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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
Toshiba Memory Corporation, the world leader in memory solutions, today announced the BG4 series, a new line-up of single package NVMe SSDs with capacities up to 1,024 GB, which places both innovative 96-layer 3D flash memory and an all-new controller into one package to deliver best-in-class read performance. The BG4 series is currently sampling to PC OEM customers in limited quantities, with general sample availability expected later in the second calendar quarter of 2019.
This new series of single package SSDs, featuring PCIe Gen 3.0 x4 lanes, offers sequential read performance up to 2,250 MB/s, and with improved flash management delivers industry-leading random read performance up to 380,000 IOPS. The BG4 single package SSDs are suitable for compact and performance-oriented systems, such as ultra-thin PC notebooks, IoT embedded systems and server boot in data centers.
Additionally, the BG4 series improves upon the prior generation BG3 series in sequential and random write performance by approximately 70% and 90% respectively. Furthermore, power efficiency was improved up to 20% in read and 7% in write by utilizing Toshiba Memory's cutting-edge BiCS FLASH 3D flash memory and a new SSD controller.
The BG4 single package SSD series will be available in four capacities of 128 GB, 256 GB, 512GB, and 1,024 GB, with a slim 1.3 mm height profile for capacities up to 512 GB. Form factor options include a surface-mount M.2 1620 (16 x 20 mm) single package or a removable M.2 2230 (22 x 30 mm) module, enabling more design flexibility for thin and light mobile PCs.
The BG4 SSDs are built upon the NVM Express Revision 1.3b specification and features optional self-encrypting drive (TCG Opal version 2.01) models.
View at TechPowerUp Main Site
This new series of single package SSDs, featuring PCIe Gen 3.0 x4 lanes, offers sequential read performance up to 2,250 MB/s, and with improved flash management delivers industry-leading random read performance up to 380,000 IOPS. The BG4 single package SSDs are suitable for compact and performance-oriented systems, such as ultra-thin PC notebooks, IoT embedded systems and server boot in data centers.
Additionally, the BG4 series improves upon the prior generation BG3 series in sequential and random write performance by approximately 70% and 90% respectively. Furthermore, power efficiency was improved up to 20% in read and 7% in write by utilizing Toshiba Memory's cutting-edge BiCS FLASH 3D flash memory and a new SSD controller.
The BG4 single package SSD series will be available in four capacities of 128 GB, 256 GB, 512GB, and 1,024 GB, with a slim 1.3 mm height profile for capacities up to 512 GB. Form factor options include a surface-mount M.2 1620 (16 x 20 mm) single package or a removable M.2 2230 (22 x 30 mm) module, enabling more design flexibility for thin and light mobile PCs.
The BG4 SSDs are built upon the NVM Express Revision 1.3b specification and features optional self-encrypting drive (TCG Opal version 2.01) models.
View at TechPowerUp Main Site
