2014. Watch this space.

It looks like there's a subtle but relentless push to get ARM CPUs into desktop PCs. Morgan Stanley recently surveyed 30 PC makers (names not revealed) and discovered that 40% of them are interested in trying out ARM-based PCs within the next two years. As we reported previously that the Wintel alliance appears to be crumbling, this finding appears to add weight to that assertion. Of course, there's a huge mountain to climb before ARM processors can compete head to head with high performance x86, as explained in our article, not least because Microsoft won't begin supporting ARM until Windows 8 is released late next year and the fact that the vast majority of existing software won't run on ARM. A real catch-22 if ever there was one. Just as crucially, the many high performance enhancements and interface standards that currently go into making a modern x86 chip fly will also have to go into an ARM - and developing that isn't going to be cheap, although it may not take that long, since these are tried and trusted technologies that need to be applied. Still, the interest is there and Morgan Stanley expect that 10% (39 million) PCs, excluding tablets, will have an ARM processor at their heart. If true, it will make for interesting times.

At SC11, Intel Corporation revealed details about the company's next-generation Intel Xeon processor-based and Intel Many Integrated Core (Intel MIC)-based platforms designed for high-performance computing (HPC). The company also outlined new investments in research and development that will lead the industry to Exascale performance by 2018.

During his briefing at the conference, Rajeeb Hazra, general manager of Technical Computing, Intel Datacenter and Connected Systems Group, said that the Intel Xeon processor E5 family is the world's first server processor to support full integration of the PCI Express 3.0 specification**. PCIe 3.0 is estimated** to double the interconnect bandwidth over the PCIe* 2.0 specification** while enabling lower power and higher density server implementations. New fabric controllers taking advantage of the PCI Express 3.0 specification will allow more efficient scaling of performance and data transfer with the growing number of nodes in HPC supercomputers.

Eurocom Corporation (www.eurocom.com), a developer of long lifespan, fully upgradable Notebooks, high performance Mobile Workstations and Mobile Servers is now offering a Mobile Workstation capable of supporting NVIDIA 3D Vision with NVIDIA GeForce GTX 580M and 560M GPUs.

Eurocom offers 3D Vision support on the Neptune Mobile Workstation through a built in-emitter, 3D active shutter technology, a 120Hz display and supported NVIDIA graphics cards. The EUROCOM Neptune comes complete with an NVIDIA 3D Vision Kit which consists of one pair of 3D Vision glasses and USB cables. Each lens of the glasses operates at 60Hz, and alternate to create a 120Hz 3-dimensional experience.

AMD today unleashed the AMD FX family of CPUs, delivering a fully unlocked and customizable experience for desktop PC users. The AMD FX series of desktop CPUs includes the first-ever eight-core desktop processor, enabling extreme multi-display gaming, mega-tasking and HD content creation for PC and digital enthusiasts - all for less than $245 (suggested U.S. retail price). This marks the first retail availability of processors that use AMD's new multi-core architecture (codenamed "Bulldozer"), which is included in AMD's upcoming server CPU (codenamed "Interlagos") and the next-generation of AMD Accelerated Processing Units.

"AMD FX CPUs are back with a vengeance, as validated by the recent feat of setting a Guinness World Records title for 'Highest Frequency of a Computer Processor,'" said Chris Cloran, corporate vice president and general manager, Client Group at AMD. "While overclockers will certainly enjoy the frequencies the AMD FX processors can achieve, PC enthusiasts and HD media aficionados will appreciate the remarkable experience that AMD FX processors can provide as part of a balanced, affordable desktop system."

Today, AMD (NYSE: AMD) announced revenue shipments of the first processors based on its new x86 "Bulldozer" architecture. Initial production of the world's first 16-core x86 processor, codenamed "Interlagos," began in August and shipping to customers is already underway. Compatible with existing AMD Opteron 6100 Series platforms and infrastructure, "Interlagos" is expected to launch and be available in partner systems in the fourth quarter of this year. Many of the initial shipments have been earmarked for large custom supercomputer installations that are now underway.

"This is a monumental moment for the industry as this first 'Bulldozer' core represents the beginning of unprecedented performance scaling for x86 CPUs," said Rick Bergman, senior vice president and general manager, AMD Products Group. "The flexible new 'Bulldozer' architecture will give Web and datacenter customers the scalability they need to handle emerging cloud and virtualization workloads."For more information, visit the pages of Opteron 6000 series and Opteron 4000 series.

