Today, AMD (NASDAQ: AMD) announced "together we advance_PCs," a livestream premiere to unveil next generation AMD PC products. Chair and CEO Dr. Lisa Su, CTO and EVP Mark Papermaster, and other AMD executives will present details on the latest "Zen 4" architecture that powers upcoming AMD Ryzen processors and the all new AM5 platform built around the latest technologies including DDR5 and PCIe 5.0, all designed to drive a new era of performance desktop PCs.

The show will premiere at 7 p.m. ET on Monday, August 29, on the AMD YouTube channel. A replay can be accessed a few hours after the conclusion of the event at AMD.com/Ryzen.

Following the recent passage of the U.S. CHIPS and Science Act last week, GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing and Qualcomm Technologies, Inc. today announced they are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into by GF's and Qualcomm's respective subsidiaries. Today's announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF's most advanced semiconductor manufacturing facility, in Malta, New York.

The announcement was made in Washington D.C. at a CEO Summit co-hosted by GF, Ford Motor Company, and Applied Materials, which included National Economic Council Director Brian Deese, Under Secretary of Defense for Acquisition & Sustainability Dr. William LaPlante, and National Security Council Senior Director for Technology & National Security, Tarun Chhabra underscoring the importance of domestic manufacturing to national and economic security. The Summit included CEOs and senior leaders from across the semiconductor supply chain from tool and wafer manufacturers to key suppliers to end users of chips manufactured in the U.S.

-AvicenaTech Corp., the leader in microLED-based chip-to-chip interconnects, today announced that the company has secured $25M in Series A funding from Samsung Catalyst Fund, Cerberus Capital Management, Clear Ventures, and Micron Ventures to drive the development of products based on Avicena's breakthrough photonic I/O solution. "We believe that Avicena technology can be transformational in unlocking compute-to-memory chip-to-chip high-speed interconnects. Such technology can be central to supporting future disaggregated architectures and distributed high-performance computing (HPC) systems," said Marco Chisari, EVP of Samsung Electronics and Head of the Samsung Semiconductor Innovation Center.

"We are excited to participate in this round at Avicena," said Amir Salek, Senior Managing Director at Cerberus Capital Management and former Head of silicon for Google Infrastructure and Cloud. "Avicena has a highly differentiated technology addressing one of the main challenges in modern computer architecture. The technology offered by Avicena meets the needs for scaling future HPC and cloud compute networks and covers applications in conventional datacenter and 5G cellular networking."

NVIDIA's next generation of graphics cards, codenamed RTX 40 series, Ada Lovelace, is expected to arrive sometime in October. However, the latest information from the YouTube channel "Moore's Law Is Dead" suggests that NVIDIA could postpone the arrival of the new GPU generation to December. Why, you might be wondering? The report claims that the current GPU market is flooded with used GeForce RTX 30 series GPUs. Thus, NVIDIA could postpone the availability of the latest GPUs to keep the demand high and ensure that the market is searching for additional graphics cards.

Retailers are experiencing smaller demand as the used GPU market is full of devices used for cryptocurrency mining, and the recent crypto crash has helped the situation. What we could see is NVIDIA announcing Ada Lovelace GPUs in October, with availability arriving later in December. Of course, these are just the current industry rumors, and we are yet to see how the market and NVIDIA will respond.

LIAN LI Industrial Co. Ltd., a leading manufacturer of aluminium chassis and PC accessories, premieres the LIAN LI 2022 DIGITAL EXPO 2.0 at 9 am EST on YouTube (here). The 2-part video series reveals new prototypes of 3 cases, 4 fans, and an All-In-One liquid cooler. The new cases include the LANCOOL 216, DAN Cases A3 m-ATX, and the highly anticipated O11D EVO XL. LIAN LI also presents the next generation UNI FANs with SL120 V2, SL140 V2, AL120 V2, and AL140, including an update of the UNI FAN P28. And the show closes with a new 100% LIAN LI design All-In-One liquid cooler.

