ECS Industrial Computer Co., Ltd., also known as ECSIPC, proudly unveils its latest generation of mini PCs for quad-display industrial applications, the LIVA Z5 series, which includes the LIVA Z5 Plus, LIVA Z5E Plus, and LIVA Z5F Plus. Committed to providing industry-specific value solutions, ECSIPC focuses on developing niche products and solutions for vertical industry applications. ECSIPC has achieved success in various application areas, including educational electronic whiteboards in Europe and the US, airport real-time flight systems in India, image projection for Japan's Shinkansen bullet trains, and electronic menu and POS systems for KFC in South America, while also exploring applications in vending machines and digital signage.

The newly launched LIVA Z5 series is powered by Intel 13th and 14th generation Core processors, delivering significant performance improvements with up to 10 cores capable of efficiently handling various demanding tasks. The series has Wi-Fi 6E speeds up to 9.6 Gbps for enhanced data transmission efficiency, allowing seamless playback of high-quality audiovisual content. Additionally, the multi-storage design accommodates PCIe Gen 4 M.2 NVMe SSDs and a 2.5-inch SSD or HDD, offering greater storage flexibility. The series ensures high-speed data processing in industrial environments with two 2.5G Base-T (2.5G) ports. At the same time, support for vPro and physical TPM significantly enhances the value of industrial applications.

China's homegrown Loongson 3A6000 CPU shows promise but still needs to catch up AMD and Intel's latest offerings in real-world performance. According to benchmarks by Chinese tech reviewer Geekerwan, the 3A6000 has instructions per clock (IPC) on par with AMD's Zen 4 architecture and Intel's Raptor Lake. Using the SPEC CPU 2017 processor benchmark, Geekerwan has clocked all the CPUs at 2.5 GHs to compare the raw benchmark results to Zen 4 and Intel's Raptor Lake (Raptor Cove) processors. As a result, the Loongson 3A6000 seemingly matches the latest designs by AMD and Intel in integer results, with integer IPC measured at 4.8, while Zen 4 and Raptor Cove have 5.0 and 4.9, respectively. The floating point performance is still lagging behind a lot, though. This demonstrates that Loongson's CPU design can catching up to global leaders, but still needs further development, especially for floating point arithmetic.

However, the 3A6000 is held back by low clock speeds and limited core counts. With a maximum boost speed of just 2.5 GHz across four CPU cores, the 3A6000 cannot compete with flagship chips like AMD's 16-core Ryzen 9 7950X running at 5.7 GHz. While the 3A6000's IPC is impressive, its raw computing power is a fraction of that of leading x86 CPUs. Loongson must improve manufacturing process technology to increase clock speeds, core counts, and cache size. The 3A6000's strengths highlight Loongson's ambitions: an in-house LoongArch ISA design fabricated on 12 nm achieves competitive IPC to state-of-the-art x86 chips built on more advanced TSMC 5 nm and Intel 7 nm nodes. This shows the potential behind Loongson's engineering. Reports suggest that next-generation Loongson 3A7000 CPUs will use SMIC 7 nm, allowing higher clocks and more cores to better harness the architecture's potential. So, we expect the next generation to set a bar for China's homegrown CPU performance.

DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel Core Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.

According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies.

AMD is looking to debut its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture some time around May-June 2024, according to High Yield YT, a reliable source with AMD leaks. These processors will be built in the existing Socket AM5 package, and be compatible with all existing AMD 600 series chipset motherboards. It remains to be seen if AMD debuts a new line of motherboard chipsets. Almost all Socket AM5 motherboards come with the USB BIOS flashback feature, which means motherboards from even the earliest production batches that are in the retail channel, should be able to easily support the new processors.

AMD is giving its next-gen desktop processors the Ryzen 9000 series processor model numbering, as it used the Ryzen 8000 series for its recently announced Socket AM5 desktop APUs based on the "Hawk Point" monolithic silicon. "Granite Ridge" will be a chiplet-based processor, much like the Ryzen 7000 series "Raphael." In fact, it will even retain the same 6 nm client I/O die (cIOD) as "Raphael," with some possible revisions made to increase its native DDR5 memory frequency (up from the current DDR5-5200), and improve its memory overclocking capabilities. It's being reported that DDR5-6400 could be the new "sweetspot" memory speed for these processors, up from the current DDR5-6000.

