News Posts matching #A76

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MediaTek Introduces Dimensity 800U 5G SoC

MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek's Dimensity series family. The 7 nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology. With Dimensity 800U MediaTek continues to accelerate the rollout of 5G technology and deliver premium experiences on mid-tier 5G smartphones.

"MediaTek has always focused on enhancing the user experience with our leading semiconductor technology, whether consumers are streaming, gaming or taking photos," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "MediaTek's Dimensity 800U brings cutting-edge, next-gen technology to the Dimensity SoC series, bringing MediaTek's advanced 5G, imaging and multimedia technologies to high-performance 5G smartphones that deliver incredible 5G experiences."

MediaTek Announces Dimensity 720, its Newest 5G Chip

MediaTek today announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones. The Dimensity 720, is part of MediaTek's 5G chipset family that includes range of chipsets from Dimensity 1000 for flagship 5G smartphones to the Dimensity 800 and 700 series for more accessible 5G mid-tier devices.

"The Dimensity 720 sets a new standard, delivering feature-packed 5G experiences and technology to devices that are more accessible to mass market consumers," said Dr. Yenchi Lee, Deputy General Manager, Wireless Communications Business Unit, MediaTek. "This chip is highly power-efficient, has impressive performance and advanced display and imaging technologies. All of that combined will help brands usher in differentiated 5G devices for consumers around the globe."

UNISOC Launches Next-Gen 5G SoC T7520 on 6 nm EUV Manufacturing Node

UNISOC, a leading global supplier of mobile communication and IoT chipsets, today officially launched its new-generation 5G SoC mobile platform - T7520. Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption.

T7520 is UNISOC's second-generation 5G smartphone platform. Built on a 6 nm EUV process technology and empowered by some of the latest design techniques, it offers substantially enhanced performance at a lower level of power consumption than ever.

An ARM to Rule Them All: ARM 76 To Challenge x86 Chips in the Laptop Space?

ARM has announced their next, high-performance computing solution with their A76 design, which brings another large performance increase to the fledgling architecture. having been touted for some time as a true contender to the aging x86 architecture, ARM has had a way of extracting impressive performance increases with each iteration of its computing designs, in the order of 20% do 40% performance increases in an almost annual basis. Compare that to the poster-child of x86 computing, Intel, and its passivity-fueled 5 to 10% yearly performance increases, and the projections aren't that hard to grasp: at some point in time, ARM cores will surpass x86 in performance - at least on the mobility space.

The new ARM A76 design, to be manufactured on the 7 nm process, brings about a 35% increase in performance compared to last years' A75. This comes with an added 40% power efficiency (partly from the 10 nm to 7 nm transition, the rest from architecture efficiency and performance improvements), despite the increase to maximum 3.0 GHz clocks. With the added performance, ARM is saying the new A76 will deliver 4x the Machine Learning performance of its previous A75 design.
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