On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.

AMD's latest GPUs have been reported to be experiencing overheating issues, with many users claiming that the vapor chamber cooler works better in a vertical rather than a horizontal position. Regardless of orientation, vapor chamber coolers should equal roughly the same heat dissipation performance and move the heat away from the source; however, testing showed that some reference AMD Radeon RX 7900 XTX GPUs feature defect coolers. According to the testing conducted by Roman "der8auer" Hartung, AMD's Radeon RX 7900 XTX RDNA3 GPUs are experiencing problems with overheating caused by a faulty vapor chamber design.

What der8auer found is that these coolers could have a defect in the manufacturing process, where the liquid inside the vapor chamber faces problems in circulation after condensation. It could relate to manufacturing issues of the cooler itself, with an inadequate amount of fluid or insufficient pressure inside the chamber. For more in-depth testing and performance benchmarks, see the video below. It is important to note that we didn't see other reports that replicate this behavior, so always take these reports with a dash of salt.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil two brand-new Radeon RX 7900 series graphics cards. Powered by the groundbreaking AMD RDNA 3 architecture, BIOSTAR is latest Radeon RX 7900XTX-24GB and RX 7900XT-20GB graphics cards deliver up to 50% more performance per watt than their previous generation RDNA 2 GPU units. Featuring AMD is superior RDNA 3 architecture and the world is fastest interconnect technology, the all-new BIOSTAR Radeon RX 7900XTX and RX 7900XT graphics cards combine 5 nm and 6 nm process nodes with updated chiplets that leverage AMD is Infinity Links and high-performance fanout packaging to deliver blazingly fast 5.3 TB/s bandwidth.

Unleash jaw-droppingly high frame-rates on AAA game titles with breathtaking 4K visuals powered by AMD is most advanced graphics technology with BIOSTAR is Radeon RX 7900XTX and RX 7900XT graphics cards. Ideal for gamers and content creators, they carry AMD is second-generation Infinity Cache technology and high-speed GDDR6 memory with up to a 384-bit memory interface.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new AMD Radeon RX 7900 Series graphics cards powered by the high-performance, energy-efficient AMD RDNA 3 architecture - the AORUS Radeon RX 7900 XTX ELITE 24G, Radeon RX 7900 XTX GAMING OC 24G, Radeon RX 7900 XTX 24G, Radeon RX 7900 XT GAMING OC 20G and Radeon RX 7900 XT 20G graphics cards. The new graphics cards will be available for purchase on December 13, 2022.

The new graphics cards are the world's first gaming graphics cards to feature an advanced AMD chiplet design, delivering exceptional performance and superb energy efficiency to power high-framerate 4K and higher resolution gaming in the most demanding titles.

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today launched the new AQUA, Taichi and Phantom Gaming series graphics cards based on AMD Radeon RX 7900 Series GPUs.

The new graphics cards are built on the groundbreaking AMD RDNA 3 architecture with chiplet technology. AMD RDNA 3 architecture delivers up to 54% more performance per watt than AMD RDNA 2, features the world's fastest interconnect linking the graphics and memory system chiplets at up to 5.3 TB/s, and offers up to 96 new unified compute units and second-generation AMD Infinity Cache technology. It also delivers increased AI throughput that provides up to 2.7X higher AI performance, and rearchitected compute units with second-generation ray tracing technology that provides up to 1.8X higher ray tracing architectural performance in select titles versus AMD RDNA 2 architecture.

AMD's next-generation Radeon RX 7900 high-end graphics cards are set to arrive next week and bring the new RDNA3 GPU architecture to the masses. However, it seems like the customers will have to fight for their purchase as the availability could be scarce at launch, leading to potentially increased prices with low stocks. According to Igor's Lab report, Germany will receive only 3,000 reference MBA (Made By AMD) units of Radeon RX 7900 series cards. In contrast, the rest of the EMEA region will receive only 7,000 MBA units. These numbers are lower than expected, so AIB partners may improve the supply once their designs hit shelves.

