AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

AMD's 4 nm "Phoenix" silicon could serious turn the company's fortunes around in the ultra-thin notebook space. The 28-Watt Ryzen 7 7840U surfaced on Cinebench R23 screenshots, where it is shown beating the previous-generation 55 W flagship, the Ryzen 9 6900HX. If this is any indication of performance across the board, then the 15-28 W models of Ryzen 7040-series "Phoenix" could unleash an open-season against competing 15-28 W-category 13th Gen Core processors that have lower P-core counts, such as 2P+8E. The 7840U has all eight "Zen 4" CPU cores enabled, along with a fast RDNA3 graphics architecture based iGPU. In the screenshot, the 7840U is shown with a Cinebench R23 multi-threaded score of 14285 points, a score that is higher than that of the "Zen 3+" based 6900HX "Rembrandt," and a touch below the 45 W Core i7-12800H, which means it could have the upper hand over several 13th Gen and 12 Gen SKUs in the 15-28 W category.

If you were one of those that were waiting with bated breath for AMD's Zen 4 based "Phoenix" line-up of mobile CPUs, you're going to be waiting a little longer. Late on Friday afternoon AMD announced that they have delayed the launch of their Ryzen Mobile 7040HS series of CPUs, pushing the expected launch window from late March to some time in April. Speculation abound as to why this may be, but the direct correspondence from AMD's PR department is sparse:

To align with platform readiness and ensure the best possible user experience, we now expect our OEM partners to launch the first notebooks powered by Ryzen 7040HS Series processors in April.

As a refresher on the "Phoenix" line of CPUs these are the next-generation Zen 4 based monolithic SoCs built on TSMC's 4 nm process first announced back in January. These chips feature up to 8 Zen 4 cores with turbo clocks reaching 5 to 5.2 GHz, an RDNA3 based integrated GPU with clocks as high as 3 GHz, and AMD's first AI coprocessor dubbed Ryzen AI. Despite being Zen 4 these SoCs are still using PCI-E Gen 4 but are not hamstrung by a lack of lanes like some previous generations. We've already seen substantial leaks over the past few days hinting at the performance of these chips which suggests they will offer good competition to Intel's shipping 13th Gen Raptor Lake mobile offerings.

AMD has announced the immediate availability of its Ryzen 7045 HX-series (Dragon Range) processors for high performance laptop devices. In a Youtube video released on March 10, AMD's Jason Banta has announced the availability of the world's most powerful mobile processor, the Ryzen 9 7945HX. He listed the OEM partners who have integrated the 7945HX into flagship level laptop models. He also declared that this range topping CPU is a competition beater. Gaming benchmark tests have demonstrated that the Ryzen 9 7945HX beats Intel's Raptor Lake Core i9-13950HX by an average margin of 10%.

There are two distinct developments in the client processor space for AMD—first, its Ryzen 7000X3D desktop processors have managed to retain gaming performance competitiveness against Intel's fastest 13th Gen Core "Raptor Lake" processors; and second, that its Ryzen 7045HX "Dragon Range" mobile processors are picking up interest in the enthusiast-segment notebook community, where its advanced 5 nm + 6 nm process is dealing damage to 13th Gen Core mobile processors in performance/Watt, and gaming performance. Can AMD dial things up a notch? Technically, yes.

It should technically be possible for AMD to build "Dragon Range" multi-chip modules using "Zen 4" + 3D Vertical Cache CCDs (CPU complex dies), much in the same way it did for the desktop product stack. Such a processor would either have one CCD with the 3DV cache for a CPU core-count of up to 8-core/16-thread; or a contraption similar to the desktop 7950X3D, wherein one of the CCDs has 3DV cache, while the other is a regular "Zen 4" CCD, for core-counts of up to 16-core/32-thread. But will AMD build such chips? A lot would depend on the volumes of L3Ds (the 6 nm dies with the 64 MB 3D Vertical cache memory that operates at 2.5 TB/s), the production of CCDs with 3DV cache; and whether AMD is able to achieve the right performance/Watt numbers against Intel's fastest 8P+16E "Raptor Lake" mobile processors.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 presentation, we not only have a die shot of the cIOD, but some friendly people on the internet have also made annotations for us mere mortals. There are no big secrets here, but based on the annotations by @Locuza_ we now know for certain that it's not possible to use the current I/O die with three CCDs, as it only has two GMI3 interfaces, to which the CCDs are connected.

