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ADATA Showcases Full Industrial Product Range at SPS IPC Drives 2015

ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, is pleased to confirm participation in SPS IPC Drives 2015, Europe's leading industrial PC and automation trade show from Nov. 24 to 26 in Nuremberg, Germany. ADATA is ready to display a wide selection of industrial products that help customers create smart manufacturing with a high degree of connectivity, automation, and control. Smart industry depends on reliable memory and storage to drive it forward, and ADATA is at the forefront of providing these.

To fulfill the latest market demand, ADATA implements large capacities and high performance specifications, with PCIe Gen 3x4 and up to 2TB density for big data process across industrial sectors. In addition, the support of PLP (Power-Loss Protection), advanced LDPC ECC and wide temperature tolerance ensure great reliability, stability, as well as data security. As for those applications requires ultra-fast computing and high power efficiency, ADATA's DDR4 DRAM modules can offer lower energy draw and faster performance compared to DDR3 while adding robust durability.

Intel Skylake Microarchitecture Detailed

The "Skylake" CPU microarchitecture is as much important to Intel as "Sandy Bridge" was, a few years ago. It allows Intel to facilitate mainstream adoption of the DDR4 memory standard (with DDR3 backwards compatibility encouraging cheap upgrades), and gives users IPC increases over older architectures. While users of Core "Haswell" processors and reasonably fast DDR3 memory will find "Skylake" a hard-sell, it should look appealing to users of much older chips, such as "Lynnfield," and perhaps even "Sandy Bridge."

The "Skylake" core is bigger than "Haswell," owing to wider pipelines, prefetcher improvements, more execution units, a bigger front-end with a higher-capacity branch predictor, cache optimizations, and an update to the way HyperThreading works. The instruction window is nearly 1.5x the size of Sandy Bridge, with an out-of-order execution window size of 224 (vs. 168 on Sandy Bridge), load/store sizes of 72/56 (vs. 64/36 on Sandy Bridge), 97 scheduler entries (vs. 56 on Sandy Bridge), and an allocation queue size of 64/thread (vs. 28/thread). The platform of "Skylake" is similar to that of its predecessor, with four notable changes - an integrated camera ISP with the chipset, DDR4 memory support, double the chipset bus bandwidth (64 Gb/s), and eDRAM support on certain CPU SKUs.

Source: HotHardware

Intel Debuts its 6th Generation Core Processor Family and Z170 Express Chipset

Intel announced its first 6th generation Core processors, codenamed "Skylake." Built on Intel's swanky new 14 nanometer silicon fab process, and in the new LGA1151 package, these processors bring DDR4 memory to the mainstream, and offer IPC improvements over the previous-generation Core "Haswell" and "Broadwell" processors. Making its debut at Gamescom, Intel is starting its lineup off with two chips that are predominantly targeted at the DIY gaming PC crowd, the Core i7-6700K and the Core i5-6600K quad-core processors. More models in the series will be launched towards the end of this month. The company also announced the Z170 Express chipset.

The Core i7-6700K features a nominal clock speed of 4.00 GHz, with a Turbo Boost frequency of 4.20 GHz. It features 8 MB of L3 cache, and HyperThreading. Its integrated Intel HD 530 graphics ticks at 350 MHz, with 1200 MHz Boost. The Core i5-6600K, on the other hand, features clock speeds of 3.50 GHz, with 3.90 GHz Turbo Boost. It features 6 MB of L3 cache, and lacks HyperThreading. It features the same integrated graphics solution as its bigger sibling. The TDP of both chips are rated at 91W. Both chips feature integrated memory controllers with support for DDR3L-1600 and DDR4-2133. The Core i7-6700K is priced around $350, and the i5-6600K around $243, in 1000-unit tray quantities. The retail packages of both chips will lack a stock cooling solution. The LGA1151 cooler mount will be identical to that of the outgoing LGA1150, so you shouldn't have any problems using your older cooler.

IBASE Announces ASB200-908 IPC

IBASE Technology, a leading provider of embedded board and systems, announced the release of its new fanless box system with 12V~24V wide range power input - ASB200-908. The system is built with the IBASE IB908 3.5-inch SBC designed with the 4th Generation Intel Core i7-4650U and i5-4300U processors. ASB200-908 is ideal for industrial automation, transportation, security and retail POS applications that can take advantage of the system's four serial ports as well as the DC-in power input. It supports IBASE's iSMART green technology featuring EuP/ErP power saving and intelligent scheduler.