The LANCOOL 216 is a mid-tower with excellent cooling and is configurable for air or All-In-One liquid cooling. The rotatable I/O shield enables Upper Motherboard or Air Cooling mode, where the motherboard can be installed higher for extra room for vertical GPUs and larger CPU tower coolers. By rotating the I/O shield 180 degrees, it enables the Lower Motherboard or All-In-One Liquid Cooling mode to support thicker radiators and lengths of up to 360 mm. To maximize the air intake and exhaust, an external rear fan 120 mm bracket can be installed below the GPU IO ports, and a cover plate can be added on the top to seal off unnecessary openings to reduce air pressure loss.

ASRock has released UEFI/BIOS updates for at least 47 of its 600-series chipset based motherboards, which will add support for the next generation of CPUs from Intel. The new CPUs are of course Intel's 13th gen Core CPU's, codenamed Raptor Lake, even though ASRock doesn't specifically mention this anywhere in the text on its portal site. We're expecting to see similar announcements from the other motherboard makers in due time. ASRock doesn't go into any kind of details as to which CPUs are supported and the company doesn't appear to have updated its CPU support lists yet, which is a shame, but not entirely unexpected, since the Raptor Lake CPUs aren't expected to launch until later this year.

However, ASRock has implemented what the company calls Auto Driver Installer or ADI in this UEFI/BIOS update for the boards and this is likely to be an unpopular addition, as it means drivers will be automatically be downloaded and installed if the system is connected to the internet. Presumably there will be an option to disable this feature, but it appears to be enabled by default, which has proven to be an unpopular option when other companies have done it. Admittedly it could be a handy feature during a new build or OS reinstall, but it's also a potential attack vector for malware.

Intel Labs announces a significant advancement in its integrated photonics research - the next frontier in increasing communication bandwidth between compute silicon in data centers and across networks. The latest research features industry-leading advancements in multiwavelength integrated optics, including the demonstration of an eight-wavelength distributed feedback (DFB) laser array that is fully integrated on a silicon wafer and delivers excellent output power uniformity of +/- 0.25 decibel (dB) and wavelength spacing uniformity of ±6.5% that exceed industry specifications.

"This new research demonstrates that it's possible to achieve well-matched output power with uniform and densely spaced wavelengths. Most importantly, this can be done using existing manufacturing and process controls in Intel's fabs, thereby ensuring a clear path to volume production of the next-generation co-packaged optics and optical compute interconnect at scale." -Haisheng Rong, senior principal engineer at Intel Labs

Intel has allowed the media to get a closer look at the next generation of silicon that will power millions of systems in years to come during its private Vision event. PC Watch, a Japanese tech media, managed to get some shots of the upcoming Meteor Lake, Sapphire Rapids, and Ponte Vecchio processors. Starting with Meteor Lake, Intel has displayed two packages for this processor family. The first one is the ultra-compact, high-density UP9 package used for highly compact mobile systems, and it is made out of silicon with minimal packaging to save space. The second one is a traditional design with more oversized packaging, designed for typical laptop/notebook configurations.

E Ink, the originator, pioneer, and global commercial leader in digital paper technology, today announced the launch of E Ink Gallery 3, a next generation of color ePaper for the eReader and eNote markets. E Ink Gallery 3 is based on the E Ink ACeP Advanced Color ePaper platform. In this platform, a full-color gamut is achieved through a four particle ink system: cyan, magenta, yellow and white, which allows a full color gamut at each pixel.

