I have moved most of an HP system over to a new case and am monitoring the CPU temps and need some guidance. Here are my specs:
A bit of explanation...
The H50 was a recent addition after moving to the new case and I started monitoring the CPU temps and I thought they were running too high and I got a couple of BSoDs. After installing the H50 the temps dropped from about 145f (50% CPU load) to around 125f (50% CPU load). I tried moving fans around and that didn't seem to work.
This past weekend, I was to the point that I was thinking that it was the fact that the case I moved to had 1) a bigger power supply and 2) it was located at the top of the case right above the cpu. So, made the choice to move to a new Thermaltake V4 case where the power supply sits at the bottom and it has plenty of air flow. At the same time I took the opportunity to re-seated the pump on the H50. After cleaning off the thermal paste (it comes pre-applied to the copper plate on the pump) I saw some nicks on the copper (see attached photo). I used some Antec Formula 5 (only one available at my local computer store) and applied according to their directions.
After restarting the computer, it seemed that even though the temps would jump up with cpu usage, they would drop back down much faster than before. I breathed a quick sigh of relief. It was a bit too soon. The next morning I decided to play a little WoW since that's where I was seeing the more consistent higher temps, and I was seeing 129f to 133f across all 4 cores. I was not a happy camper. What was a bit surprising was that I did notice that Core 3 was now the core that seemed to get hotter after re-seating, when previously it was Core 0.
Now for the questions...
What could be causing the high cpu temps?
If this was your system, what would be your next steps -- within reason and given the following: I'm limited to a 17" high case. I can't really afford to change the mobo or processor.
Could the fan blowing air into the H50 not be running fast enough? I don't have any control over it thru BIOS.
Should I see about RMA'ing the H50 because of the nicks on the copper plate?
Is the thermal paste supposed to be applied to the heatsink or to the processor? Is the Antec Formula 5 okay to use, it's supposed to be the same as Arctic Silver.
Any suggestions?
Also, I use this system on a daily basis for work, not just for play so it gets a lot of use and I can't have it down, so quick, prompt help is very much appreciated!
- Motherboard: IPIBL-LA (http://h10025.www1.hp.com/ewfrf/wc/d...t=3623090#N443)
- Processor: Intel Core 2 Quad Q6600 G0 @ 2.40Ghz (not overclocked)
- BIOS: American Megatrends 5.13 (10/24/2007) no flash available, some areas disabled by HP
- Memory: Corsair XMS 4096MB PC6400 DDR2 800MHz (4 x 2048)
- CPU Cooler: Corsair H50 Hydro Series
- Case: Thermaltake V4 w/ Corsair HX620 pws
- Video: ASUS GeForce GTX 460 1GB GDDR5 PCIe
- OS: Win 7 64bit Ultimate
A bit of explanation...
The H50 was a recent addition after moving to the new case and I started monitoring the CPU temps and I thought they were running too high and I got a couple of BSoDs. After installing the H50 the temps dropped from about 145f (50% CPU load) to around 125f (50% CPU load). I tried moving fans around and that didn't seem to work.
This past weekend, I was to the point that I was thinking that it was the fact that the case I moved to had 1) a bigger power supply and 2) it was located at the top of the case right above the cpu. So, made the choice to move to a new Thermaltake V4 case where the power supply sits at the bottom and it has plenty of air flow. At the same time I took the opportunity to re-seated the pump on the H50. After cleaning off the thermal paste (it comes pre-applied to the copper plate on the pump) I saw some nicks on the copper (see attached photo). I used some Antec Formula 5 (only one available at my local computer store) and applied according to their directions.
After restarting the computer, it seemed that even though the temps would jump up with cpu usage, they would drop back down much faster than before. I breathed a quick sigh of relief. It was a bit too soon. The next morning I decided to play a little WoW since that's where I was seeing the more consistent higher temps, and I was seeing 129f to 133f across all 4 cores. I was not a happy camper. What was a bit surprising was that I did notice that Core 3 was now the core that seemed to get hotter after re-seating, when previously it was Core 0.
Now for the questions...
What could be causing the high cpu temps?
If this was your system, what would be your next steps -- within reason and given the following: I'm limited to a 17" high case. I can't really afford to change the mobo or processor.
Could the fan blowing air into the H50 not be running fast enough? I don't have any control over it thru BIOS.
Should I see about RMA'ing the H50 because of the nicks on the copper plate?
Is the thermal paste supposed to be applied to the heatsink or to the processor? Is the Antec Formula 5 okay to use, it's supposed to be the same as Arctic Silver.
Any suggestions?
Also, I use this system on a daily basis for work, not just for play so it gets a lot of use and I can't have it down, so quick, prompt help is very much appreciated!
Attachments
-
CleanedCopperPlate.jpg
Is there anyway to tell this? Is it telling that I saw the higher temps move from one core (core 0) to a different core (core 3) after I re-seated the pump? I do think that I positioned the pump differently.
I'm really surprised that my system would be able to handle that high of temps, but okay. 