On the other hand, mainland China will not receive any MBA units of the new cards as a sign of increasing tension with Taiwan. Of course, AMD's board partners will supply their designs to China, and they are allowed to; however, it seems that only AMD is making a statement here. In addition to supply issues, the launch is rumored to be covered in BIOS issues such as memory leaks and the COVID-19 outbreak affecting production in closed factories. Of course, all of this information should be taken with a grain of salt, and we must wait for the official launch before making any further assumptions.

Over the past few weeks, the legal dispute between Arm Ltd. and Qualcomm Inc. has been warming up the eyes of the entire tech community. However, as per the latest court filing, Arm could change its licensing strategy and shift its whole business model into a new direction that would benefit the company directly. Currently, the company provides the intellectual property (IP) that chip makers can use and add to designs mixed with other IPs and custom in-house solutions. That is how the world of electronics design (EDA) works and how many companies operate. However, in the Qualcomm-Arm legal battle, Qualcomm's counterclaim has brought new light about Arm's plans for licensing its hardware designs past 2024.

According to Dylan Patel of SemiAnalysis, who examined court documents, Arm will reportedly change terms to use its IP where the use of other IP mixed with Arm IP is prohibited. If a chip maker plans to use Arm CPU IP, they must also use Arm's GPU/NPU/ISP/DSP IPs. This would result in devices that utilize every design the UK-based designer has to offer, and other IP makers will have to exclude their designs from the SoC. By doing this, Arm directly stands against deals like the Samsung-AMD deal, where AMD provides RDNA GPU IP and would force Samsung to use Arm's Mali GPU IP instead. This change should take effect in 2025 when every new license agreement has to comply with new rules.

It's hardly a secret that AMD will announce its first RDNA 3 based GPUs on the 3rd of November and the company has now officially announced that that it'll hold a livestream that starts 1:00 pm (13:00) Pacific Daylight Time. The event goes under the name "together we advance_gaming". AMD didn't share much in terms of details about the event, all we know is that "AMD executives will provide details on the new high-performance, energy-efficient AMD RDNA 3 architecture that will deliver new levels of performance, efficiency and functionality to gamers and content creators."

AMD is now TSMC's second largest customer for its 5 nanometer N5 silicon fabrication node, according to a DigiTimes report. The Taiwan-based semiconductor industry observer also reports that AMD is more resilient than Intel in facing any downturns in the PC industry, in the coming few months. PC sales are expected to slump by as much as 15 percent in the near future, but the lower market-share compared to Intel; and the flexibility for AMD to move its CPU chips over to enterprise product to feed the growth in server processor segment, means that the company can ride over a bumpy road in the near future. The lower market-share translates to "lesser pain" from a slump compared to Intel. The report also says that embracing TSMC for processors "just in time" means that AMD has a front-row seat with product performance, time-to-market, yields, and delivery.

AMD is on the anvil of two major product launches on 5 nm, the Ryzen 7000 series "Raphael" desktop processors on August 30 (according to the report), and EPYC "Genoa" server processors in November 2022. The company is planning to refresh its notebook processor lineup in the first half of 2023, with "Dragon Range," and "Phoenix Point" targeting distinct market segments among notebooks. "Dragon Range" is essentially "Raphael" (5 nm chiplet + 6 nm cIOD) on a mobile-optimized BGA package, letting AMD cram up to 16 "Zen 4" cores, and take on Intel's high core-count mobile processors. The iGPU of "Dragon Range" will be basic, since designs based on this chip are expected to use discrete GPUs. "Phoenix Point" is a purpose-built mobile processor with up to 8 "Zen 4" cores, and a powerful iGPU based the RDNA3 architecture.

AMD today announced a strategic collaboration with ECARX, a global mobility tech company. The companies will work together on an in-vehicle computing platform for next-generation electric vehicles (EVs), expected to be in mass production for global rollout in late 2023. The ECARX digital cockpit will be the first in-vehicle platform to be offered with AMD Ryzen Embedded V2000 processors and AMD Radeon RX 6000 Series GPUs along with ECARX hardware and software.

