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CPU heats up to 77-80c when running Virtual Dub

Joined
Jun 25, 2008
Messages
2,452 (0.40/day)
System Name Dell Workstation t5810
Processor Xeon CPU's E5-2683 v4 Broadwell-E Technology
Motherboard Broadwell-E X99
Cooling Default fan System Level 3
Memory 48GB DDR4
Video Card(s) Radeon Pro VII 16GB
Storage 2 Internal SSD, 6 External HDD
Display(s) Dell 27 Inch Monitor
Case Dell Precision 5810
Audio Device(s) RealTek High Definition
Power Supply 825 Watts PSU
Mouse Soundless Black Quiet Mouse
Keyboard Dell Black
Software Windows Pro 10 x64
I bought a new cpu last week, i was using a L5640 and now I'm using a Xeon 5670. I always notice for years when i use virutal dub, the cpu heats up a bit, because its running something, but it always was around 62 or 65c. For some odd reason right now, the temps are up in the red up to 77-85c. I'm about to check if the paste is still up there, but this wasn't happening when i was using the L5640. I might have go back to using that.
 

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Put more air threw the case see if that helps
 
Seem to have helped when i use speedfan also. stays under 70 when running virutal dub. funny even my games doesn't even even go that high when playing , only virtual dub.
 
No surprise. The x5670 is faster (and has a higher TDP) than the L5640. In fact, the L in L5640 denotes low power, while the X in X5670 denotes high performance. They're also old, Nehalem-based 32nm 6 core chips with HT. They already run hot. You probably need a better cooler to keep temps low... and that Dell case isn't helping either.

That said, don't freak out over it. Those temps are acceptable operating temps. VDub is likely loading all 6 cores/12 threads to 100%. Most games won't.
 
No surprise. The x5670 is faster (and has a higher TDP) than the L5640. In fact, the L in L5640 denotes low power, while the X in X5670 denotes high performance. They're also old, Nehalem-based 32nm 6 core chips with HT. They already run hot. You probably need a better cooler to keep temps low... and that Dell case isn't helping either.

That said, don't freak out over it. Those temps are acceptable operating temps. VDub is likely loading all 6 cores/12 threads to 100%. Most games won't.

Very true and makes sense. I do notice a performance boost in games using the 5670. I'm just going to use speed fan when i am using virtual dub. I plan to build a second workstation gaming system soon, will make sure i buy one of the newer cpu's chips and a better case with better cooling.
 
I'd recommend you switch to coretemp or realtemp for viewing CPU temps. Speedfan is positively ancient.

If you want to keep temps under control, this one gets heralded as the best budget cooler pretty often:

https://www.newegg.com/Product/Product.aspx?item=N82E16835103099

It's like the Arctic Freezer 7/64 Pro of current times. ;)
 
I'm about to check if the paste is still up there
What do you mean by "if the paste is still up there"? Where are you thinking it might go?

For sure, when you mounted this new CPU, you should have applied a fresh new layer of TIM (thermal interface material). If you used the same old heatsink, you should have completely removed the old TIM and thoroughly cleaned the mating surfaces before adding any new TIM. Did you do that? Was the new TIM a pad, or paste you had to spread around? If a paste, did you use as small an amount as possible while still ensuring thorough coverage? If so, then there is no reason to worry about the paste doing its job or if it "is still up there"? Some excess might be squeezed out when you clamped the cooler in place and that's okay as long as it is not a lot being pushed out as that would indicate you put way too much TIM on there in the first place.

Otherwise, the purpose of TIM is to fill the microscopic pits and valleys in the mating surfaces to prevent insulating air from being trapped in there. The best transfer of heat occurs with direct metal to metal contact. So any excess TIM is actually in the way. Hence the reason to make sure any applied layer is as thin as possible. Once properly applied, the TIM will easily last 10, 12, 15 years or longer AS LONG AS the cured bond between the mating surfaces is not broken. It never needs to be replaced just because it is X number of years old. Even if it dries out, the solids left behind are still preventing any insulating air from getting in there.

If a CPU "needs" the few (typically 3 or 4) degrees a fresh new application of TIM might provide to prevent crossing the excessive heat thresholds, you have other issues that need to be addressed first - like the cooler itself being inadequate, or an improperly cooled case.

What cooler are you using with this new CPU? As seen here, the X5670 does consume considerably more power and can generate more heat than the L5640. Assuming you are using a cooler that (when properly mounted) is capable of adequately cooling that CPU, assuming you did indeed thoroughly clean the mating surfaces, assuming you applied a fresh new layer of TIM, and assuming you did properly mount the cooler, I agree with the others and you need to look at case cooling.

I hate to assume and that is a lot of assumptions. :( Here's another - I am assuming the case interior is clean of heat trapping dust.

I don't know what "Blue Light Speed Fans" are, how much air they move or how they are configured in your case but it is important to note it is the case's responsibility to provide an adequate supply of cool air flowing through the case. The CPU cooler need only toss the CPU's heat into that air flow. You typically want good "front-to-back" (or bottom-to-top) flow through the case. You need to inspect your case to see if it will support more or larger case fans.

