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Delid 7700K and applying CLU + results

Tallencor

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This is exciting stuff.
Was going to attempt this myself a couple yrs back with my ivy but was talked out of it by @Vario glad I didn't at the time due to lack of funds to replace. Was going to vice and hammer it lol.Thanks Vario for that. But man do I want to try at some point. Watching this thread. I'd be interested to see what happens if you do decide to go with liquid metal.
 
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Always liquid metal under the IHS. It's the most critical heat transfer junction/point. Why use anything but the best you can buy there? Well...unless you plan to LN2/DICE it. In which case you probably shouldn't.
 
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I have to agree here! Not worth all the effort for just 7 degrees at max. Might be why so many are using liquid metal paste though over the usual TIM offerings.

I think most people do it just for the sake of doing it. I could have easily water cooled my entire rig for $200, with a corsair AIO cooler for the CPU and EVGA "hybrid" kit for my GPU. the temps would have been only 5-10*C more. but I chose to drop north of $600 and waste 2 days of my life building a custom loop. but I had fun doing it, and I like the results.
 
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Realtemp never reports actual temps, no software will report actual voltage or temps its a given fact. You want actual temps buy a temperature prob, even then they will not be precise.
RealTemp has never been accurate for me, I go by the temps in AIDA64 stress test, which seem right, because when stress testing a high overclock, my system will bluescreen as maximum CPU core temps approach 90c (as it should). Also great for checking fan and water pump speeds, voltages, clock speeds, etc.
 

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as someone who has delidded, watch your temps over time. Mine would slowly creep up as the TIM bled out inside the IHS, and i had to use liquid metal to stop the thermal creep.
 

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I think a metal based thermal compound will bring things up to snuff.
yes it its, there several articles about delid and the reasons why you must use liquid metal,


This is exciting stuff.
Was going to attempt this myself a couple yrs back with my ivy but was talked out of it by @Vario glad I didn't at the time due to lack of funds to replace. Was going to vice and hammer it lol.Thanks Vario for that. But man do I want to try at some point. Watching this thread. I'd be interested to see what happens if you do decide to go with liquid metal.
i did delid, @Knoxx29 was the one that supports the process, learned a lot from him,

Always liquid metal under the IHS. It's the most critical heat transfer junction/point. Why use anything but the best you can buy there? Well...unless you plan to LN2/DICE it. In which case you probably shouldn't.
pretty much on the point, :pimp:

as someone who has delidded, watch your temps over time. Mine would slowly creep up as the TIM bled out inside the IHS, and i had to use liquid metal to stop the thermal creep.
you mean that normal TIM, for example arctic mx 4 used @ CPU die will make it bleed and them screw your temps?

Wrong paste = that happening. ;)
Simple...


Regards,
 

fullinfusion

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I think a metal based thermal compound will bring things up to snuff. Gelid is good for IHS to cooler, but for a bare die, the metal stuff (like the Grizzly stuff and Coolabratory stuff) it makes a pretty big difference.
I'll order liquid metal since it be easy to pop the cap back off.
 

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I'll order liquid metal since it be easy to pop the cap back off.
beware, there are a few scenarios were the liquid metal tends to bond ... so when poping out might scratch cores, use collaboratory liquid ultra, issues are somewhere around with collab pro

Regards,
 

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Today i have noticed something that makes me think that my WC loop is wrong.


As showed in the pic below the loop goes this way: Chiller------> Water block -------->Reservoir------->240 Rad-------->Chiller


So, what is cooling the CPU?

there is not Rad between the chiller and CPU, what the 240 Rad is cooling?, nothing?, wouldn't be better to have a Rad between chiller and CPU?



IMG_4014.JPG
 
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Benchmark Scores Faster than yours... I'd bet on it. :)
First... res should be before the pump... feeds the pump..

2nd, loop order really doesn't matter at all. With a properly flowing and radded loop, temps within the loop shouldnt be more than 1-2C off at any point in the loop.

Please have a read a few times, some of these links...: http://www.overclockers.com/forums/forumdisplay.php/71-Water-Cooling
 
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FireFox

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fullinfusion

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there ordered this so hopefully all goes well, it the right stuff?

Also any tips on spreading the metal around the die?



beware, there are a few scenarios were the liquid metal tends to bond ... so when poping out might scratch cores, use collaboratory liquid ultra, issues are somewhere around with collab pro

Regards,
I wont be going bare back
 

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Benchmark Scores Faster than yours... I'd bet on it. :)
I thought you were moving it in the loop, not adding (missed that word...ADD, lol!).. as far as temps... who knows... a couple C. Nkt sure I would bother with a chiller in the loop though...
 

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Nkt sure I would bother with a chiller in the loop though...

Once again the Chiller:banghead::banghead::banghead:

I have said millions of time that the Chiller it's in idle mode = it's not cooling the water at all :mad:

Say/mention Chiller once again and you will see:nutkick:
 
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as someone who has delidded, watch your temps over time. Mine would slowly creep up as the TIM bled out inside the IHS, and i had to use liquid metal to stop the thermal creep.

Which paste did you use? Think I have made a mistake and used Gelid extreme under the IHS. Was worried of using liquid metal as the 4770k I have has little VRM's next to the die that i didnt want to get any conductive metal on.
 
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Benchmark Scores Faster than yours... I'd bet on it. :)
Once again the Chiller:banghead::banghead::banghead:

I have said millions of time that the Chiller it's in idle mode = it's not cooling the water at all :mad:

Say/mention Chiller once again and you will see:nutkick:
If You Aren't Using it... Get It Out Of The loop.. Sell It To me.
 

fullinfusion

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What do you guys think of this, after the liquid metal is applied to the chip and to the under side of the IHS I place the chip in the socket and since I have a marker around the lid on the PCB for proper alignment I just lower it in place.. Oh and I'd have taken the Intel clamp right off the board just for now.. OK I gasket the lid and place it on the chip. Now I'd just lower the water block straight down over the CPU and tighten down the block over night to let the gasket cure.. Once morning comes I just remove the block and install the socket clamp and lock it in place..

Any thoughts if this would be a problem? The rig would be on its side of course and no Tim would.be applied to the block.. It's just a thought on a way to clamp it down and not fuck with the locking mechanism pushing the IHS around while putting it in place.

Those fine lads from Ireland which own memoryC dot com have fedx'd overnight so I'll have it all tomorrow..
 
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