Measuring only 180x150x66mm, ASB200-908 operates silently and reliably in a small footprint. It has two 1600MHz DDR3L slots that accept up to 16GB of system memory. External I/Os include 5x USB, 4x COM, 2x GbE, DVI-I, CFAST socket, HDD LED and power button. All models are available with 4GB memory and 320GB HDD. A 60W power adaptor and VESA bracket are optional.

Stealth Introduces a New Rugged 21.5" Full HD Touchscreen LCD Monitor for IPCs

Stealth (a Sparton company), a leader in the industrial computer and peripherals market has released a new 21.5" Panel Mount LCD monitor, featuring a high definition widescreen 16:9 format with 1080p resolution (1920 x 1080). The LCD is environmentally sealed to NEMA 4/IP65 specifications providing maximum protection from dirty, wet and hostile operating environments.

The SV-2150WS-PM 21.5" panel mount monitor is an IPS LCD Panel with LED Backlighting for optimal energy efficiency while delivering up to 250 Nits (Cd/m2) of brightness, a contrast ratio of 1000:1 (25000:1 dynamic) and wide viewing angles of 178°. The SV-2150WS-PM is well equipped with Resistive or Capacitive Touch Screen, VGA, DVI-D, HDMI & DisplayPort video input connectors.

Giada Unveils Intel "Skylake" Based NUC

Embedded systems and IPC major Giada is one of the first to openly exhibit a NUC (next unit of computing) compact desktop based on Intel's 6th generation Core "Skylake" processor. The i80 Ultra-Compact Mini PC by Giada features a "Skylake-U" dual-core processor, meant for Ultrabooks and NUCs; and tucks in four USB 3.0 ports, 802.11 ac WLAN, gigabit Ethernet (Intel controller), mini-DisplayPort, and HDMI 2.0, with just enough room for an mSATA SSD; in a compact chassis that measures 116.6 mm x 111 mm x 47.5 mm.

AMD "Zen" Offers a 40% IPC Increase Over "Excavator"

In its Investor Day presentation, led by CEO Lisa Su, and CTO Mark Papermaster, AMD made a slew of careful, near-term product announcements, and market strategies. One of its announcements that strike us, is the company's emphasis on getting the CPU core design right. The company talked about its "Zen" CPU core architecture, not from a technical standpoint, on how it fits into the company's near-term. It turns out that the company is betting on a massive performance increase.

AMD announced that its "Zen" CPU core, will offer a massive 40 percent increase in IPC (instructions per clock) or in other words, performance/clock, over the existing "Excavator" CPU core architecture. Zen will introduce features such as SMT (simultaneous multi-threading), a brand new low-latency cache system, and will leverage the 14 nm FinFET process. The first products based on Zen will be desktop CPUs in the 6th generation FX processor family, which will be launched in 2016. AMD plans to unify the CPU and APU into one socket, which will be called AM4 (and not the previously thought of "FM3"). You'll be able to install both CPUs (which lack integrated graphics, but feature more CPU cores); and the company's 7th generation A-series APUs (which integrate both CPU and iGPUs), on the same kind of motherboards.

AMD "Zen" CPU Core Block Diagram Surfaces

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Source: Planet3DNow, Many Thanks to qubit for the tip.

MSI Announces IPC Motherboard with Embedded Broadwell Processor

As industrial applications increasingly require higher processing performance now than ever before, MSI released MS-98G5 industrial mainboard with superior processing and graphic capability in response. MS-98G5 is a Mini-ITX board based on Intel 4th Gen QM87/HM86 architecture that come support with BGA-type Haswell/Broadwell Mobile Core i7/i5/i3/Celeron Processor, multiple displays, 1 PCIe(x16), 8 USB 2.0 & 4 USB 3.0 ports, 5 COM ports, SATA 3.0 connector, and 2 mini-PCIe slots. The flexible and rich design along with the auto-switch DC 12/19V power inputs bring system integrators more possibilities of display deployment, I/O connection, and extra expansion.

MS-98G5 is also featured with its multiple displays with HDMI, DP, DVI-I, and LVDS outputs and the HD Graphics. The brilliant display capability and the high-performance Intel 4th Gen kernel make it an ideal solution for various industrial applications, such as HMI control, ATM, Kiosk, intelligent transportation system, medical, networking, and many more automation fields.