In Gallery 3, the black and white update time has been improved to 350 milliseconds (ms), the fast color mode is 500 ms, standard color mode is 750-1000 ms and best color is achieved at 1500 ms. This is a substantial improvement over the first generation of E Ink Gallery, which had a black and white update time of two seconds and color updates of ten seconds. In addition, Gallery 3 will have an improved resolution of 300 pixels per inch (ppi) versus the earlier 150ppi and an operating temperature of 0-50 degrees Celsius, on par with black and white eReaders.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. Renesas, the industry's undisputed leader in timing solutions, is offering 11 new clock buffers and 4 new multiplexers. The new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas' low-jitter 9SQ440, 9FGV1002 and 9FGV1006 clock generators to offer customers a complete PCIe Gen6 timing solution for data center/cloud computing, networking and high-speed industrial applications. The PCIe Gen6 standard supports extremely high data rates of 64 GT/s while requiring very low clock jitter performance of less than 100fs RMS. Renesas' new RC190xx clock buffers and RC192xx multiplexers have PCIe Gen6 additive jitter specs of only 4fs RMS, making them virtually noiseless, and thereby future-proofing customer designs for the next generation of industry standards.

"PCIe Gen6 timing will be at the heart of new equipment in data centers, high-speed networking and other applications," said Zaher Baidas, Vice President of the Timing Products Division at Renesas. "As we have done for preceding generations, Renesas is providing customers with the first timing solution to enable these new, higher-performance systems. Our customers know that we have the technical expertise and market knowledge to ensure that their products will be able to meet future requirements as well." "By delivering the first discrete timing solution for PCIe Gen6, Renesas is enabling customers to develop the next-generation of high-performance systems," said Rich Wawrzyniak, Principal Analyst for Semico Research. "It will be interesting to see the innovative implementations that result from this new capability, especially when considering how solutions for the emerging Chiplet market are starting to evolve, with the need for increasing speed and bandwidth as an underlying constant."

MediaTek has announced it is the first TV SoC vendor to support Dolby Vision IQ with Precision Detail. Precision Detail is a new innovative feature introduced for TVs with Dolby Vision IQ, which will be supported in MediaTek's Pentonic series for 8K and 4K smart TVs. In addition, the Pentonic series will enable TV manufacturers to support features designed for gaming in Dolby Vision along with other advanced capabilities. MediaTek and Dolby collaborated on the implementation of these technologies, which will be available starting in 2H 2022 for TV OEMs to begin adopting.

Joining Dolby's suite of Advanced Imaging technologies available through Dolby Vision IQ, Precision Detail unlocks more from Dolby Vision content by revealing incredible detail in both bright and dark areas. With added texture and depth, images take on a new dimension with astonishing crispness on 8K and 4K smart TVs. In addition to Precision Detail, MediaTek's Intelligent View technology paired with Dolby's latest advancements in imaging technology can process multiple Dolby Vision streams simultaneously. Consumers can now watch different media sources at the same time in Dolby Vision in multiple windows, all in stunning detail.

This morning, Maybell Quantum unveiled the Icebox, a cryogenic platform to power the next generation of quantum computers. Maybell's Icebox solves several pressing challenges for scaling quantum. Quantum computing is a reinvention of computing. It will perform calculations in seconds that would require billions of years for today's most powerful supercomputers, with profound implications for everything from logistics and agriculture to medicine and climate change. But achieving reliable quantum computation requires qubits - quantum computers' fundamental building block - be in a state where they can be finely manipulated and communicated with through minute signals. Maybell's approach to these challenges has attracted contracts from DARPA, NSIC/DIU, and leading research universities, and is now available to the quantum computing industry.

"Controlling quantum devices at room-temperature is like playing a sonata in a hurricane," explains Corban Tillemann-Dick, Maybell's CEO. "Cooling devices to a few thousandths of a degree above absolute zero, nature's 'speed limit for cold,' calms this chaos to near 'quantum silence' so quantum operations are controllable." Traditional quantum cryogenic systems, however, are tangles of tubes and wires that cover hundreds of square feet and often require months to set up and PhDs to operate. Moreover, to increase capacity, these systems typically become even larger and more complex.