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI. Designed for digital signage and self-service kiosks in the smart retail industry, or in large vehicles fitted with display-board advertising, this unique mini-PC offers up to 4 display outputs that can showcase a variety of rich and vibrant content. The highly flexible solution can display 4 different screens, mirror all screens the same, split one image across 4 displays, or splits of 3-and-1 or 2-and-2, affording maximum flexibility to cover wide areas of retail spaces that can easily plan and push a multitude of content to inform and advertise in attractive, dynamic, high-resolution visuals, all from a single device. The LIVA X3A mini-PC is ready to go right out the box, along with ECSIPC's own content management software to streamline product deployment.

Powered by a highly efficient Rockchip octa-core featuring a 4x Arm Cortex-A76 and 4x Arm Cortex-A55 processors in this Arm-based CPU, the highly efficient, fanless design ensures a sustainable solution that accommodates many use-cases. In addition, 8 GB of fast LPDDR5 and 64 GB of internal storage is preinstalled, while dual GbE, Wi-Fi 6 and Bluetooth 5.3 provide a variety of internet connectivity built-in, which can be further expanded with optional PoE and 4G LTE to meet specific deployment requirements.

Intel Core Ultra "Meteor Lake" mobile processor may be the the company's most efficient, but isn't a generation ahead of the 13th Gen Core "Raptor Lake" mobile processors in terms of performance. This isn't just because it has an overall lower CPU core count in its H-segment of SKUs, but also because its performance cores (P-cores) actually post a generational reduction in IPC, as David Huang in his blog testing contemporary mobile processors found out, through a series of single-threaded benchmarks. Huang did a SPECint 2017 performance comparison of Intel's Core Ultra 7 155H, and Core i7-13700H "Raptor Lake," with AMD Ryzen 7 7840HS, 7840H "Phoenix, Zen 4," and Apple M3 Pro and M2 Pro.

In his testing, the 155H, an H-segment processor, was found roughly matching the "Zen 4" based 7840U and 7840HS; while the Core i7-13700H was ahead of the three. Apple's M2 Pro and M3 Pro are a league ahead of all the other chips in terms of IPC. To determine IPC, Huang tested all processors with only one core, and their default clock speeds, and divided SPECint 2017 scores upon average clock speed of the loaded core logged during the course of the benchmark. Its worth noting here that the i7-13000H notebook was using dual-channel (4 sub-channel) DDR5 memory, while the Core Ultra 7 155H notebook was using LPDDR5, however Huang remarks that this shouldn't affect his conclusion that there has been an IPC regression between "Raptor Lake" and "Meteor Lake."

MemryX Inc. is announcing the availability of production level silicon of its cutting-edge AI Accelerator (MX3). MemryX is a pioneering startup specializing in accelerating artificial intelligence (AI) processing for edge devices. In less than 30 days after receiving production silicon from TSMC, MemryX will publicly showcase the ability to efficiently run hundreds of unaltered AI models at the 2024 Consumer Electronics Show (CES) in Las Vegas from Jan 9 through Jan 12.

The Chinese chipmaker Loongson has launched its newest desktop processors, the 4-core, 8-thread 3A6000 series, based on the company's LoongArch microarchitecture. We have previously reported that the company wants to match Intel's "Willow Cove" and AMD's Zen 3 instruction per clock (IPC) levels with its 3A6000 CPU series, and today we have the first preview of the performance. Powered by the LA664 cores, 3A6000 is built on a 14/12 nm manufacturing process, with clock speeds going from 2.0 to 2.5 GHz and power consumption of up to 50 Watts. It features 256 KB of L2 cache and 16 MB of L3 cache in total.

While several hardware partners are announcing new Loongson-powered solutions, ASUS China's "Uncle Tony" managed to get his hands on one of them and overclocker the CPU to 2.63 GHz on air cooling. In overclocking tests using liquid nitrogen cooling, a 3A6000 processor reached 3.0 GHz, though there are indications that there is still overhead. In standard out-of-the-box configuration, the 3A6000 performs similarly to Intel's Core i3-10100 four-core CPU, an achievement for Loongson but still behind Intel's latest offerings that clock nearly twice as high. This rapid development of Loongson IP has led to a massive performance increase, matching the IPC of modern CPUs. We are still left to see more information about these 3A6000 series SKUs; however, early benchmarks suggest a significant improvement. You can see the CPU benchmarks below, which include UnixBench and SPEC CPU 2006.