ADATA Launches IHSS312 Industrial Half-Slim SSD

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the IHSS312, a high-performance SATA III 6Gbps 22-pin half-slim SSD of MO-297 form factor, which is available in 8/16/32/64/128/256GB capacities to meet the varying needs of IPC embedded systems, healthcare, medical devices, kiosk/POS and factory automation.

Utilizing high-speed MLC NAND flash, ADATA's IHSS312 provides excellent performance and reliability with a sequential read/write speed up to 500/125MB per second and MTBF of up to 1 million hours. Thanks to its industrial-grade operable temperature range of -40°C to +85°C, the IHSSS312 is ideal for harsh environments requiring long-term operation.

AMD's Excavator Core is Leaner, Faster, Greener

AMD gave us a technical preview of its next-generation "Carrizo" APU, which is perhaps the company's biggest design leap since "Trinity." Built on the 28 nm silicon fab process, this chip offers big energy-efficiency gains over the current-generation "Kaveri" silicon, thanks to some major under-the-hood changes.

The biggest of these is the "Excavator" CPU module. 23 percent smaller in area than "Steamroller," (same 28 nm process), Excavator features a new high-density library design, which reduces die-area of the module. Most components are compacted. The floating-point scheduler is 38% smaller, fused multiply-accumulate (FMAC) units compacted by 35%, and instruction-cache controller compacted by another 35%. The "Carrizo" silicon itself uses GPU-optimized high-density metal stack, which helps with the compaction. Each "Excavator" module features two x86-64 CPU cores, which are structured much in the same way as AMD's previous three CPU core generations.

Logic Supply Announces ML400 Series Rugged IPCs

Logic Supply, a leading provider of industrial and embedded computer hardware, has unveiled a new series of rugged PCs which breaks free of the 'black box' paradigm in the industrial hardware market. The new ML400 series combines a sleek, exciting aesthetic with ultra-reliable, fanless and ventless engineering to create the company's smallest full-size Mini-ITX system. The product of years of experience designing rugged, solid state computers, the ML400 series is the next step in the evolution of the Logic Supply product line and a distinct break from the norm in embedded computing.

"The ML400 series represents the evolution of not only our own product line, but the embedded industry as a whole," said Logic Supply CEO Roland Groeneveld. "These systems are the brains inside some of today's most cutting edge technologies, and we believe their capabilities and aesthetics should reflect that. We've worked closely with our clients to better understand what they need and want in an embedded PC, and we believe the ML400 series delivers on that research."

Intel Updates Desktop CPU Roadmap, Haswell-E, Broadwell, Devil's Canyon Blip

At GDC, Intel announced a backpedal from its plans to eventually reshape desktop CPUs into components that come hardwired to the motherboards across the line, by announcing three new CPU families. It includes the Haswell-E HEDT platform, Broadwell performance platform, and Devil's Canyon. The three are expected to launch in reverse order, beginning with Devil's Canyon. A variant of existing "Haswell" silicon in the LGA1150 package, Devil's Canyon is codename for a breed of hand-picked chips with "insane" overclocking potential. In addition to binned dies, the chips feature a performance-optimized TIM between the die and the integrated heatspreader (IHS). The dies will be placed on special "high tolerance" packages, with equally "special" LGA contact points. The chips will be designed with higher voltage tolerance levels. Devil's Canyon is expected to branded under the existing Core i7-4xxx series, possibly with "Extreme" brand extension. It will be compatible with motherboards based on the Z97 chipset.

Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.

MSI Announces MS-9A29 Fanless IPC

MSI, the leading provider of industrial PC, has released a new embedded system to the market. The newly launched MS-9A29 is an ultra compact size fanless embedded system with low-power Intel Atom processor, offering a perfect cool solution for industrial applications. The versatile installation options of wall mounting, display-attaching, and cabinet installation allow the embedded system to be easily integrated in various field sites, especially fits to space-critical application sites. Great flexibility can also be found in this product with its rich networking, storage, and expansion options. Thanks to all the friendly design, the MS-9A29 offers great cost-effectiveness with maximum flexibility and convenience for your future maintenance or expansion.

Huntkey Releases Power Supplies for Servers and Industrial Personal Computers

Huntkey Enterprise Group, a global professional power supply provider, has delivered numerous industrial power supplies to meet various demands from servers, communication, workstation, storage, networking application or any other automation applications.

Huntkey has released all kinds of form factor power supplies, such as 1U, 2U, 4U, ATX, FLEX, SFX, TFX, and so on. The high-load electrical components adopted by Huntkey industrial PSUs make them work perfectly in an industrial environment. In addition, with its full range of input and output electrical features, Huntkey products also comply with the latest safety and EMC standards, and therefore meet various regulations all over the world. Customers will be impressed by the longtime working and stable performance of Huntkey industrial PSUs.