My guess is your "Dell Precision" case does not offers enough cooling in its current configuration, and more importantly, I fear it does not offer any cooling upgrade options. So my guess is you need to shop around for another case and hope and pray Dell did not give you the shaft by going proprietary!
 
What exactly is the problem here?
Your PC is throttling? Smoking? Melting?

Your previous CPU had TDP 60W. Your current one is 95W. Dell was selling this case with a 130W processor (W3530). So there goes the lovely argument that your funny office case can't handle the heat.
The cooler is another story. There might have been different models for different CPUs, although Dell seldom does that. Check the manual or something. There might even be a sticker inside the case.
If a more powerful heatsink exists, you should be able to find it somewhere. These things are fairly cheap.

Also, clean the case. Dust in vents and on the CPU cooler can "provide" 5-10*C easily.
 
@notb just beat me....
https://ark.intel.com/compare/47926,47920
You've replaced a 60 watt TDP CPU with a 95 watt TDP CPU. Your temperatures will go up if you use the same cooling configuration. At the very least, you will need to increase airflow (increase fan speeds) to maintain the same temps. Also, consider that it's winter time. You will need even more cooling come summer time.
 
Dell was selling this case with a 130W processor (W3530). So there goes the lovely argument that your funny office case can't handle the heat.
:(

The 130W specification just indicates how much power it might consume - not how much heat it throws off! With just a tiny bit of research/homework and a quick look at the W3530 ARK, we can see it has a maximum Tcase spec of 67.9°C - which is actually lower than the L5640 (69.4°C) and the X5670 (81.3°C).

So as thebluebumblebee correctly points out, the X5670 has greater cooling needs so you do indeed need to look at your case cooling because it likely is inadequate, as previously noted.
 
The 130W specification just indicates how much power it might consume - not how much heat it throws off!
That statement, ...., scratches head, ...., well, ...., might cause some confusion (as if TDP isn't confusing). From Intel:
It is important to note that thermal design power is the maximum thermal power the processor will dissipate, but not the same as the maximum power the processor can consume
Basically, if you build a system with a 130 watt TDP processor, you need to be prepared to dissipate 130 watts of heat in the environment that the CPU will be in. This is before OC'ing of course.
 
:(

The 130W specification just indicates how much power it might consume - not how much heat it throws off! With just a tiny bit of research/homework and a quick look at the W3530 ARK, we can see it has a maximum Tcase spec of 67.9°C - which is actually lower than the L5640 (69.4°C) and the X5670 (81.3°C).
And the relation between Tcase and heat dissipation is...?
 
70C is great. When i OC i usually shoot for 90c in stress test and 80's-mid 80's in heavy programs (cinebench, handbrake etc). I've had laptops that idle in the mid 50's (ahem apple) last for almost 10 years now and they are still fine.
 
It is confusing. And yes, I mispoke about "consumption" - my apologies for that.

But note "thermal power" is not the same thing as the generated heat (due to inefficiency) that is being "transferred" (a key point) into the heatsink and case.

See this and note where it says,
• Thermal energy is the total internal energy of a system while heat is energy in transit.

• Thus, heat is the energy being transferred from a hotter body to a colder body in contact until both achieve equilibrium.

So just because processor A has a higher thermal design power value than processor B, that does not mean it is actually dissipating (transferring) more heat to the heatsink and into the case interior.
And the relation between Tcase and heat dissipation is...?
That depends on many variables specific to each installation. These include the efficiency of the TIM, the efficiency of the heatsink and its fan, as well as the ambient temps.

Regardless, it is still the case's responsibility to provide a sufficient supply of cool air through the case. And it is the user's responsibility to configure that case cooling as well as to ensure an acceptable ambient environment. Until the OP returns with more information about the CPU cooler and case fans, I'm still looking at case cooling as the problem.
70C is great.
:confused: Okay, but a look at the OP's screen shot shows 82°C. That is not great.
 
:confused: Okay, but a look at the OP's screen shot shows 82°C. That is not great.

He replied right below it that tweaking airlfow keeps it below 70C now.
 
Ah! I see what you mean now. Thanks.

That said, while 70°C is within acceptable limits, I personally would not call 70°C great. I like my CPU temps to stay below 60°C most of the time. In fact, if they go above 60° and stay there for more than a few seconds, that generally tells me I need to clean my filters.

That said, the OP also said that 70°C is only with VirtualDub - not with gaming so that is good.

And I would not compare laptops to PCs. Considering even bit PC cases can be challenged to keep the innards properly cooled, it is no wonder laptop cases have problems.
 
As for your conern about TIM ... Questions:

1. Did you thoroughly clean the CPU and heat sink with a thermal surface cleaner like Indigo Extreme or at least isoprophly alcohol ?