If you're wondering about the 2x 40-bit memory interface, it's for ECC memory support outside of the on-die ECC support of DDR5 memory. Also note that DDR5 memory is two times 32-bit in non ECC mode. That said, it's up to the motherboard makers to implement support for ECC memory, but it would appear all Zen 4 CPUs support it. The addition of a GPU, even a basic one like this, takes up a fair bit of space inside the cIOD, especially once you add things like video decoders/encoders and so on. In fact, it appears that the parts related to the GPU and video decoders/encoders take up at least a third of the space inside the I/O die, yet thanks to a significant die shrink from the Zen 3 era cIOD, it's physically smaller in the Zen 4 processors, while having an estimated 58 percent increase in transistors.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

AMD's top two new desktop processors, the Ryzen 9 7950X3D 16-core/32-thread; and the Ryzen 9 7900X3D 12-core/24-thread, go on sale later today (starting 3 PM Central European time, 9 AM EST). The two "Zen 4" processors feature the company's 3D Vertical Cache technology, which significantly improves gaming performance. The 7950X3D in particular attains parity with the Intel Core i9-13900K in both gaming and multi-threaded productivity performance.

3D Vertical Cache is a 64 MB SRAM die that augments the 32 MB on-die L3 cache of one of the two CCDs in these processors. The combined 96 MB cache has a profound impact on compute latencies for gaming. In our testing, the 7950X3D matches the gaming performance of the i9-13900K "Raptor Lake," which means AMD now has a truly competitive processor with Intel's latest. It also matches or exceeds the I/O feature-set, including DDR5 memory, PCIe Gen 5 (including for the CPU-attached NVMe slot); and an iGPU, although it loses out on DDR4 memory support. The Ryzen 9 7950X3D commands an MSRP of USD $700, and the 7900X3D $600.

Catch the TechPowerUp Review of the AMD Ryzen 9 7950X3D.

AMD is preparing to release the latest version of its Chipset software. Version 5.01.29.2026 WHQL should be of particular interest for users planning to buy an upcoming Ryzen 7000X3D series processor. The chipset driver includes the "3D V-Cache Performance Optimizer driver" component, version 1.0.0.7. This gives Windows a degree of awareness of the asymmetric nature of 3DV cache on the 16-core 7950X3D and 12-core 7900X3D, where only one of the two CCDs (chiplets) has the 3DV cache memory, while the other is a regular "Zen 4" CCD with 32 MB on-die L3 cache. This awareness should in theory improve performance in less-parallelized workloads (such as games). The AMD website doesn't yet list this driver, but it should appear as we head closer to the market-availability date of the 7950X3D and 7900X3D (February 28). From the looks of it, the optimization works for both Windows 11 and Windows 10, so those on the older operating system for reasons, can keep rocking it.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

Intel has recently updated its open-source C++ header file library for high-performance SIMD-based sorting to support the AVX-512 SIMD instruction set. Extending the capability of regular AVX2 support, the sorting functions now implement 512-bit extensions to offer greater performance. According to Phoronix, the NumPy Python library for mathematics that underpins a lot of software has updated its software base to use the AVX-512 boosted sorting functionality that yields a fantastic uplift in performance. The library uses AVX-512 to vectorize the quicksort for 16-bit and 64-bit data types using the extended instruction set. Benchmarked on an Intel Tiger Lake system, the NumPy sorting saw a 10-17x increase in performance.

Intel's engineer Raghuveer Devulapalli changed the NumPy code, which was merged into the NumPy codebase on Wednesday. Regarding individual data types, the new implementation increases 16-bit int sorting by 17x and 32-bit data type sorting by 12-13x, while float 64-bit sorting for random arrays has experienced a 10x speed up. Using the x86-simd-sort code, this speed-up shows the power of AVX-512 and its capability to enhance the performance of various libraries. We hope to see more implementations of AVX-512, as AMD has joined the party by placing AVX-512 processing elements on Zen 4.

In the wake of its Ryzen 7000X3D series announcement, AMD cut the price of its Ryzen 7 7700X 8-core/16-thread "Zen 4" processor. The Ryzen 7000X3D series is available from February 28, however, the 8-core 7800X3D will only be available from April 6. Despite this, sales prospects of the 7700X could be affected, as the SKU faces cannibalization not just from the 7800X3D, but also the recently launched 65 W Ryzen 7 7700, which has shown decent overclocking potential with motherboard-level power limit unlocks. What's interesting is that the 105 W 7700X at $299 puts it below the 65 W 7700 that launched at $325, which means that the 7700 could get even cheaper. This series of price-cuts and SKU re-positioning could make AMD competitive against Intel's 13th Gen Core i5 SKUs such as the i5-13600 and i5-13500 6P+8E models.