BizLink, a global leader in interconnect solutions, is proud to announce the release of its DP80 Enhanced mDP cable in the market, which is the world's first VESA certified DP80 cable. The new DP80 Enhanced mDP cable features high transmission capacities with the new data rates of UHBR10 (10 Gbps), UHBR13.5 (13.5 Gbps), and UHBR20 (20 Gbps). BizLink has worked with VESA (Video Electronics Standards Association) on developing the next generation of Enhanced full-size DP/mDP cables and connectors since 2019 to break the bandwidth limit of the legacy DP/mDP cables and connectors.

With the latest DP technology, the DP80 Enhanced mDP cable supports the new data rates of UHBR10, UHBR13.5, and UHBR20. The cable has a maximum data throughput of up to 80 Gbps, which is designed for the connections of the most advanced visual display applications and systems. It supports a wider bandwidth in video streaming for higher resolution and quality of videos and is backward compatible with existing DisplayPort devices. The new DP80 standard creates an exciting advantage for a superior connection over the now-aged cables. As a premier supplier of high-speed interconnect solutions for client peripherals, BizLink also offers leading-edge DP80 Enhanced mDP connectors, Enhanced full-size DP cables and connectors, and other latest DP connectivity applications.

Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced the establishment of an industry consortium to promote an open die-to-die interconnect standard called Universal Chiplet Interconnect Express (UCIe). Building on its work on the open Advanced Interface Bus (AIB), Intel developed the UCIe standard and donated it to the group of founding members as an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

"Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel's IDM 2.0 strategy," said Sandra Rivera, executive vice president and general manager of the Datacenter and Artificial Intelligence Group at Intel. "Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore's Law."

Qualcomm Technologies, Inc., today announced the world's most advanced Wi-Fi + Bluetooth connectivity system in the industry: FastConnect 7800. This advanced client connectivity solution marries the power of high-speed, ultra-low latency Wi-Fi with the latest Wi-Fi 7 specification and deploys an array of Bluetooth audio advancements that raise the bar on consumer expectations for sound quality. FastConnect 7800 leads the industry with the introduction of High Band Simultaneous (HBS) Multi-Link technology - the premium capability for Wi-Fi 7 networks that unlocks the vast potential of multiple 5 GHz and 6 GHz connections to deliver the highest throughput and lowest sustained latency, while reserving high-traffic 2.4 GHz spectrum for Bluetooth and lower-bandwidth Wi-Fi.

"With FastConnect 7800, Qualcomm Technologies reasserts its leadership by defining the future of wireless connectivity. Introducing the first Wi-Fi 7 solution to the industry might be enough for some, but with the introduction of HBS Multi-Link we take performance to the next level, shattering expectations for speed and latency," said Dino Bekis, vice president and general manager, Mobile Compute and Connectivity, Qualcomm Technologies, Inc. "Coupled with up to 50% lower power consumption and Intelligent Dual Bluetooth with advanced Snapdragon Sound capabilities, FastConnect 7800 is simply the best client connectivity offering in the industry."

In an interview with IEEE Spectrum Dr. Y.J. Mii, Senior Vice President of Research and Development at TSMC, said that he believes that we're not going to see an end to the chip shortage until the next generation of fabs that are currently under construction, or will commence soon, come online in two to three years. Interestingly, Mii is apparently not putting the blame squarely at the pandemic as so many others have for the components shortage, but rather points towards the fact that chips are being used in just about every kind of product these days. This has in turn led to much higher demands for semiconductors, without the infrastructure to manufacture enough of them being in place.

He also believes the industry as a whole missed the fact that the demand for a wide range of semiconductors was growing as quickly as it has been over the past few years. On the upside, it seems like the semiconductor manufacturers have understood what's going on and they're investing heavily in making sure that they can meet demand, both in the near term and longer term. Interestingly, he also mentions how hard it is, even for a company like TSMC, to progress their nodes today. He's quoted saying "Before, we could achieve the next-generation node by fine-tuning the process, but now for every generation we must find new ways in terms of transistor architecture, materials, processes, and tools. In the past, it's pretty much been a major optical shrink, but that's no longer a simple trick." It looks like the semiconductor manufacturers are going to have to come up with some new, innovative ways to be able to keep making better and faster semiconductors in the not too distant future.