AMD today launched its first client processors that feature the compact "Zen 4c" CPU cores, with the Ryzen 5 7545U and Ryzen 3 7440U mobile processors for thin-and-light notebooks. The "Zen 4c" CPU core is a compacted version of the "Zen 4" core without the subtraction of any hardware components, but rather a high density arrangement of them on the 4 nm silicon. A "Zen 4c" core is around 35% smaller in area on the die than a regular "Zen 4" core. Since none of its components is removed, the core features an identical IPC (single thread performance) to "Zen 4," as well as an identical ISA (instruction set). "Zen 4c" also supports SMT or 2 threads per core. The trade-off here is that "Zen 4c" cores are generally clocked lower than "Zen 4" cores, as they can operate at lower core voltages. This doesn't, however, make the "Zen 4c" comparable to an E-core by Intel's definition, these cores are still part of the same CPU clock speed band as the "Zen 4" cores, at least in the processors that's being launched today.

The Ryzen 5 7545U and Ryzen 3 7440U mobile processors formally debut the new 4 nm "Phoenix 2" monolithic silicon. This chip is AMD's first hybrid processor, in that it has a mixture of two regular "Zen 4" cores, and four compact "Zen 4c" cores. The six cores share an impressive 16 MB of L3 cache. All six cores feature 1 MB of dedicated L2 cache. There is no complex hardware-based scheduler involved, but a software based solution that's deployed by AMD's Chipset Software, which tells the Windows scheduler to see the "Zen 4" cores as UEFI CPPC "preferred cores," and prioritize traffic to them, as they can hold on to higher boost frequency bins. The "Phoenix 2" silicon inherits much of the on-die power-management feature-set from the "Phoenix" and "Rembrandt" chips, and so are capable of a high degree of power savings with underutilized CPU cores and iGPU compute units.

AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

The 4 nm "Phoenix 2" monolithic APU silicon powering the lower end of AMD's Ryzen 7040-series mobile processors, could very well be the company's first hybrid core processor, even though the company doesn't advertise it as such. We first caught whiff of "Phoenix 2" back in July, when it was described as being a physically smaller chip than the regular "Phoenix." It was known to have just 6 CPU cores, and a smaller iGPU with 4 RDNA3 compute units; in comparison to the 8 CPU cores and 12 compute units of the "Phoenix" silicon. At the time a lack of 2 CPU cores and 8 CUs were known to be behind the significant reduction in die size from 178 mm² to 137 mm², but it turns out that there's a lot more to "Phoenix 2."

A die shot of "Phoenix 2" emerged on Chinese social media platform QQ, which reveals two distinct kinds of CPU cores. There are six cores in all, but two of them appear larger than the other four. The obvious inference here, is that the larger cores are "Zen 4," and the smaller ones are the compacted "Zen 4c." The "Zen 4c" core has the same core machinery as "Zen 4," albeit it is re-arranged to favor lower area on the die. The trade-off here is that the "Zen 4c" core operates at lower voltages and lower clock-speeds than the regular "Zen 4" cores. At the same clock speeds, both kinds of cores have an identical IPC. The two also have an identical ISA, so any software threads migrating between the cores will not encounter runtime errors. Unlike Intel Thread Director, AMD can use a less sophisticated software-based solution to ensure that the right kind of workload is allocated to the right kind of cores, and prevent undesirable migration between the two kinds of cores. Unlike the hardware-based Thread Director, AMD's solution can be continually updated.

ASRock Industrial released iBOX fanless industrial PCs (IPCs) powered by 13th Gen Intel Core "Raptor Lake" processors. These are completely fanless, and are powered by mobile Intel Core "Raptor Lake" processors in the 15 W to 28 W power class. Their bodies are made of extruded aluminium ridges, which double up as heatsinks for the SoC. All the industrial connectivity essentials are covered, including dual 2.5 GbE wired LAN, provision for WLAN, a handful USB 3.x and USB 2.0 ports, RS232 COM, and some models even feature GPIO. Processor models on offer include the Core i3-1315UE, i5-1345UE, and i7-1375UE. Depending on the processor model and other features, these iBOX IPCs are priced anywhere between $800 to $1,300.