Giada Introduces D310 DIY Barebones System

Giada Technology, a world famous manufacturer of compact desktop PCs, has announced the launch of a compact "Do-it-yourself" barebones-system: The D310. The D310 family is based on the 3rd generation of Intel Core processors. The D310 compact systems are simple Barebones Systems using the Intel Celeron Processor 1037U. The assembly only requires 2 screws; 1 screw to open the chassis and one to fix the hard drive, allowing maximum efficiency in building your dream machine. In addition, support for the Trusted Platform Module (TPM) which provides extensive security with high levels of data encryption, allows the use of D310-based systems in various applications in IT departments of large enterprises. The D310 system is also ideal for industrial control applications, smart traffic control systems, security and surveillance systems, commercial terminals and other similar applications which require small size, wide choice of interfaces, simplicity and reliability of use.

Sapphire Unveils Three APU-based Innovations

While Sapphire's LGA1150 motherboard lineup came across as a little lukewarm, the company more than made up for that with its fleet of motherboards that take advantage of AMD's newest A-series and E-series APUs and SoCs. First, there's the PGS A320M, a micro-ATX motherboard that ships with a FirePro A320 socket FM2 APU pre-installed. Largely identical to an A10-5800K, and based on the "Trinity" micro-architecture, the A320 features FirePro-branded professional graphics that's certified for most modern 3D productivity applications, and can give display output at resolutions as high as 4096 x 2160. The board features one each of DisplayPort 1.2, dual-link DVI-I, and D-Sub display outputs. Other features include eight SATA 6 Gb/s ports, four USB 3.0, gigabit Ethernet (Broadcom controller), and 8-channel HD audio.

Things get interesting with a contraption called IPC-FS1r2A75. This board comes in a proprietary IPC form-factor, features an FS1 rev 2.0 socket, which seats R-series APUs, an embedded AMD Radeon E6000 series GPU based on the Graphics CoreNext arhitecture, with its own dedicated GDDR5 memory on-package, and AMD A75 FCH chipset. The board offers six mini-DisplayPort and four HDMI outputs, two DDR3 SO-DIMM slots, an open-ended PCI-Express 2.0 x4 slot, four mPCIe slots (in stacks of two), five SATA 6 Gb/s ports, six USB 3.0 ports, two gigabit Ethernet connections, and 6-channel audio.

Icy Dock Announces ToughArmor 2.5-inch Drive Racks

Introducing the Icy Dock ToughArmor MB991SK-B 2.5" SATA Mobile Rack solution for use in 3.5" device bays (Floppy bay). It is a smaller form factor device built specifically for systems with small real estate to work with. Using a heavy duty metal construction, it is capable to withstand the harshest enterprise type environments. The drive is fully secured by our proven technologies such as, the Eagle-Hook lock system and metal 2-segment safeguard key. Our full metal EZ Slide Mini Tray allows interchangeability of data between multiple systems with other ToughArmor products. Suggested applications in Medical & Military systems, Media servers, and IPCs, approved by Tier 1 companies.

The MB991SK-B is perfect for use in industrial PCs, SMB SFF servers, mobile DVR systems, or even home servers. These systems tend to use components that provide the needed features, in the smallest form factor available. The ability to house one SATA SSD or HDD in a single 3.5" bay makes it a valuable asset in specific applications such as, integration into an industrial imaging or medical device.

MSI MS-98D1 EPIC IPC Motherboard Announced

MSI proudly announced the release of its new EPIC embedded board?MS-98D1. The MS-98D1 is a compact EPIC size embedded board with Intel Atom Dual Core processor for low-power fanless solution. Featuring with dual core, fanless design, rich I/O, and wide input voltage of 9 to 36 VDC, the MS-98D1 is especially ideal for industrial applications that involve control and communications, or any industrial fields that require fanless embedded systems.

The dual Gigabit LAN built-in also benefit the target applications by providing broad-band communication capability that is required by many industrial fields. For some systems that need additional communication or I/O interfaces, the PCI-104 slot of MS-98D1 allows system integrators to stack more modules with no limits, offering more application possibilities with this small board. Moreover, 2 independent displays with VGA, DVI, and Dual LVDS outputs enable the MS-98D1 to be applied for remote monitoring and control systems as well.

