Introduction

Just a short time ago, Intel released their latest platform, Sandy Bridge-E also known as "SB-E" in enthusiast circles. Featuring a Quad-Channel memory architecture and Intel's XMP v1.3 memory profiling, the platform also needs supporting memory, tested and approved to work properly with the Intel X79 Express chipset and Socket 2011 processors. Our first look at this new take on memory comes from G.SKILL, a well-established brand that has become one of the most globally recognized names when it comes to memory. Here's what they have to say about themselves on their website:

Our History:
"G. SKILL", established in 1989 by enthusiasts, is a leading memory module Manufacturer based in Taipei, Taiwan.
With traditional strengths, we have built an excellent reputation by meeting market demand and fostering business competitiveness both locally and internationally with our dedications to provide competitive prices, On-Time Delivery, Assured Quality, Customer-Oriented Services and Diversity of Products.

Mission Statement:
We are here to provide superior memory products, with satisfactory services in order to keep pace with our customers' growing needs, and help them by adding value to their purchases. We pledge we will continue to do so and enable both sides to obtain significant competitive advantages in the market segments.

G.Skill has released several different products for the X79 platform, all of which have been featured in our News section quite recently. The first product from G.Skill we will be taking a look at is the "Ripjaws Z" F3-17000CL9Q-16GBZH, a quad-channel kit boasting the high speed of 2133 MHz when XMP v1.3 is enabled, with 9-11-10-28 timings and requiring 1.65V.

Specifications

Packaging

The G.Skill "Ripjaws Z" F3-17000CL9Q-16GBZH showed up on our doorstep direct from G.Skill's Taiwan offices, clad in plastic clamshell that G.Skill has been using for quite some time for many of their products. The clear plastic allows prospective buyers to see two sticks of the memory kit itself easily, and highlights the aesthetic design of the included heatspreaders. Up on the top right corner of the package is a small highlight showing that this kit has been certified for functionality on the Intel X79 platform. Flipping the package over, we find the other two DIMMs, with a small cardboard layer in between, isolating the pairs of sticks from each other.


Once opened, we can see that there is a bit of information on that piece of protective cardboard, but it seems like standard packaging info for the product line, rather than info specific directly related to the modules inside. The second image above shows that provided information.


With the card out of the way, we can see all four modules; each nestled securely in its own section of the clamshell. G.Skill has informed us that the final retail packaging may differ slightly, but as the box isn’t exactly what we’re interested in, it’s hardly that important, but is still worth mentioning.