- Joined
- Jul 10, 2010
- Messages
- 1,230 (0.24/day)
- Location
- USA, Arizona
System Name | SolarwindMobile |
---|---|
Processor | AMD FX-9800P RADEON R7, 12 COMPUTE CORES 4C+8G |
Motherboard | Acer Wasp_BR |
Cooling | It's Copper. |
Memory | 2 x 8GB SK Hynix/HMA41GS6AFR8N-TF |
Video Card(s) | ATI/AMD Radeon R7 Series (Bristol Ridge FP4) [ACER] |
Storage | TOSHIBA MQ01ABD100 1TB + KINGSTON RBU-SNS8152S3128GG2 128 GB |
Display(s) | ViewSonic XG2401 SERIES |
Case | Acer Aspire E5-553G |
Audio Device(s) | Realtek ALC255 |
Power Supply | PANASONIC AS16A5K |
Mouse | SteelSeries Rival |
Keyboard | Ducky Channel Shine 3 |
Software | Windows 10 Home 64-bit (Version 1607, Build 14393.969) |
DiRAM4 which is a 2.5/3D RAM which can operate at 512 gigabyte/s @ 0.6V, 1024 gigabyte/s @ 0.7V, and peaks out at 2048 gigabyte/s somewhere between 0.7V and 1.3V.Now we must all hold our breath and see what..."Nexgen Memory" actually means! God forbid it's HBM3, equally hilarity will ensue if it's GDDR(6).
There is only three stacked architectures in use HMC(MCDRAM via Intel) by Micron, HBM by SK Hynix/Samsung, and DiRAM4 by Tezzaron/Globalfoundries;
etc. That is my guess. HBM2 capacity, with post-HBM3 bandwidth. It also has the lowest latency of all them at 15~22 ns tRC compared to 48 ns tRC for HBM and 50 ns tRC for HMC.
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