The CPU support list in the product page of Gigabyte's top of the line socket AM3+ motherboard, the GA-990FXA-UD7, spilled out details of upcoming AMD FX series processors, days ahead of actual product launches. Tables listing out specs of FX processors aren't new, but in older occasions, they were posted by the media citing sources. This table comes from a leading motherboard manufacturer. In this case, the 990FXA-UD7 will support FX series processors from BIOS version F4.

The table lists out FX 8000 series 8-core processors, and one each of FX 6000 and FX 4000 series 6-core and 4-core chips. A new detail emerging with this table is the system interface speed, which has been bumped all the way up to 5200 MT/s, up from 4000 MT/s of the previous generation. The faster 8-core chips have TDP rated at 125W, while every other FX series chip is rated at 95W. FX 8000 series chips include the 3.60 GHz FX-8150, the 3.10 GHZ FX-8120, 2.80 GHz FX-8100; FX 6000 series includes the 3.30 GHz FX-6100; while the quad-core FX 4000 series includes the 3.60 GHz FX-4100. The FX series is expected to launch in this month.

Intel's upcoming Core i7 processors in the LGA2011 package, codenamed "Sandy Bridge-E," will come in a unique package that's completely different from what's being reported as AMD's, in which self-contained liquid CPU coolers will be bundled with some FX-series processors. Intel's upcoming Core i7-3820, Core i7-3930K and the Core i7-3960X Extreme Edition processor boxes will lack Intel's certified (stock) heatsink-fan (HSF). Instead, Intel plans to sell the certified coolers separately, probably having the same market reach and availability as the processors themselves.

The idea behind this is that the target users of Sandy Bridge-E will most likely use third-party cooling solutions. Hence it makes sense to save them of a chunk of metal they'll probably never use. For those who do use stock cooling, seldom/never overclock, and rely on the Intel certification to go with the cooler, Intel will have the certified cooler available separately for purchase, with its retail partners. Sandy Bridge-E processors have a rated TDP of 130W, though tests by those having access to engineering samples have shown that it can reach as much as 180W on load, even without overclocking. It is expected that PC cooling products manufacturers will have entire lines of LGA2011-ready coolers in time for the launch of Sandy Bridge-E.

The certified fan-heatsink that comes with the CPU is perhaps the first thing enthusiasts get rid of, from their machines. The bundled heatsinks are almost never built in a way that allows you to squeeze the most out of your CPU. It looks like AMD is deciding whether to change this notion with some of its top-tier 8-core "Bulldozer" FX-series processors. The company reportedly plans to bundle self-contained liquid-based coolers with their processors.

Over the last couple of years, consumers have taken a liking for $100 self-contained CPU water coolers, kits that include the block with a motor, pre-fitted tubing to the radiator, which latches onto the common 120 mm rear fan hole of most cases. Bundling water coolers indicate two things: firstly, that the top-end FX-series chips will be hot, secondly, AMD is trying to woo enthusiasts. AMD could have asked its cooler OEMs to come up with a heavy tower-type fan-heatsink, but it chose water-cooling instead. So the move to pack water-cooling could either work for AMD's image (wooing enthusiasts), or against it (to convey that FX chips are so hot that nothing short of water-cooling is fit for them). Pictured below is a popular self-contained water-cooler by Corsair.

AMD today reintroduced the FX brand for PC processors and platforms at the Electronic Entertainment Expo (E3). FX-branded products will be geared toward enthusiast PCs and HD entertainment aficionados. AMD also announced new members for its "Gaming Evolved" program, driving the PC gaming experience forward with native HD3D support in Eidos Montreal's "Deus Ex: Human Revolution," and new collaborations with Bioware, Creative Assembly and Codemasters.

The FX brand is associated with AMD's fastest processors and most powerful platforms -- those designed for unrestrained PC performance for the ultimate gaming and HD entertainment experiences. In addition, these processors and platforms drive rich visuals for graphics-intensive applications and high-resolution AMD Eyefinity multi-monitor configurations. The first platform to earn the FX title, the "Scorpius" platform, will feature the now-available AMD 9-series chipset motherboards and AMD Radeon HD 6000 Series graphics cards, plus the upcoming "Zambezi" unlocked, native eight-core processor.

