New built pc cpu overheating

[DeathtoGnomes]

In a space with forced airflow, MOST of the heat goes where you tell it. If heat is rising it’s because you don’t have enough airflow to exhaust it.

this is exactly why top exhaust fans work more efficiently.

I never suggested mounting fans on the bottom (the 4000D airflow doesn’t even support this configuration)

I never said you did. Although its dated 2011, the bottom-up concept didnt exactly take hold, however, I'd like to see more bottom-up airflow designs even tho it wont happen, aesthetics and all. We wont stop seeing case manufacturers insisting on restricting front intake flow with decorative front panels (glass panels, etc..). At least until they get fed up with negative reviews.

 

[Francisco Medina]

this is exactly why top exhaust fans work more efficiently.

I never said you did. Although its dated 2011, the bottom-up concept didnt exactly take hold, however, I'd like to see more bottom-up airflow designs even tho it wont happen, aesthetics and all. We wont stop seeing case manufacturers insisting on restricting front intake flow with decorative front panels (glass panels, etc..). At least until they get fed up with negative reviews.

That's one of the reasons I chose the Corsair 4000D Airflow.

 

[skizzo]

I checked and this one doesn't come with a plastic cover. It only came witht he pre applied thermal paste.

does this make sense to anyone? how do you package and ship a heat sink with thermal paste pre-applied without foreign debris getting stuck in the paste?! The film that is applied over the paste to keep it clean prior to installation. not having a peel film on it sounds really odd to me. edit: not to mention the mess that would be made with the paste getting stuck onto other surfaces in the packaging

 

[Francisco Medina]

does this make sense to anyone? how do you package and ship a heat sink with thermal paste pre-applied without foreign debris getting stuck in the paste?! The film that is applied over the paste to keep it clean prior to installation. not having a peel film on it sounds really odd to me. edit: not to mention the mess that would be made with the paste getting stuck onto other surfaces in the packaging

When I read your post I thought maybe mine didn't come with a film, but then I checked youtube and confirmed that it didn't come with a film.

 

[skizzo]

When I read your post I thought maybe mine didn't come with a film, but then I checked youtube and confirmed that it didn't come with a film.

thermal paste should be like....paste. very pliable and sticky. how on earth did that not get stuck all over the packaging? if it is stiff or hardened at all that could be influencing your issues with high temps. dried out paste does a poor job of transferring the heat from the chip to the heat sink.

glad you checked to make sure you didn't leave a film cover on the heat sink and it actually doesn't come with one. but now I would really question the quality of said heat sink if the manufacturer doesn't bother to spend less than pennies on pieces of film to cover the thermal paste lol

 

[claes]

this is exactly why top exhaust fans work more efficiently.

I own an FT02 and have tested myself — with fixed fan speeds I get the same temps whether my case is standing up, upside down, or rotated horizontally. Removed the exhaust fan — same results...

Please follow that Puget Systems link. The phenomena you are discussing simply doesn’t happen in cases because the hot air is moved out of the chassis before it gains buoyancy to “rise.” There is no room for natural convection because the hot air is pushed before it has a chance to rise...

From the review, here’s some math:

Let's do a thought experiment to see what we would expect in terms of the bouyancy of hot air inside a chassis, and how that relates to the air pushed by a typical 120mm fan. We'll use an average room temperature of 20C (68F). In our thermal testing, under load with maximum temperatures, we saw chassis panels around 40C average. Let's round it up to 50C so we're sure to give convection the biggest advantage possible. Heck, let's double the average air temperature difference measured, and use 60C.

Density of air at 20C: 1.2041 kg/m^3
Density of air at 60C: 1.067 kg/m^3
Bouyancy of 60C air in 20C air: 0.1371 kg/m^3

A P183 chassis is 0.04 cubic meters in internal volume. Therefore, if you fill an Antec P183 chassis with 60C air, and surrounding air is 20C, the air inside the P183 would have a bouyancy equivalent to the weight of 5.484 grams. That's about the weight of two pennies. How does that translate into air pressure across a top 120mm fan? The column of air coming into play has an air volume of 0.00576 m^3, creating a bouyancy of .79 grams over the fan's area of 144 cm^2. That translates to 0.0054861 grams/cm^2, or 0.54861 mmH20 (the standard unit of measurement for fan static pressure).

