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Samsung and TSMC Reportedly Struggling with 3 nm Yields

From what I heard from an intel engineer the more we advance the more the numbers of deactivated/non functional transistors count rises. To the point that on "10nm" about 40 to 60% of the transistors fall into that category. Makes you wonder wtf is going on.
Hm, I don't see what that could mean. The transistor is the only type of component that can be manufactured on a chip, and all are the same size (Iit can be a bit different with finfets because the process may allow a combination of two sizes, for example, half are 3-fin and the other half are 2-fin.) But you sometimes need other components in a circuit, and some transistors have to serve as capacitors or (maybe) resistors. Some transistors have to be bigger for high performance, in practice those are two or more transistors connected in parallel. The layout certainly isn't 100% optimised, so there's some unused space (but I gues designers can always put capacitors there).

Here's an article by David Kanter I often recommend, it has many details regarding this same topic, however as an EE with no background in microelectronics, it's not an easy read.

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And here's one issue I'm wondering about, and can't find an answer: CPUS and other types of processors have significant parts of the die dedicated to cache (static RAM). If there's a couple defects in the L2 or L3 area, does that mean that the entire core or an entire L3 slice is unusable - or can just a few cache lines be marked as bad, while the other 99.9% are still operational? The latter would certainly enable much better yields.
 
Hm, I don't see what that could mean. The transistor is the only type of component that can be manufactured on a chip, and all are the same size (Iit can be a bit different with finfets because the process may allow a combination of two sizes, for example, half are 3-fin and the other half are 2-fin.) But you sometimes need other components in a circuit, and some transistors have to serve as capacitors or (maybe) resistors. Some transistors have to be bigger for high performance, in practice those are two or more transistors connected in parallel. The layout certainly isn't 100% optimised, so there's some unused space (but I gues designers can always put capacitors there).

Here's an article by David Kanter I often recommend, it has many details regarding this same topic, however as an EE with no background in microelectronics, it's not an easy read.

***

And here's one issue I'm wondering about, and can't find an answer: CPUS and other types of processors have significant parts of the die dedicated to cache (static RAM). If there's a couple defects in the L2 or L3 area, does that mean that the entire core or an entire L3 slice is unusable - or can just a few cache lines be marked as bad, while the other 99.9% are still operational? The latter would certainly enable much better yields.
That's what yields mean. You have one bad transistor, you throw away the entire chip. Depending on where the defect lies, you can hopefully deactivate some compute hardware, some cache, the IGP and sell that chip as a different SKU. But normally, if you don't have billions of the little guys printed out right, you're screwed.
Remember, transistors in a CPU deal mostly with logic. You can't have a CPU core that will flip, for example, all but the 7th bit. It would be less than useless.
 
The intel engineer was a woman called Rose something (sorry cant remember the name) but the video leaked a few years ago when intel was supposedly struggling to achieve 10nm. And the video was not supposed to be for the masses. I will however try to find it back, iirc techtechpotato was the og source where I found it.
 
Hm, I don't see what that could mean. The transistor is the only type of component that can be manufactured on a chip, and all are the same size (Iit can be a bit different with finfets because the process may allow a combination of two sizes, for example, half are 3-fin and the other half are 2-fin.) But you sometimes need other components in a circuit, and some transistors have to serve as capacitors or (maybe) resistors. Some transistors have to be bigger for high performance, in practice those are two or more transistors connected in parallel. The layout certainly isn't 100% optimised, so there's some unused space (but I gues designers can always put capacitors there).

Here's an article by David Kanter I often recommend, it has many details regarding this same topic, however as an EE with no background in microelectronics, it's not an easy read.

***

And here's one issue I'm wondering about, and can't find an answer: CPUS and other types of processors have significant parts of the die dedicated to cache (static RAM). If there's a couple defects in the L2 or L3 area, does that mean that the entire core or an entire L3 slice is unusable - or can just a few cache lines be marked as bad, while the other 99.9% are still operational? The latter would certainly enable much better yields.
Cache can and usually does have redundancy. See this article about the second Itanium for reference. I've quoted the relevant part below:

The McKinley’s L3 is composed of 135 identical 24 KB sub-blocks. Of these, 128 are used to store data, 5 are used to hold EDC check bits, and 2 are used for redundancy.
 
A whole lot of spoofing going on.. A few points for the confusingly sore (Intel) nanometer army:

>AMD uses "nm" four times in the 7000 series press release from 8/22. It's in the first paragraph. 5nm and 6nm chips from TSMC.


>Alder lake was an Intel designed, 7nm TSMC part. Subsequent Intel parts are Intel design with chip production, packaging from Intel and TSMC.

>A whole yuck-ton of spoofed Intel articles can be found with zero mention of "nm" specifics. Odd..

>So, like, They're all lying to us? Why?


Why is everyone so afraid gate measurement in current processors is in actual nanometers and were going to angstrom next?
 
Cache can and usually does have redundancy. See this article about the second Itanium for reference.
Thanks. Intel was willing to talk about such details two decades ago, now they aren't anymore.
That's what yields mean. You have one bad transistor, you throw away the entire chip. Depending on where the defect lies, you can hopefully deactivate some compute hardware, some cache, the IGP and sell that chip as a different SKU. But normally, if you don't have billions of the little guys printed out right, you're screwed.
Remember, transistors in a CPU deal mostly with logic. You can't have a CPU core that will flip, for example, all but the 7th bit. It would be less than useless.
AMD, Intel and others probably have some redundancy mechanism in place that enables operation of the entire cache, at least the L3, with a single bad transistor in the cache area. If that's the case, it saves a significant number of chips from being recycled, or degraded to a Ryzen 5 or i5.
 
Thanks. Intel was willing to talk about such details two decades ago, now they aren't anymore.
As CPUs grow increasingly more complex, it's expected some of these details will turn into commercial secrets...
AMD, Intel and others probably have some redundancy mechanism in place that enables operation of the entire cache, at least the L3, with a single bad transistor in the cache area. If that's the case, it saves a significant number of chips from being recycled, or degraded to a Ryzen 5 or i5.
Possibly, but without official confirmation, I'm going to assume they don't.
 
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