2. What did you use ? And does it require curing (i.e. AS5 takes 7 - 8 weeks @ 25 - 30 hours per week usage) ?

3. What method did you use ? Was it appropriate for the type of heat sink ?

Benchmarkreviews.com did the best article on TIM application methods that I ever read. .... they have a newer site and the old site was archived.... but they seem to have gone the way of VHS.

Take aways from I took from that article and others .... as well as experience gained when checking imprints after disassembly, have taught me that:

a) the "pea size" is popular, except use a lot less than a real green pea.

b) the IHS is square but the heat generating surface below is rectangular ... the "line method" is intnded to address this ... if you take this approach, with the golden triangle in lower left and lettering readable (right side up) make a horizontal line covering about 2/3 to 3/4 of the width. If you have one of those heat sinks that have exposed heat pipes on the underside. Make sure to fill the cracks, spread evenly and wipe off excess with a credit card .... I keep an old one in my tool box for this purpose (Iit's a card I no longer have and I cut off an inch with part of the number just to make sure it didn't get 'lifted")

c) I use the X method on GPUs ... also works decently on CPUs but from disassemblies, I often found spillage squeezed out.

That's been my experience but die size, how much is used and other factors will make all methods vary by user.

As y the Speedfan improvement, how's the noise ?
 
And does it require curing (i.e. AS5 takes 7 - 8 weeks @ 25 - 30 hours per week usage) ?

Like many TIMs, there is a curing period where temps can be expected to improve (typically by 5 - 6°) once fully cured. For AS5, that is "50 to 200 hours of use". That means in as little as just over 2 days.

But as noted above, if you "need" that 5°C to prevent crossing thermal protection thresholds, you have other issues that need addressing first.
 
It is confusing. And yes, I mispoke about "consumption" - my apologies for that.
That's a minor offense. You didn't get the sarcasm - that's serious. :-P
But note "thermal power" is not the same thing as the generated heat (due to inefficiency) that is being "transferred" (a key point) into the heatsink and case.
There's no such thing as "thermal power"... well... unless we're talking about power plant, not PCs. :-P
"Thus, heat is the energy being transferred from a hotter body to a colder body in contact until both achieve equilibrium."
And this is not a correct definition of heat.

Lifehack:
don't quote actual quotes (not discussion-related) with the QUOTE tag. It vanishes when I answer. If you want to highlight some text in your post
try using coding tags :-)
So just because processor A has a higher thermal design power value than processor B, that does not mean it is actually dissipating (transferring) more heat to the heatsink and into the case interior.
Yes!
That depends on many variables specific to each installation. These include the efficiency of the TIM, the efficiency of the heatsink and its fan, as well as the ambient temps.
So there is no obvious connection, right? :-)
That said, while 70°C is within acceptable limits, I personally would not call 70°C great. I like my CPU temps to stay below 60°C most of the time. In fact, if they go above 60° and stay there for more than a few seconds, that generally tells me I need to clean my filters.
How is that good? Maybe he's making a living with VirtualDub? Maybe it runs for 120h a week and he games occasionally? :-P
And I would not compare laptops to PCs. Considering even bit PC cases can be challenged to keep the innards properly cooled, it is no wonder laptop cases have problems.
Actually *well designed* laptops have the advantage of being purpose-built and very optimally cooled. It's the same with *well designed* OEM PCs (be it Dell or Apple or whatever).
Cooling in custom build PCs can't be as efficient because of the necessary universality.

All in all, you're making a lot of brave assumptions. :-P
 
That's a minor offense. You didn't get the sarcasm - that's serious.
Me being incorrect is serious (at least in my book - I don't like to be wrong when posting incorrect facts in technical forums).

So there is no obvious connection, right?
Obvious? Perhaps not. Just saying there are many variables.
How is that good?
Never said it was.
All in all, you're making a lot of brave assumptions.
And you are not? Didn't you just do so with your *well designed* comments? The fact is, even in the best designed laptop, cooling will be an issue. They can pack the computing horsepower of a PC into a tiny laptop case, but not the cooling.
 
Y'all are making this awfully complicated.

TL : DR @u2konline : look at cleaning the dust out, improving and/or adding intake/exhaust fans and improving the CPU cooler. None of this has to be expensive, either.
 
Wait a second guys, everyone seems to be confused, my fault if i have confused everyone. The problem was the temps will increase too high "only" when using Virtual dub, not gaming or anything else. Yes it only happens when using the Xeon 5670, what hat said made sense. Also when i use the program i just set the cores to 6 instead of 12 and the temps only goes up to around 65. So the problem is not really an issue anymore, but i did take everyone advice and dust out the fans.

Now, someone mention that i am using a powersuppy of 130 watts? No i am not lol. My Powersupply is 500watts. The desktop T3500 i bought came with Dell Precision T3500 Workstation | 2.4GHz Xeon W3503 | 4gb DDR3 | 250gb | DVDROM | 500 watts PSU. All i did was added a Xeon 5670, AMD Firepro W5000, more ran to total 16GB ddr3, and 4 more hard drives and 2 more DVD drives.
 

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more importantly... how do you have 16 gb of triple channel ram?
 
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