Combining the extensive experience in automotive digital cockpit design of ECARX with AMD advanced computing power and stunning visual graphic rendering capabilities, the companies aim to deliver an innovative in-car experience. The digital cockpit will launch with advanced features including driver information mode, heads-up display, rear seat entertainment, multiple-displays, multi-zone voice recognition, high-end gaming and a full 3D user experience.

Unofficial driver packs tend to unlock features outside of a product's feature-set, and the most prominent of these for AMD Radeon GPUs is the NimeZ series. Their latest 22.7.1-based driver pack extends Radeon Noise Suppression technology support to older generation GPUs (which predate the RX 5000 series). This would cover the RX 500/400 series "Polaris," the RX Vega series, and even the much older Graphics CoreNext architecture (R# 300-series and 200-series from a decade ago). Most importantly, this brings the technology to the various generations of AMD Ryzen and A-series APUs. Use of unofficial drivers isn't covered under product warranties, but then your pre-RDNA graphics card is probably outside its coverage anyway.

AMD's RDNA3 graphics IP is just around the corner, and we are hearing more information about the upcoming architecture. Historically, as GPUs advance, it is not unusual for companies to add dedicated hardware blocks to accelerate a specific task. Today, AMD engineers have updated the backend of the LLVM compiler to include a new instruction called Wave Matrix Multiply-Accumulate (WMMA). This instruction will be present on GFX11, which is the RDNA3 GPU architecture. With WMMA, AMD will offer support for processing 16x16x16 size tensors in FP16 and BF16 precision formats. With these instructions, AMD is adding new arrangements to support the processing of matrix multiply-accumulate operations. This is closely mimicking the work NVIDIA is doing with Tensor Cores.

AMD ROCm 5.2 API update lists the use case for this type of instruction, which you can see below:

rocWMMA provides a C++ API to facilitate breaking down matrix multiply accumulate problems into fragments and using them in block-wise operations that are distributed in parallel across GPU wavefronts. The API is a header library of GPU device code, meaning matrix core acceleration may be compiled directly into your kernel device code. This can benefit from compiler optimization in the generation of kernel assembly and does not incur additional overhead costs of linking to external runtime libraries or having to launch separate kernels.

rocWMMA is released as a header library and includes test and sample projects to validate and illustrate example usages of the C++ API. GEMM matrix multiplication is used as primary validation given the heavy precedent for the library. However, the usage portfolio is growing significantly and demonstrates different ways rocWMMA may be consumed.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

AMD is planning to debut its next-generation RDNA3 graphics architecture with the Radeon RX 7000 series desktop graphics cards, some time in late-October or early-November, 2022. This, according to Greymon55, a reliable source with AMD and NVIDIA leaks. We had known about a late-2022 debut for AMD's next-gen graphics, but now we have a finer timeline.

AMD claims that RDNA3 will repeat the feat of over 50 percent generational performance/Watt gains that RDNA2 had over RDNA. The next-generation GPUs will be built on the TSMC N5 (5 nm EUV) silicon fabrication process, and debut a multi-chip module design similar to AMD's processors. The logic dies with the GPU's SIMD components will be built on the most advanced node, while the I/O and display/media accelerators will be located in separate dies that can make do on a slightly older node.

AMD's upcoming Radeon RX 7000 series of graphics cards based on the RDNA 3 architecture are supposed to feature next-generation protocols all over the board. Today, according to a patch committed to the Linux kernel, we have information about display output choices AMD will present to consumers in the upcoming products. According to a Twitter user @Kepler_L2, who discovered this patch, we know that AMD will bundle DisplayPort 2.0 technology with UHBR 20 transmission mode. The UHBR 20 standard can provide a maximum of 80 Gbps bi-directional bandwidth, representing the highest bandwidth in a display output connector currently available. With this technology, a sample RDNA 3 GPU could display 16K resolution with Display Stream Compression, 10K without compression, or two 8K HDR screens running at 120 Hz refresh rate. All of this will be handled by Display Controller Next (DCN) engine for media.