AMD's hotly anticipated gaming CPU, the Ryzen 7 7800X3D "Zen 4," which launches early-April, is beginning to show up in online benchmark databases. The 8-core/16-thread processor has 64 MB of 3D Vertical Cache, which takes its L3 cache size up to an impressive 96 MB, and total cache up to 104 MB. The chip is showing up on the SiSoftware SANDRA online database, where it was tested on an MSI MEG X670E Ace motherboard. It obtained a score of 395.07 GOPS, with 527.56 GIPS dhrystone INT, 552.04 GIPS dhrystone long; 316 GFLOP/s whetstone single-precision floating point, and 264.71 GFLOP/s whetstone double-precision floating point.

The score puts it at roughly 37% faster than the Ryzen 7 5800X3D "Zen 3," although it's somewhere between its other 8-core "Zen 4" compatriots, the 7700X and 7700. The 7800X3D, much like its predecessor, is expected to perform either on-par or slightly worse than the 7700X in frequency/IPC dependent "lightweight" tasks, but zoom past in cache-favoring workloads such as gaming. Its predecessor, the 5800X3D, beat the fastest Intel processor of its time, the i9-12900K, so the 7800X3D has its task cut out—to beat the i9-13900K in gaming.

Intel's next-generation Arc "Battlemage" GPU is expected to numerically-double its shader counts, according to a report by RedGamingTech. The largest GPU from the Arc "Battlemage" series, the "BMG-G10," aims to power SKUs that compete in the performance segment. The chip is expected to be built on a TSMC 4 nm-class EUV node, similar to NVIDIA's GeForce "Ada" GPUs, and have a die-size similar to that of the "AD103" silicon powering the GeForce RTX 4080.

Among the juiciest bits from this report are that the top "Battlemage" chip will see its Xe Core count doubled to 64, up from 32 on the top "Alchemist" part. This would see its execution unit (EU) count doubled to 1,024, and unified shader counts at 8,192. Intel is expected to give the chip clock speeds in excess of 3.00 GHz. The Xe Cores themselves could see several updates, including IPC uplifts, and support for new math formats. The memory sub-system is expected to see an overhaul, with a large 48 MB on-die L2 cache. While the memory bus is unchanged at 256-bit wide, the memory speed could see a significant increase up from the 16-17.5 Gbps on the Arc A770. As for when customers can actually expect products, the RedGamingTech report puts launch of the Arc "Battlemage" series at no sooner than Q2-2024. The company is expected to launch refreshed "Alchemist+" GPUs in 2023.

MSI is a top player in the ICT industry. With over 35 years of experience in R&D. By introducing AI systems, IoT, automation, and remote operations. Leveraging its many years of experience in ODM/OEM and its production capabilities, MSI delivers products that apply to smart transportation, smart cities, innovative automation, digital signage and intelligent retailing, offering top-quality, integrated solutions that best suit client needs. MSI commercial monitors offer crisp visuals and a range of features to enhance the computing experience.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance, providing reliability and high durability with lower power consumption, and actively deploy in multiple applications such as AMR-AI-PJ-UVGI Robot, which was verified by Texcell/France to effectively inactivate the new SARS-COV2 virus within seconds.

The BeagleBoard.org Foundation today announces the global availability of BeaglePlay, the most adaptable open-source performance platform available. Built on our proven open source Linux approach, BeaglePlay has a feature set that includes built-in wired and wireless connectivity and ability to connect to a wide selection of sensor and prototyping systems with thousands of options, as well as interfaces and processing performance to support them.

Leveraging the Texas Instruments AM625 processor with quad 64-bit Arm Cortex -A53 cores, low-latency microcontroller subsystems, a dedicated Texas Instruments SimpleLink CC1352P7 sub-1 GHz and 2.4-GHz wireless MCU, and a Texas Instruments WiLink WL1807MOD Wi-Fi module, new and experienced users can use a wide variety of application libraries and examples from Linux, Zephyr, MicroPython and numerous other open source frameworks to add an endless array of sensors, actuators, indicators and new connectivity options.

