Ummm, no I don't. I don't accept there is such a thing as "thermal wear" that, to any significant point, affects cooling. If there was a bad application, it would be apparent at the first power up.
It would seem you did not read my comments above about drying. It does not matter if your TIM dries out once properly applied. The solids (which are the heat transferring components of TIM) left behind are still there doing their job. See my post #35 above. See also:
The Heatsink Guide and note where it says (my
bold added),
You keep trying to throw time into the equation when it does not apply! Again, show one TIM, motherboard, computer, processor, or cooler maker who says time is a factor! NOT ONE does.
It is true that over time, the efficiency of some TIMs (depending on formula)
may degrade a
few degrees. But again if a few degrees puts the processor temps over the threshold causing stability issues, you have greater issues to deal with - likely case cooling. Because the temps never should have been that close to the threshold in the first place.
It is important to note that it is the case's responsibility to provide an adequate supply of cool air flowing through the case. And of course, it is the computer designer and user who are responsible for setting up proper case cooling.
The CPU cooler need only toss up the CPU's heat into that air flow. Of course, if the ambient (room) temp is excessive, no amount of air flow from fans, or heat transfer through heat sinks will help. But hopefully users are not using their computers in 100°F environments.
Ironically, I have found one of the most common causes for the cured bond between the CPU and heatsink to break is users over-twisting the heatsink to see if the cured bond is broken!
Rough handling during transport is another cause - especially with tall and heavy, vertically oriented coolers that "hang" off the motherboards in tower cases.