ASUS Republic of Gamers (ROG) today announced the new ROG Ryujin III series of all-in-one CPU coolers, with six different models to choose from. Armed with the latest 8th gen Asetek pump, a larger embedded pump fan, and a beefy 240 mm or 360 mm radiator, these units stand ready to tame CPU heat without breaking a sweat. Three style options cater to any aesthetic, and the customizable 3.5-inch LCD display helps users personalize their PC like never before.

To ensure there is an ROG Ryujin III AIO cooler in the perfect style for any build, ROG is launching several new variants. For builders who love the pristine surfaces of an all-white build—and the way that this finish uniquely reflects RGB LED lighting—ROG offers the Ryujin III 240 ARGB White Edition and the Ryujin III 360 ARGB White Edition. For those who prefer classic black, the ROG Ryujin III 240 ARGB and Ryujin III 360 ARGB beckon.

GAMDIAS, a leading gaming peripherals manufacturer, has announced the launch of the BOREAS P1-720 dual tower CPU air cooler. Engineered to provide exceptional cooling power, this cooler features a dual asymmetrical heat sink, 7 copper heat pipes, and 2 high-performance PWM fans that work together to maintain low temperatures even during heavy gaming sessions or overclocking.

The BOREAS P1-720 boasts an impressive TDP rating of 270 W, and the dual tower configuration includes two dense aluminium fins that provide a large heat dissipation surface area. The cooler also features an optimized convex copper base design that provides seamless contact with the CPU surface, improving heat transfer capabilities and further increasing the efficiency of thermal conductivity. In addition to its outstanding cooling performance, the BOREAS P1-720 also features a premium all-black design that will complement any system setup. The cooler is fully coated with an all-black finish and has a brushed aluminium finish that gives it a sleek and stylish look.

GELID today announced the largest variant of its Liquid Ultimate line of all-in-one liquid CPU coolers. The series that had debuted in February 2023 with 120 mm and 240 mm radiator size variants, is now being joined with one that uses a 360 mm radiator, hence the name Liquid 360 Ultimate. Its pump-block is characterized by an infinity-mirror ornament that's framed by addressable-RGB, and which features a tiny 2-digit seven-segment display that shows you coolant temperature in real-time.

Each of the three included Smart ARGB PWM 120 mm fans features an infinity-mirror on the impeller hub, which also puts out ARGB LED illumination that's diffused by the frosty-white impeller. Each fan provides an airflow of up to 61.9 CFM, with a speed range between 750 to 1,800 RPM; up to 1.67 mm H₂O static pressure, and 29.6 dBA maximum noise. The fans feature hydro-dynamic bearings that are rated for 50,000 hours. The GELID Liquid 360 Ultimate offers cooling capacity of over 300 W. Among the CPU socket types supported are LGA1700, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Air-based CPU cooling maestros Thermalright are expanding their liquid-based cooler portfolio with the addition of two white color-schemed coolers under the Frozen Prism White series. These include two models based on the radiator size—the Frozen Prism White 360, and the Frozen Prism White 240. Their design sees white cover everything from the radiator frames, to the radiator fins, the fiber sleeving of the coolant tubes, the included fans, their frames and impellers; and of course the pump-block itself.

An illuminated ARGB ornament on top of the pump-block; and the illuminated fans, make up their lighting setup. These use standard 3-pin ARGB headers. Each of the included TL-E12W-S V2 fans turns at speeds of up to 1,850 RPM, pushing up to 70.4 CFM of airflow, at 2.64 mm H₂O static pressure. Among the CPU socket types supported by the Frozen Prism series are Intel Socket LGA1700, LGA1200, LGA2066, and LGA115x; and AMD Socket AM5 and AM4. The company didn't reveal pricing.

There is now an Amazon Basics CPU air cooler that works with Intel Socket LGA1700 and AMD Socket AM5. Called simply the CPU Air Cooler (model: RR-H410-20PC-AS), it features a conventional aluminium fin-stack tower-type design, and uses four copper heatpipes that make direct contact with the CPU at the base. A 92 mm fan ventilates the cooler. This fan is RGB illuminated and includes a controller. The fan turns at speeds ranging between 600 to 2,000 RPM, pushing up to 34.73 CFM of airflow, and features a conventional rifle bearing.

The cooler itself measures 102 mm x 83.4 mm x 136 mm (WxDxH), and Amazon Basics claims that it can handle thermal loads of up to 200 W. Amazon Basics usually brings otherwise obscure white-box brands into the market under its marquee so customers with confidence in the Amazon brand can buy them. In this case, the retail giant roped in no less than Cooler Master as the OEM for this cooler. The cooler itself appears to be a rebadged version of the Hyper H410R RGB, but with updated retention modules to support the latest CPU socket types. Amazon Basics is pricing this at $28.47. You can catch a review at the source link.

Leading global motherboard manufacturer ASRock proudly announces its new series of AMD A620 motherboards. The latest AMD A620 platform aims at a more budget-friendly market while still offering a wide variety of features, such as DDR5 memory support, multiple M.2 slots for NVMe storage devices, and WiFi 6E for daily tasks as well as gaming.