The availability of DisplayPort 2.0 capable monitors is a story of its own. VESA noted that they should come at the end of 2021; however, they got delayed due to the lack of devices supporting this output. Having AMD's RDNA 3 cards as the newest product to support these monitors, we would likely see the market adapt to demand and few available products as the transition to the latest standard is in the process.

We are nearing the arrival of AMD's Radeon RX 6x50XT graphics card refresh series, and benchmarks are starting to appear. Today, we received a 3DMark TimeSpy benchmark of the AMD Radeon RX 6950XT GPU and compared it to existing solutions. More notably, we compared it to NVIDIA's GeForce RTX 3090 Ti and came to a surprise. The Radeon RX 6950XT GPU scored 22209 points in the 3DMark TimeSpy test and looking at Graphics score, while the GeForce RTX 3090 Ti GPU scored 20855 points in the same test. Of course, we have to account that 3DMark TimeSpy is a synthetic benchmark and tends to perform very well on AMD RDNA2 hardware, so we have to wait and see for official independent testing like TechPowerUp's reviews.

AMD Radeon RX 6950XT card was tested with Ryzen 7 5800X3D CPU paired with DDR4-3600 memory and pre-released 22.10-220411n drivers on Windows 10. We could experience higher graphics scores with final drivers and see better performance of the upcoming refreshed SKUs.

AMD today introduced Radeon Super Resolution (RSR), a new performance enhancement feature that's designed to improve frame-rates of thousands of games, whether or not they feature support for it. Put simply, RSR is a high-quality upscaling algorithm derived from FidelityFX Super Resolution 1.0, which is located on the driver-side, rather than game-side. In games that support FSR, the 3D scene rendered at a lower resolution is put through the FSR upscaler algorithm before post-processing and HUD are applied to its result. RSR doesn't require game-level integration, because it requires the game to simply run at a lower resolution than the display's native resolution; so it could act like a high-quality image upscaling algorithm.

This means that thousands of games can benefit from RSR, as the feature is agnostic to what it's upscaling. There are a couple of wrinkles, though. First, you'll need a Radeon RX 5000 or RX 6000 series GPU, based on the RDNA or RDNA2 graphics architectures. The older "Vega" or "Polaris" architectures don't support it. "Vega" is still a current architecture, given that Ryzen 5000 series processors with Radeon Graphics, use a "Vega" based iGPU. The feature should, however, work with the RDNA2-based iGPU of the Ryzen 6000 "Rembrandt" processor. The second big catch is that since RSR comes later down the rendering pipeline than even HUD application, you may notice low-quality HUDs in some games—especially RTS or RPGs with large cluttered HUDs and inventory icons. RSR is being released through the AMD Software 22.3.1 update today.

We explored RSR in greater technical detail, and tested its performance and image quality for you in our Radeon Super Resolution article.

The recent NVIDIA data-leak springs up information on various upcoming graphics parts. Besides "Ada Lovelace," "Hopper," we come across a new codename, "Blackwell." It turns out that NVIDIA is splitting the the graphics and compute architecture naming with the next generation, not unlike what AMD did, with its RDNA and CDNA series. The current "Ampere" architecture is being used both for compute and graphics, with the streaming multiprocessor for the two being slightly different—the compute "Ampere" has more FP64 and Tensor components, while the graphics "Ampere" does away with these in favor of RT cores and graphics-relevant components.

The graphics architecture to succeed GeForce "Ampere" will be GeForce "Ada Lovelace." GPUs in this series are identified in the leaked code as "AD102," "AD103," "AD104," "AD106," "AD107," and "AD10B," succeeding a similar numbering for parts with the "A" (GeForce Ampere) series. The compute architecture succeeding "Ampere" will be codenamed "Hopper." with parts in the series being codenamed "GH100" and "GH202." Another compute or datacenter architecture is "Blackwell," with parts being codenamed "GB100" and "GB102." From all accounts, NVIDIA is planning to launch the GeForce 40-series "Ada" graphics card lineup in the second half of 2022. The company is in need of a similar refresh for its compute product lineup, and could debut "Hopper" either toward the end of 2022 or next year. "Blackwell" could follow "Hopper."