Late last year, it was reported that Intel is skipping its upcoming "Meteor Lake" microarchitecture for the desktop platform, giving it a mobile-platform debut in late-2023, with "Arrow Lake" following on in 2024, which would address both platforms. In the interim, Intel was expected to release a "Raptor Lake Refresh" architecture for desktop in 2023. It turns out now, that both the "Raptor Lake Refresh" and "Meteor Lake" architectures are coming to desktop—we just don't know when.

Apparently, Intel will brazen it out against AMD with a maximum CPU core-count of just 6 performance cores and 16 efficiency cores possible for "Meteor Lake." It's just that both the P-cores and a E-cores get an IPC uplift with "Meteor Lake." The processor features up to six "Redwood Cove" P-cores with an IPC uplift over the current "Raptor Cove" cores; and introduce the new "Crestmont" E-cores. A lot will depend on the IPC uplift of the latter. Leaf_hobby, a reliable source with Intel leaks on social media, has some interesting details on the I/O capabilities of "Meteor Lake" on the desktop platform.

Intel in its Q4-2022 Financial release call reiterated that its Core "Meteor Lake" processor remains on course for a 2H-2023 launch. The company slide does not mention the client form-factor the architecture targets, and there are still rumors of a "Raptor Lake Refresh" desktop processor lineup for 2H, which would mean that "Meteor Lake" will debut as a high-performance mobile processor architecture attempting to dominate the 7 W, 15 W, 28 W, and 35 W device market-segments, with its 6P+16E CPU that introduce IPC increases on both the P-cores and E-cores; and a powerful new iGPU. The slide also mentions that its succeeding "Lunar Lake" architecture is on course for 2024.

"Meteor Lake" is Intel's first chiplet-based MCM processor, in which the key components of the processor are built on various silicon fabrication nodes, based on their need for such a cutting-edge node; such that the cost-optimization upholds the economic aspect of Moore's Law. The compute tile, the die that has the CPU cores, features a 6P+16E setup, with six "Redwood Cove" P-cores, and sixteen "Crestmont" E-cores. At this point it's not known if "Crestmont" cores are arranged in clusters of 4 cores, each. The graphics tile features a powerful iGPU based on the newer Xe-LPG graphics architecture that meets full DirectX 12 Ultimate feature-set. The processor's I/O is expected to support even faster DDR5/LPDDR5 memory speeds, and feature PCIe Gen 5.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance products, providing the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.

It can be widely used in harsh industrial environments, and provide stable computing performance, which can be deployed in industries ranging from the most edge computing to various Embedded platforms such as machine control and multimedia retail and the high-performance edge computing application products are the core of digital transformation, and how to continuously strengthen their capabilities has become more and more important. Power consumption is intended to realize energy-saving and carbon-reducing applications of various edge high-performance computing, and actively deploy in multiple application fields such as autonomous mobile robots (AMR).

An early review of a retail Intel Core i9-13900K "Raptor Lake" 8P+16E processor shows it holding up to the rumored "20-40" claim, the idea that the processor can be up to 20% faster in gaming, and up to 40% faster in productivity, compared to the current i9-12900K. Much of the gaming performance increase is attributed to the higher IPC of the new "Raptor Cove" P-cores, and the much higher boost clocks they run at (up to 5.80 GHz); whereas the multi-threaded performance boost comes from not just the faster P-cores, but a doubling in the E-core count to 16, and improved E-core cache structures, besides higher clock speeds that they run on. For tests that scale across P-cores and E-cores, the i9-13900K behaves like a 24-core/32-thread processor, which is what it is. Among the tests included are CSGO, AIDA64, 7-Zip, WinRAR, Cinebench R15, R20, and R23; and their average, in comparison to the i9-12900K.

With Intel's 13th Gen Core "Raptor Lake" facing stiff competition from AMD's Ryzen 7000 series, and the "Zen 4" series being augmented with 7000X3D series in early-2023, it's becoming a foregone conclusion that Intel will launch a possible "Core i9-13900KS" SKU, which is on its way to being the world's first desktop processor that can boost up to the 6.00 GHz mark. The processor should be able to boost its 8 "Raptor Cove" P-cores to the 6.00 GHz mark, given that the maximum boost frequency of the stock i9-13900K is already rumored to be at 5.70 GHz.

