That's really sad, using the vise method is probably safer, well, probably your next 4770 will have better thermals
You know, I used coolaboratory's liquid pro in the past, and it has excellent thermal properties, but once I almost killed both an Asus MIVE and a 2600K CPU because of it, I was moving these parts to a new case and was about to remove the H100 cooler from the proc but it was bonded to it, I tried gently twisting it but I stopped when I realized I was using too much torque and would probably rip the whole socket from the board.
I finally decided to remove the CPU along with the heatsink, it was almost as if it had been soldered to the cooper plate, I ended up having to wedge a razor blade between the heatsink and the CPU, and almost snapped the blade before it finally gave, the paste had dried to a solid state and effectively bonded my CPU to the H100.
I looked at the syringe filled with the paste, and it had also dried up completely, it had been sitting safely sealed in a cool drawer and was still in its original package and had its cap tightly closed.
I believe the gallium eventually vaporized in less than a year and left nothing but whatever base metal is used to create the alloy, I decided not to use it anymore as this thing was really expensive and had all gone to waste in less than a year! I only used it twice and had to throw almost all of it away, it almost killed my board and CPU too!
I realize it may be much harder to bond the naked silicon on a delided CPU to a heatsink, but that, besides the high risk of even the smallest particle causing a short, makes for a deadly combination...