The recent NVIDIA data-leak springs up information on various upcoming graphics parts. Besides "Ada Lovelace," "Hopper," we come across a new codename, "Blackwell." It turns out that NVIDIA is splitting the the graphics and compute architecture naming with the next generation, not unlike what AMD did, with its RDNA and CDNA series. The current "Ampere" architecture is being used both for compute and graphics, with the streaming multiprocessor for the two being slightly different—the compute "Ampere" has more FP64 and Tensor components, while the graphics "Ampere" does away with these in favor of RT cores and graphics-relevant components.

The graphics architecture to succeed GeForce "Ampere" will be GeForce "Ada Lovelace." GPUs in this series are identified in the leaked code as "AD102," "AD103," "AD104," "AD106," "AD107," and "AD10B," succeeding a similar numbering for parts with the "A" (GeForce Ampere) series. The compute architecture succeeding "Ampere" will be codenamed "Hopper." with parts in the series being codenamed "GH100" and "GH202." Another compute or datacenter architecture is "Blackwell," with parts being codenamed "GB100" and "GB102." From all accounts, NVIDIA is planning to launch the GeForce 40-series "Ada" graphics card lineup in the second half of 2022. The company is in need of a similar refresh for its compute product lineup, and could debut "Hopper" either toward the end of 2022 or next year. "Blackwell" could follow "Hopper."

Intel's Alder Lake CPUs started the wave of hybrid designs spanning the consumer sector with high-performance P-cores and high-efficiency E-cores combined to make a mixed design work. And it seems like the replacement for it is already in progress, as the next-generation Intel "Raptor Lake" processors are continuing enablement in the Linux kernel. This next-generation Raptor Lake design will arrive towards the end of this year, and the software ecosystem is already preparing for its arrival. According to the report from Phoronix, audio support for Intel Raptor Lake processors has been added to the Linux kernel 5.18.

As the report points out, the enablement work is no different since days of Skylake, where adding new IDs to the driver gets the job done. However, what is interesting is that Raptor Lake is slowly getting the entire software ecosystem support functional. This shows with Linux kernel 5.17, where Raptor Lake-S Gen 12-based graphics card received initial software support. As the software matures, full support for Raptor Lake will come, especially as we enter the later months of 2022, when the next generation is supposed to arrive.

The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched 3 new research and innovation projects. The projects aim to bring the EU and its partners in the EuroHPC JU closer to developing independent microprocessor and HPC technology and advance a sovereign European HPC ecosystem. The European Processor Initiative (EPI SGA2), The European PILOT and the European Pilot for Exascale (EUPEX) are interlinked projects and an important milestone towards a more autonomous European supply chain for digital technologies and specifically HPC.

With joint investments of €140 million from the European Union (EU) and the EuroHPC JU Participating States, the three projects will carry out research and innovation activities to contribute to the overarching goal of securing European autonomy and sovereignty in HPC components and technologies, especially in anticipation of the European exascale supercomputers.

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

Tachyum today announced that it was selected by the Slovak Republic to participate in the latest submission for the Important Projects of Common European Interest (IPCEI), to develop Prodigy 2 for HPC/AI. Prodigy 2 for HPC/AI will enable 1 AI Zettaflop and more than 10 DP Exaflops computers to support superhuman brain-scale computing by 2024 for under €1B. As part of this selection, Tachyum could receive a 49 million Euro grant to accelerate a second-generation of its Tachyum Prodigy processor for HPC/AI in a 3-nanometer process.