That's about half the pressure put out by our Antec TriCool fans on their lowest setting. That means that even one of the lowest pressure, quietest fans that we sell, would *double* the pressure necessary to overcome the air pressure caused by convection, in the hottest scenario we can imagine. And this was after doubling the average air temperature increases we actually measured. When using a 40C average air temperature, an Antec TriCool fan on low setting has 4x the pressure necessary to overcome convection. Given the results of this thought experiment, the results of our emperical testing are making a lot more sense. Convection, while a strong concept in thought, simply does not generate the results necessary to play a discernible role in a typical chassis.

Puget’s test demonstrates this in two ways. First a thermal imaging camera that shows no heat rising in either a bottom-up case (FT02) or in a traditional horizontal layout (Antec P183).

Second, they compare the actual temps at load in both chassis when rotated to an opposite layout. When flipped they perform exactly the same...

All of this demonstrates that whether airflow is commiserate with gravity or not makes no difference in a PC chassis..

Go ahead — test it yourself! I don’t mind being wrong but all of my experience, the exhaustive experience of Mike Chin and Puget building thousands of noise-optimized workstations and playing with ducts and anemometers and thermal imaging etc, and Corsair’s case designers suggests otherwise, FWIW :shrug:

Edit: Added Puget’s theoretical explanation

 

[Francisco Medina]

thermal paste should be like....paste. very pliable and sticky. how on earth did that not get stuck all over the packaging? if it is stiff or hardened at all that could be influencing your issues with high temps. dried out paste does a poor job of transferring the heat from the chip to the heat sink.

glad you checked to make sure you didn't leave a film cover on the heat sink and it actually doesn't come with one. but now I would really question the quality of said heat sink if the manufacturer doesn't bother to spend less than pennies on pieces of film to cover the thermal paste lol

It actually was sticky, I know because I got some in one of my fingers. I think the plastic cover is placed in a way that it leaves a small gap between the plastic and the cpu fan. What is strange is that as you mentioned it doesn't harden in the package.

 

[ColinB123]

Here's a pic of my case with a Fuma 2: I've installed a flat plate (bar) that separates a top (warmer) chamber, from a lower (cooler) chamber (and is also held up by a graphics card support). The Front Top fan, Rear fan and Fuma 2 are linked to the CPU temps (in BIOS), and the Front Bottom, Top Rear fans are linked to the RTX3070's temperature through a utility (Argus Monitor) that over-rides their BIOS settings.

In this way, whether I'm cpu-bound or gpu-bound, I have a set of input and output fans to deal with the heat build-ups.
The cpu rarely gets past 63C, the gpu past 65C (and I've run a LOT of benchmarks). I find Blender is the most stressful of these benchmarks: 'bmw' is quite light-weight, 'fishy-cat' middle-weight, and 'koro' heavy-weight. I tune the system to survive koro.

The 3070 is the big heat generator here, and outputs most of its heat horizontally 'towards the glass'. The bar prevents this heat flowing downwards, and forces everything upwards (where it naturally wants to go anyway).

 

[phanbuey]

even with high ambient temp, and crap cooler, the chip shouldnt be at 90C while gaming - stress test sure, but you should be ~20C lower as gaming uses like 50%-70% of the cpu.

90C while gaming is in the "something is not making contact" category of temperatures. Reset the cooler, repaste if possible.

 

[Deleted member 205776]

even with high ambient temp, and crap cooler, the chip shouldnt be at 90C while gaming - stress test sure, but you should be ~20C lower as gaming uses like 50%-70% of the cpu.

90C while gaming is in the "something is not making contact" category of temperatures. Reset the cooler, repaste if possible.

This.

Reseat the cooler -- I had 90C temps in AIDA64 when I installed my NH-D15 incorrectly, by not screwing it in all the way. Reseated it and screwed it in until the screws stopped turning, never going past 80C in AIDA now.

 

[Francisco Medina]

This.

Reseat the cooler -- I had 90C temps in AIDA64 when I installed my NH-D15 incorrectly, by not screwing it in all the way. Reseated it and screwed it in until the screws stopped turning, never going past 80C in AIDA now.

I’ve done this twice now, without repasting but still having the same temps. I’m getting a fuma 2 next week so I’m going to have to repaste with that.

 

[Deleted member 205776]

I’ve done this twice now, without repasting but still having the same temps. I’m getting a fuma 2 next week so I’m going to have to repaste with that.

Expect lower temps, but not by a lot. Zen 2 and above use the thermal headroom to boost higher.