Intel is designing a "Halo" SKU of a future generation of mobile processors with a goal to match Apple's in-house silicon of the time. Slated for tape-out some time in 2023, with mass-production expected in 2024, the 15th Generation Core "Arrow Lake-P Halo" processor is being designed specifically to compete with Apple's "premium 14-inch laptop" (presumably the MacBook Pro) that the company could have around 2024, based on an in-house Apple silicon. This is to essentially tell its notebook partners that they will have an SoC capable of making their devices in the class truly competitive. Apple relies on a highly scaled out Arm-based SoC based on in-house IP blocks, with a software that's closely optimized for it. Intel's effort appears to chase down its performance and efficiency.

The Core "Arrow Lake" microarchitecture succeeds the 14th Gen "Meteor Lake." It is a multi-chip module (MCM) of three distinct dies built on different fabrication nodes, in line with the company's IDM 2.0 strategy. These nodes are Intel 4 (comparable to TSMC N7 or N6), Intel 20A (comparable to TSMC N5), and an "external" 3 nm-class node that's just the TSMC N3. The compute tile, or the die which houses the CPU cores, combines a hybrid CPU setup of 6 P-cores, and 8 E-cores. The performance cores are likely successors of the "Redwood Cove" P-cores powering the "Meteor Lake" compute tiles. Intel appears to be using one kind of E-cores across two generations (eg: Gracemont across Alder Lake and Raptor Lake). If this is any indication, Arrow Lake could continue to use "Crestmont" E-cores. Things get interesting with the Graphics tile.

Mesh shader is a relatively new concept of a programmable geometric shading pipeline, which promises to simplify the whole graphics rendering pipeline organization. NVIDIA introduced this concept with Turing back in 2018, and AMD joined with RDNA2. Today, thanks to the finds of Phoronix, we have gathered information that Intel's DG2 GPU will carry support for mesh shaders and bring it under Vulkan API. For starters, the difference between mesh/task and traditional graphics rendering pipeline is that the mesh edition is much simpler and offers higher scalability, bandwidth reduction, and greater flexibility in the design of mesh topology and graphics work. In Vulkan, the current mesh shader state is NVIDIA's contribution called the VK_NV_mesh_shader extension. The below docs explain it in greater detail:

Vulkan API documentationThis extension provides a new mechanism allowing applications to generate collections of geometric primitives via programmable mesh shading. It is an alternative to the existing programmable primitive shading pipeline, which relied on generating input primitives by a fixed function assembler as well as fixed function vertex fetch.

There are new programmable shader types—the task and mesh shader—to generate these collections to be processed by fixed-function primitive assembly and rasterization logic. When task and mesh shaders are dispatched, they replace the core pre-rasterization stages, including vertex array attribute fetching, vertex shader processing, tessellation, and geometry shader processing.

Valve's highly anticipated handheld gaming console, Steam Deck, officially arrives on February 25th. According to the newest information from Valve, the company plans to start sending our Steam Deck units to customers who first pre-ordered their units on February 25th, and the arrival time should be three days. That means that on February 28th, customers will have Steam Deck in their hands. Regarding press units for reviewers, the company has already started shipping review units to select media partners. The review embargo for Steam Deck is also set to February 25th, so that marks the date when we can see the full potential of AMD's custom Van Gogh SoC.

As a general reminder, the Van Gogh SoC features four Zen 2 cores with eight threads, running at a 3.5 GHz frequency. The graphics side is powered by eight RDNA2 CUs clocked at 1.6 GHz, meaning that the chip can support some decent handheld gaming. The base model starts at $399, while the top-end configuration costs up to $649, carrying more extensive memory/storage options.

The image upscaling wars keep grassing, with AMD and NVIDIA claiming as many integrations as possible for their respective FSR (FidelityFX Super Resolution) and DLSS (Deep-Learning Super Sampling) technologies in a bid to achieve maximum market share for their respective technologies. While the entire world was now focusing on Intel's own addition to the image upscaling wars with its XeSS (XE SuperSampling) tech, AMD is apparently looking to introduce a new upscaling tech as early as January 2022. Enter Radeon Super Resolution (RSR).