Advantech Launches ATX Intel Xeon E5 Industrial Serverboard

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

BIOSTAR to Showcase Exclusive Hi-Fi Puro Technology at Computex

Computex is Asia's largest high-tech event and will run from June 4th to to 8th, 2013 in Taipei, Taiwan and BIOSTAR will be showcasing their embedded/IPC solutions and graphics cards products as well as their line of Intel and AMD based motherboards in the Nangang Exhibition Hall at Booth M0402. The theme of their exhibition this year is their Hi-Fi Puro integrated products, including Intel's next generation Haswell based boards and their FM2 motherboards that support AMD's new Fusion "Richland" CPU. Continuing the tradition of their own in-house audio technology called "Puro Hi-Fi Technology"; Biostar is going to present the 2nd generation of this technology, called "Hi-Fi 3D".

Targeting audiophiles, HTPC enthusiasts and high-end gamers alike, Puro Hi-Fi features an integrated independent audio power design with a built-in amplifier. The technology utilizes audio components with an independent power delivery design for a significant reduction in electronic noise producing superb sound quality. The unique noise-blocking multi-layer PCB layout is conducive for an exceptionally clean signal. That design feature, together with a sampling rate of 192 kHz/24-bit, delivers high quality audio through an analog connection to your home theater system, multi-channel speakers or high-end headphones, allowing you to enjoy true high-definition 7.1-channel surround sound.

Apacer Launches Value-Added PATA SSDs

Nowadays, new products in the SSD market have mostly been upgraded to the more efficient and high-speed SATA interface solid-state drive. However, the majority of industrial computers (IPC) are still using the PATA interface (or IDE interface), which are now facing certain problems -- malfunctioning and bad tracks are beginning to emerge in the older technology and facilities.

To solve the problem, one of the most viable upgrade options at this stage in terms of data security and cost effectiveness would be the PATA interface solid-state drive with built-in security functions. In response to customer needs, Apacer launched this value-added PATA SSDs with Data Security benefit. These products come in two specifications - 2.5-inch, 44 pin AFD 257 and 1.8-inch 40 pin AFD 187. Both models come with three built-in data security functions - Full Erase, Destroy, and Write Protect to provide advanced and upgraded data security advantages.

VIA Announces Ultra Compact VIA ARMOS-800 IPC

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.

Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -40°C up to 80°C, the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP.

Intel Core "Haswell" Quad-Core Desktop CPU Lineup Detailed

2013 promises to be another year, with another new line of processors by Intel, and like every alternate year, the company will introduce a new client desktop CPU socket. With its 4th generation Core "Haswell" processor family, Intel will introduce a brand new CPU architecture that steps up IPC over current Core "Ivy Bridge," hence, Intel's Core desktop processor lineup will not ship with higher clock speeds, yet higher performance. The new chips will be built in the LGA1150 package, and will be accompanied by Intel's 8-series "Lynx Point" chipset.

By Q2-2013, Intel will have launched as many as 14 Core desktop CPU models, including six in the mainline, and eight power-optimized ones. Its nomenclature is somewhat similar to that of current Core "Ivy Bridge" lineup, except the 4000-series numbering. Leading the pack is the Core i7-4770K (unlocked) and i7-4770, clocked at 3.50 GHz with 3.90 GHz Turbo Boost, featuring eight threads with HyperThreading, 8 MB of L3 cache, Intel HD Graphics 4600 iGPU clocked up to 1250 MHz, with 84W TDP; followed by Core i5-4670K (unlocked) and i5-4670 clocked at 3.40 GHz with 3.80 GHz Turbo Boost, and 6 MB L3 cache. The Core i5-4570 and i5-4430 are clocked at 3.20 GHz (3.60 GHz Turbo) and 3.00 GHz (3.20 Turbo).

Samsung to Unveil 4+4 Core big.LITTLE Processor in 2013

Samsung is reportedly taking interest in ARM's big.LITTLE technology - an SoC design in which high-performance Cortex-A15 cores are combined by low-power Cortex-A7 cores, and the two are made to trade places as the device's CPU, depending on the load. An SoC slated for 2013, which could probably feature in high-end smartphones and tablets, sees a combination of four each of A15 and A7 cores. The A15 cores are clocked at 1.80 GHz, and A7 at 1.20 GHz, with the former featuring higher IPC than the latter. A 2 MB last-level cache serves as town-square for data and instructions going to the various cores. The chip will be built on the 28 nm process.

Source: EETimes
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