Here is the first picture of GA-X79A-UD3, the first Gigabyte-branded socket LGA2011 motherboard. Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package. Mind you, this is just the cheapest LGA2011 board from Gigabyte, there is a higher-end line of X79 motherboards, so don't let the unspectacular looks of the UD3 get you.

The GA-X79A-UD3 is a standard ATX sized motherboard. Its main VRM is spread all around the large CPU socket, in what appears to be a 6-phase design, with an unknown number of memory and uncore phases. LGA2011 processors feature a large quad-channel DDR3 memory controller, along with a northbridge uncore component with a 40-lane PCI-Express 3.0 controller. Those amount to the socket's insane pin-count of 2,011 pins. Memory slots are located in pairs of two on either sides of the socket. Each slot is its own 64-bit wide memory channel.

At Computex 2010, motherboard vendors across the board displayed socket LGA1155 motherboards that support Intel "Sandy Bridge" processors, based on P67, H67 chipsets, months in advance of the platform actually making it to the market. This year, the motherboard industry will do something similar and show off socket LGA2011 motherboards based on the Intel X79 "Patsburg" chipset.

Detailed to much length in older articles, the platform schematic of Sandy Bridge-E surfaced, confirming X79's feature-set, including a PCI-Express 3.0 based supplementary interconnect between the processor and chipset to bolster enough bandwidth for the massive 10-port SATA 6 Gb/s controller, and a 8-port PCI-Express 2.0 hub. Sandy Bridge-E processor itself comes in three main variants, an all-enabled 6-core Extreme Edition, a 6-core unlocked variant, and a limited-OC 4-core variant. The platform is slated for late 2011.

Gateway today unveils new models in its Gateway NV Series line of notebook PCs with the latest AMD processors, including new models in AMD's Vision Technology line, which deliver enhanced performance capabilities for mobile computing.

The flagship model of the new line is the Gateway NV51B05u, which features an AMD E-Series processor E-350 with Vision Technology and ATI Radeon HD 6310 graphics to deliver heightened performance in a value-based notebook.

AMD's next-generation high-end desktop processor line, the AMD FX-series, is inching toward a June 11 launch, according to DonanimHaber. FX-Series is hyped for being based on the company's next-generation "Bulldozer" architecture, which is a built from ground up x86-64 processor design. AMD's FX-series will include 8-core, 6-core, and 4-core models, and will optimally run on a new socket currently referred to as "AM3+". Major motherboard vendors are expected to release AM3+ motherboards based on various chipsets around the same time.

Bringing industry leading security and manageability, and better, more flexible performance to business computing, Intel Corporation today unveiled its newest family of business processors. The new 2nd generation Intel Core vPro processor family features the performance and capabilities of Intel's new microarchitecture, enhancements to Intel vPro technology and new security features, including a 3G "poison pill" option to help protect a PC's data.

Computer makers around the world, including Dell, Fujitsu, HP and Lenovo, are introducing new laptop, convertible-tablet, desktop and all-in-one PCs for businesses based on the new Intel Core vPro processors.

Backed by industry support of the Intel Atom processor optimized for networked storage appliances for the home and small business, Intel Corporation has added two new Intel Atom processors to further boost the company's focus on the platform.

Since Intel's initial foray in this area in March, leading storage manufacturers, including Acer, Cisco, LaCie, LG Electronics, NETGEAR, QNAP, Super Micro, Synology and Thecus have announced products based on the energy-efficient Intel Atom processor platform.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Nano E-Series processor, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets.

The move to 64-bit software architecture is an essential transition for the future of the embedded industry. Forthcoming operating systems such as Windows Embedded Standard 7 will be able to leverage a 64-bit software eco system that provides up to double the amount of data a CPU can process per clock cycle. This translates in to greater ease in manipulating large data sets and an overall performance boost compared to non-native 64-bit architectures.

The halting of production of Acer's ultra-thin notebooks, and disappointing sales from all notebook manufacturers for this market segment has prompted Intel to wait until the third quarter to release its new line of Atom processors. Sources interviewed by DigiTimes hint that the release date may be pushed back even further if demand is not high enough by Q3. Notebook manufactures say that ultra-thin notebooks accounted for only 10-15% of their sales for 2009 instead of the predicted 20-30%.