Right off the bat, do not expect RSR to be AMD's answer to the perceived image quality advantage of NVIDIA's deep-learning-powered DLSS compared to AMD's more open (and cross-hardware compatible) FSR. Instead, AMD seems to be targeting RSR as a game-agnostic upscaling solution that's based on FSR, but which can be enabled at the Radeon driver level for any game that supports exclusive full-screen rendering. AMD is seemingly moving its image upscaling technique further up in the graphics pipeline, which should impact upscaling quality (as there's less information for the image upscaler to work with). What this does enable, however, is an agnostic solution that can be deployed in any game - provided you're rocking one of the two rumored architectures that will support RSR (RDNA and RDNA2, in the form of AMD's RX-5000 and RX-6000 series). Considering the expected release of RSR, it's likely that AMD will have an official announcement around CES 2022, despite the fact that the company won't be physically present due to COVID-19 and logistics concerns.

XFX started selling the AMD BC-160 cryptocurrency mining card based on the AMD "Navi 12" silicon. The card is available on AliExpress for $2,000. The "Navi 12," if you recall, is an MCM mobile GPU that AMD developed exclusively for the 2019 MacBook Pro. It combined an RDNA-based GPU die with up to 16 GB of HBM2 across a 2048-bit wide interface. Built on the 7 nm node, the GPU die of "Navi 12" on the BC-160 is configured with 36 compute units (2,304 stream processors), and 8 GB of HBM2 across the full 2048-bit memory bus.

The card uses a blower-type cooling solution, and is rated with 150 W of typical board power, with a claimed 69.5 Mh/s (ETH). Drivers are provided for Linux, and mining software supported include Team Red Miner and Phoenix Miner. The card features a PCI-Express 4.0 x16 interface, its driver supports systems with up to 12 of these installed. A marketing slide sheds light on the nomenclature AMD is using for its mining cards. The "BC" in BC-160 represents "blockchain compute," the "1" stands for generation, in this case, first generation; and "60" represents hashrate-class with ETH.

Sapphire, along with various other AIB partners from AMD, has been making graphics cards exclusively for cryptocurrency mining. With the arrival of AMD's RDNA2 generation, this has continued as well. However, the company has been doing it more quietly to avoid backslash from its customers already furious about the poor availability of graphics cards in general. Fortunately, El Chapuzas Informatico managed to get ahold of two datasheets from Sapphire that highlight features and use cases of its GPRO X080 and GPRO X060 mining graphics cards, primarily targeting Ethereum coin mining.

According to the source, the company has readied two models based on RDNA2 chipsets. That is GPRO X080 SKU based on Navi 22 with 2304 Streaming Processors, running at 2132 MHz frequency. Paired with Navi 22 GPU, 10 GB of GDDR6 memory runs at 16 Gbps speed on a 160-bit bus. This model has no display outputs, and the only connector is a PCIe 4.0 x16 slot that connects the GPU to the motherboard. Running at the default 165 Watt TGP, the card produces a 38.0 MH/s hash rate, while the optimized form of 41.6 MH/s reduces TGP to just 93 Watts.

As we await the update of AMD's highly anticipated 6000 series Rembrandt APUs based on Zen 3 cores and RDNA2 graphics, we are in for a surprise with information about the next generation, more than a year away, of Ryzen 7000 series mobile processors based on Zen 4 architecture. Codenamed Raphael-H, it co-exists with the upcoming lineup of Phoenix APUs, which come after the 6000 series Rembrandt APU lineup. This mobile variant of the forthcoming desktop Raphael processors features as many as 16 cores based on Zen 4 architecture. What is so special about the Raphael-H is that it represents a mobile adaptation of desktop processors, and we are not sure how it will be different from the Phoenix APUs. However, we assume that Phoenix is going to feature a more powerful graphics solution.

The confusing thing is the timeline of these processors. First comes the Rembrandt APUs (6000 series) and then both the Raphael-H and Phoenix mobile processors. AMD could disable iGPU on mobile Raphael-H designs. However, that is just a guess. We have to wait to find out more in the upcoming months.