AMD today announced the retail channel pricing of its upcoming Ryzen 7000X3D "Zen 4" line of high-performance Socket AM5 desktop processors. These processors introduce the 3D Vertical Cache (3DV cache) technology, which the company claims has a significant impact on gaming performance, making them perform competitively with 13th Gen Core "Raptor Lake" processors, including the fastest i9-13900K, and possibly even the i9-13900KS. AMD announced retail availability from February 28, 2023 for the Ryzen 9 7950X3D and 7900X3D. The Ryzen 7 7800X3D launches on April 6, 2023.

The Ryzen 7 7800X3D 8-core/16-thread processor is priced at USD $449. The 12-core/24-thread Ryzen 9 7900X3D is priced at $599. The flagship 16-core/32-thread Ryzen 9 7950X3D is priced at $699. The 7800X3D launches at a $50 higher price than the $399 price that the Ryzen 7 7700X launched at, before settling down at $349. The 7900X3D launches at $599, which again is a $50 premium over the launch price of the Ryzen 9 7900X—currently going for $475. The top-dog 7950X3D launches at the same $699 price that the 7950X launched at, which has its price slashed all the way down to $575.A video presentation by AMD follows.

The product pages of the upcoming AMD Ryzen 9 7950X3D and Ryzen 7 7800X3D "Zen 4" processors went online, which say that the two chips are unlocked for overclocking. This normally implies that the processor has an unlocked base-clock multiplier, which makes it easy to overclock. The previous-generation Ryzen 7 5800X3D processors came with locked base-clock multipliers, making them complicated to overclock. Both the 16-core/32-thread 7950X3D and the 8-core/16-thread 7800X3D come with a TDP rating of 120 W, which for the 7950X3D is significantly lower than the 170 W that the 7950X is rated at. It's also worth noting that the T-junction max (TJmax) value is lower, at just 89°C, compared to 95°C of the 7950X and 7700X.

Slated for a February 2023 market release, the two chips introduce stacked 3D vertical cache technology (3DV cache). The 7800X3D comes with 64 MB of 3DV cache stacked on top of the 32 MB of on-die L3 cache, taking its L3 cache size to 96 MB, and total cache (L2+L3) to 104 MB. On the other hand, the 7950X3D and the 12-core/24-thread 7900X3D only come with the 3DV cache memory on one of the two "Zen 4" CCDs. The first CCD has 96 MB of L3 cache (including the 3DV cache), while the second CCD is a standard "Zen 4" CCD with just 32 MB of on-die L3 cache. For these chips, the L3 cache adds up to 128 MB, and total cache to 140 MB for the 7900X3D, and 144 MB for the 7950X3D.Update Jan 24th: AMD updated their product pages to remove this field altogether. It looks like we'll have to wait a bit for AMD to finalize its specs.

At the 2023 International CES, ASUS ROG announced several of its upcoming gaming notebooks across several form-factors. ASUS was one of the very few gaming PC brands to show off upcoming products based on an AMD Ryzen 7000 series processors besides those based on 13th Gen Intel Core processors. The star-attraction is the ROG Flow Z13 (GZ301-2023), an ultraportable gaming tablet that folds into a notebook—a very rare device. It packs a 13-inch 16:10 ROG Nebula display with 2560 x 1600 pixels resolution, 165 Hz, 3 ms response time, and NVIDIA G-SYNC. Under the hood, the ROG Flow Z13 rocks an Intel Core i9-13900H 6P+8E processor, GeForce RTX 4060 Laptop GPU with Advanced Optimus. The device puts out a 170° kick stand, and a detachable full-size keyboard.

