- Nov 13, 2007
- 6,142 (1.67/day)
- Austin Texas
|Processor||Intel i7 7820X Delidded @ 4.64Ghz / 3.1Ghz Mesh|
|Motherboard||MSI X299 Tomahawk|
|Cooling||240mm Corsair H105 Intake|
|Memory||32 GB Quad 3434Mhz DDR4 15-16-16-38-300-1T|
|Video Card(s)||Gigabyte GTX 1080 Ti Gaming|
|Storage||1Tb Samsung 960 Pro m2, 1TB Samsung 850 Pro SSD|
|Display(s)||Dell 24" 2560x1440 144hz, G-Sync @ 165Hz|
|Case||NZXT S340 Elite Black|
|Audio Device(s)||Arctis 7|
|Power Supply||FSP HydroG 750W|
|Keyboard||corsair k65 tenkeyless|
|Software||Windows 10 64 Bit|
|Benchmark Scores||Cb: 2103 Multi, 209 Single, 10450 Timespy - 10150 GPU/11900 CPU, superpi 1M - 7.71s|
Good thought. Yet still, I cannot help but hope that this sees some sort of success. Because it's Lockheed-Martin, they aren't actually ever going to release anything with this technology themselves, and instead, will liscence it to other companys to produce. The idea we might see a heatsink based on this tech might just not even last that 13 seconds.
In all honesty I would like to see it too... it's time for a bit of a heatpipe revolution.
But having been through the TEC craze and the Danamics Liquid Metal hype, I can't help but be a bit jaded - not at the science - but at the end result. Still if it works... it would be awesome, the scope of application is much more than the initial idea - and that is great thing.