The IPCEI program can make a very important contribution to sustainable economic growth, jobs, competitiveness and resilience for industry and the economy in the European Union. IPCEI will strengthen the EU's open strategic autonomy by enabling breakthrough innovation and infrastructure projects through cross-border cooperation and with positive spill-over effects on the internal market and society as a whole.

AMD's Ryzen 7000 series of desktop processors based on the novel Zen 4 core architecture are scheduled to arrive in the second half of 2022. While we are not sure just how big the architectural differences will be going from Zen 3 (with or without 3D V-cache) to the new Zen 4 core, we have some leaked information that confirms the existence of two SKUs that reveal additional details about the processor configuration. In the MilkyWay@Home project, aiming to create a model of the Milky Way galaxy by utilizing countless PCs across the globe, we found two next-generation Ryzen 7000 SKUs. The MilkyWay@Home project isn't a benchmark. However, it is a valuable reference where the next generation processors appeared.

First in line is the 100-000000666-21_N CPU, a codename for an eight-core, sixteen-threaded design. This model should correspond to the AMD Ryzen 7 7800X CPU, a successor to the Ryzen 7 5800X model. Next in line is the 100-000000665-21_N CPU with 16 cores and 32 threads, a successor to the Ryzen 9 5950X named Ryzen 9 7950X. One important thing to note is that these new CPUs feature different level two (L2) cache configurations. With the previous generation 5000 series "Vermeer" processors, the L2 cache was locked at 512 KB per core. However, according to today's leak, the upgraded Zen 4 IP will bring 1024 KB of L2 cache per core, doubling the cache size at one of the fastest levels.

Razer, the world's leading lifestyle brand for gamers, today unveiled its vision for the future of gaming and home computing with Project Sophia, the world's first true gaming desk concept, and the Enki Pro HyperSense, an advanced gaming chair with built-in high-fidelity haptics. Created by Razer's visionary R&D department, both Project Sophia and the Enki Pro HyperSense introduce new innovative solutions to level up any home setup.

With working from home more widespread than ever, many people find it a challenge to configure their set-ups for the multiple different uses required of their systems throughout the day. From being a pure office productivity set-up through to a gaming, streaming or editing suite, each use has a host of extra peripherals and devices to enhance and improve that experience.

It's one of the most common and frustrating problems - having multiple gamers under one roof competing for access to their favorite titles and totally crushing Wi-Fi bandwidth. Or is it??? We're always thinking ahead to the future - near and far - and thinking about the ways we can provide the best gaming experiences out there. Which is why we're incredibly stoked about potentially solving one of the biggest challenges in PC gaming and changing the game completely: how to simultaneously allow players in a household to easily access their full game library and play on any device, even if they want to change screens during gameplay. A tall order, but Alienware is hurtling towards a solution. We call it Concept Nyx.

An R&D project from our consortium of wizards also known as our Experience Innovation Group (EIG), The Concept Nyx solution comes in the wake of other audacious Alienware initiatives that have broken boundaries and elevated the PC gaming experience: from creating our thinnest gaming laptops to date with the Alienware X Series to bold gaming ideas like Concept UFO. Now we've done it again, literally breaking the mold of the PC gaming experience with an eye toward the future.

The National Renewable Energy Laboratory (NREL) has selected Hewlett Packard Enterprise (HPE) to build its third-generation, high performance computing (HPC) system, called Kestrel. Named for a falcon with keen eyesight and intelligence, Kestrel's moniker is apropos for its mission—to rapidly advance the U.S. Department of Energy's (DOE's) energy research and development (R&D) efforts to deliver transformative energy solutions to the entire United States.

Installation of the new system will begin in the fall of 2022 in NREL's Energy Systems Integration Facility (ESIF) data center. Kestrel will complement the laboratory's current supercomputer, Eagle, during the transition. When completed—in early 2023—Kestrel will accelerate energy efficiency and renewable energy research at a pace and scale more than five times greater than Eagle, with approximately 44 petaflops of computing power.