The 2023 ASUS ROG Zephyrus G14 is the company's fastest gaming notebook to be powered by an AMD processor. The 14-inch conventional form-factor notebook packs a 2560 x 1600 pixels mini-LED display with 165 Hz refresh-rate, 3 ms response time, 100% DCI-P3 coverage, and G-SYNC. The main muscle is an AMD Ryzen 7000 series processor (very likely from the "Phoenix Point" Ryzen 7045 series), and a GeForce RTX 4090 Laptop GPU. While not an AMD Advantage laptop, ASUS has given this its own in-house ROG Intelligent Cooling system that incorporates vapor-chamber base plates and liquid-metal TIM.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

Lexar extended its latest-generation ARES RGB memory enthusiast product design to the DDR4 segment, with its ARES RGB DDR4 memory series. Available in 16 GB (2x 8 GB) dual-channel kits, these modules come with an Intel XMP 2.0 profile for DDR4-4000, and come with software-controllable RGB LED illumination. Over in the DDR5 camp, we see Lexar show off its DDR5-6000 memory module that's been validated on the AMD Ryzen 7000 "Zen 4" platform, with an AMD EXPO profile that enables the advertised speeds, timings, and AMD-specific sub-timings. On Intel machines, the included XMP 3.0 profile enables the relevant timings and sub-timings besides the DDR5-6000 speed. There's a non-RGB version of the ARES DDR5 series at lower speed variants, at DDR5-5200 (JEDEC-standard SPD).

Here's the first look at the retail PIB package of an AMD Ryzen 9 7950X3D processor with 3D Vertical Cache technology. These chips come in box design that's distinct from the rest of the Ryzen 7000 lineup. Bright orange and silver accents make up the front face of the box, with "3D Vertical Cache technology" being mentioned prominently. With the Ryzen 7 5800X3D, the PIB package design was probably found to look too similar to the rest of the lineup and practically indistinguishable from those of the 5000G "Cezanne" desktop APUs, which is probably why AMD took this route.

It's very likely that we'll see Socket AM5 desktop APUs based on the "Phoenix Point" monolithic silicon later this year, with its 12 CU RDNA3 iGPU and 8-core/16-thread "Zen 4" CPU that has a 32 MB on-die L3 cache. These processors will have yet another distinguishable retail PIB packaging. AMD's then technical marketing director, Robert Hallock, assured us that the company will continue to invest in desktop APUs (processors with powerful iGPUs), despite Ryzen 7000 desktop processors coming with a low-power iGPU as standard.

Here are some of the first pictures of the yet-unnamed PCIe Gen 5-based NVMe SSD by ADATA XPG. Built in the M.2-2580 form-factor, the drive features a PCI-Express 5.0 x4 host interface and NVMe 2.0 protocol. At its core is a Silicon Motion SM2508 series controller, coupled with the latest generation 3D TLC NAND flash over a large number of flash channels; and a faster DRAM cache. The drive offers sequential transfer rates of up to 14 GB/s reads, with up to 12 GB/s writes. and 2 million IOPS 4K random transfers. It comes in capacity-based variants, with 8 TB being the largest one.

The most striking aspect about this drive is its active cooling solution. A ridged aluminium monoblock heatsink is used to cool the SM2508 controller. nestled in its center is what appears to be a miniature 10 mm lateral fan. The heatsink has surface-crystallization treatment to increase surface area for heat dissipation. A die-cast aluminium top-plate and 3-sided backplate sandwich the fan-heatsink and the main PCB. The fan is tightly controlled by temperature, and ADATA claims you should barely notice it. To use the drive to its fullest, you'll either need an AMD Ryzen 7000 "Zen 4" platform that has dedicated PCIe Gen 5 M.2 slots wired to the processor, or an Intel 700-series chipset motherboard that puts out a Gen 5 M.2 slot by subtracting lanes from the Gen 5 PEG slot.

ASUS today announced the all-new TUF Gaming A16 Advantage Edition, an all-AMD gaming laptop with a redesigned chassis and an incredibly immersive 16-inch display. The TUF Gaming A15, A17, F15 and F17 laptops also make a triumphant return, sporting the latest silicon from AMD, Intel, and NVIDIA to power players into the next generation of gaming performance.

TUF A16 Advantage Edition announced
Built for serious gaming with subtle styling, the TUF Gaming A16 Advantage Edition is a sleek gaming laptop built to demolish the competition. Powered completely by AMD, the TUF Gaming A16 features up to an AMD Ryzen 9 Zen 4 processor and AMD Radeon RDNA 3 mobile graphics. "AMD and ASUS have partnered to deliver our latest 'Zen 4' and RDNA 3 technologies into the most innovative form factors," said Jason Banta, CVP and GM OEM PC. "The TUF Gaming A16 Advantage Edition delivers blistering gaming performance and outstanding power efficiency in a sleek portable chassis."

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.