At its Tech Tour event in Israel, Intel confirmed that "Raptor Lake" brings a 15% single-threaded, and 41% multi-threaded performance gain over "Alder Lake." The single-threaded gain is from the higher IPC of the "Raptor Cove" P-core, coupled with its frequency set as high as 5.70 GHz; whereas the multi-threaded performance gain is a combination of increased IPC of the P-cores, and increased frequencies for both the P-cores and E-cores. The E-core clusters get more shared L2 cache, which should improve their performance, too.

AMD Ryzen 5 7600X "Zen 4" 6-core/12-thread processor is shaping up to be a speed-demon for purely gaming builds, with the company claiming higher gaming performance than Intel current flagship Core i9-12900K. A combination of high clock speeds (4.70 GHz nominal, 5.30 GHz max boost), high power limits from 105 W TDP (130 W limit), the "Zen 4" IPC, and the fact that all that power headroom is available to just 6 cores, means that the chip is able to sustain boost frequencies better. But what when Core Performance Boost (CPB) is disabled? VideoCardz scored screenshots of a Cinebench R23 run to answer just that.

With CPB disabled (in the motherboard BIOS), the Ryzen 5 7600X scores 1681 points in the single-threaded test, and 13003 points in the multi-threaded one. With CPB enabled (which is the default setting), the 7600X bags 1920 points single-threaded, and 14767 points multi-threaded, which is a 14% performance increase just from the processor's boosting algo. Disabling CPB is generally seen as a silver-bullet against high temperatures for AMD processors, and even here, we see the chip running under 60°C, and pulling 60.2 W peak, as measured by HWinfo; whereas with CPB enabled, the chip can run as hot as 92.1°C, pulling up to 110 W, pushing clock speeds up to 4.45 GHz.

Intel's upcoming Core i9-13900K "Raptor Lake" flagship desktop processor continues to amaze with its performance lead over the current i9-12900K "Alder Lake," in leaked benchmarks of the processor tested in a number of synthetic benchmarks. The 8P+16E hybrid processor posts a massive 30% lead in multi-threaded performance with Cinebench R23, thanks to higher IPC on the P-cores, the addition of 8 more E-cores, higher clock speeds, and larger caches all around. These gains are also noted with CPU-Z Bench, where the i9-13900K is shown posting a similar 30% lead over the i9-12900K.

In gaming benchmarks, these leads translate into a roughly-10-15 percent gain in frame-rates. Games still aren't too parallelized, Intel Thread Director localizes gaming workloads to the P-cores, which remain 8 in number. And so, the gaming performance gains boil down mainly to the IPC increase of the "Raptor Cove" P-cores, and their higher clock-speeds, compared to the 8 "Golden Cove" P-cores of the i9-12900K. From the looks of it, the i9-13900K will maintain a competitive edge over the upcoming AMD Ryzen 9 7950X mainly because the high IPC of 8 (sufficient) P-cores sees it through in gaming benchmarks, while the zerg-rush of 24 cores clinches the deal in multi-threaded benchmarks that scale across all cores.

A screenshot of an alleged AMD Ryzen 9 7950X "Zen 4" processor surfaced on the web, courtesy of OneRaichu, and this time there's no blur-out with the score field—15645 points. When compared to the alleged CPU-Z Bench scores of the Core i9-13900K "Raptor Lake" from last week, the Intel 8P+16E hybrid processor ends up 7.9% faster than this score, but still a very close second.

The Ryzen 9 7950X ends up a significant 23.47% faster than the leaked score of the Core i7-13700K (8P+8E), and the AMD flagship scores 33.5% faster than the previous-gen Intel flagship Core i9-12900K. While both the i7-13700K and i9-12900K are 8P+8E, the "Raptor Lake" gets ahead with higher IPC for the P-cores, slightly higher clocks, and more cache for the E-core clusters. The 7950X is also 32.12% faster than its predecessor, the Ryzen 9 5950X "Zen 3," and a whopping 58.39% faster than the Core i7-12700K (8P+4E).