To maximize the affordability of the AMD A620 platform, ASRock offers four models, including both 4 and 2 DIMMs motherboard layout options. If 4 DDR5 memory is a must for your next build, the A620M Pro RS will definitely be the number one choice. It offers a luxurious amount of USBs including Type-C for both front and rear panels, 3 M.2 Key-M onboard and 2 of which support PCIe Gen 4 x4 to give multiple storage options. With a 6-layer PCB and Dr.MOS for Vcore design, A620M Pro RS can fully support the latest AMD Ryzen 7000 Series Processors. A620M Pro RS also comes with a WiFi 6E variant the A620M Pro RS WiFi, an all-rounder choice for wireless environments.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest AMD A620 series motherboards with optimal memory performance and all-round features. With the perfect support of the latest AMD Ryzen 7000 series processors, GIGABYTE A620 motherboards deliver the most competitive AM5 platform for users to enjoy performance flexibly and affordably.

Enhanced by GIGABYTE exclusive layout design and BIOS setting, the A620 lineup can achieve optimal memory performance of DDR5 EXPO/XMP overclocking up to DDR5-6400, which exerts the utmost value and performance of the AM5 platform. Boasted with comprehensive features, GIGABYTE A620 motherboards can best fit users' needs and budget, and become the best choice for users who plans on stepping up to the latest AM5 platform.Meanwhile, GIGABYTE's A620 motherboards boast the innovative PCIe EZ-Latch technology to simplify the upgrade of graphics cards, and to avoid accidental damage to the surrounding components. By GIGABYTE exclusive Q-Flash Plus feature, users can update the BIOS without installing any processor, memory, or even graphics card, making it possible for users to easily enjoy the benefits brought about by the new BIOS code and processors. Further with GIGABYTE GCC software platform, GIGABYTE delivers the competitive A620 platform with user-friendly features and multiple form factor options which covers Micro ATX to Mini ITX.

Here's the first picture of the GIGABYTE A620M Gaming X, a product the company is targeting at the entry-level gaming PC crowd. The Socket AM5 Micro-ATX motherboard is based on the AMD A620 chipset, which lacks CPU overclocking, and limits both PEG and M.2 PCIe to Gen 4. The board draws power from a 24-pin ATX and 8-pin EPS power connectors; and uses an 8+2 phase VRM to condition power for the processor. You get four DDR5 DIMM slots, and expansion slots that include a PCI-Express 4.0 x16, and a PCI-Express 3.0 x1.

Storage connectivity on the GIGABYTE A620M Gaming X includes an M.2 slot with PCI-Express 4.0 x4 wiring from the processor, and four SATA 6 Gbps ports from the A620 FCH. The M.2 slot gets an included M.2-2280 heatsink. Display outputs include HDMI and DisplayPort. Networking is care of a 1 GbE wired Ethernet backed by a Realtek controller; and a basic 6-channel HD audio solution consisting of a Realtek ALC887 CODEC, electrical isolation, and audio-grade capacitors. You get two 10 Gbps USB 3.2 ports, one of which is type-C. Four 5 Gbps USB 3.1 ports (two type-A on the rear panel, two via headers); and a handful USB 2.0 ports, make for the rest of it. The board's empty traces suggest that GIGABYTE has the option to create a variant that includes WiFi.

In no mood to cede its market-share growth to Intel, AMD has reportedly decided to accelerate the development of its next-generation "Zen 5" microarchitecture for debut within 2023. In its mid-2022 presentations, AMD had publicly given "Zen 5" a 2024 release date. This is part of a reading-in-between the lines for a recent GIGABYTE press release announcing server platforms powered by relatively low-cost Ryzen desktop processors. The specific sentence from that release reads "The next generation of AMD Ryzen desktop processors that will come out later this year will also be supported on this AM5 platform, so customers who purchase these servers today have the opportunity to upgrade to the Ryzen 7000 series successor."

While the GIGABYTE press release speaks of a next-generation Ryzen desktop processor, it stands to reason that it is referencing an early release of "Zen 5," and since AMD shares the CPU complex dies (CCDs) between its Ryzen client and EPYC server processors, the company is looking at a two-pronged upgrade to its processor lineup, with its next-generation EPYC "Turin" processor competing with Xeon Scalable "Emerald Rapids," and Ryzen "Granite Ridge" desktop processors taking on Intel's Core "Raptor Lake Refresh" and "Meteor Lake-S" desktop processors. It is rumored that "Zen 5" is being designed for the TSMC 3 nm node, and could see an increase in CPU core count per CCD, up from the present 8. TSMC 3 nm node goes into commercial mass-production in the first half of 2023 as the TSMC N3 node, with a refined N3E node slated for the second half of the year.

A PCB drawing of a possible AMD A620 chipset Micro-ATX motherboard by MSI has surfaced. The drawing looks like that of a product designed to be priced well under the $100-mark. The Socket AM5 motherboard draws power from a 24-pin ATX and 8-pin EPS power connectors. A simple 8-phase VRM with LFPAK discrete MOSFETs condition power for the processor, which is wired to two DDR5 DIMM slots, an M.2 NVMe slot (possibly limited to Gen 4 bandwidth, if not Gen 3); and a PCI-Express x16 with Gen 3 bandwidth, if not Gen 4. The only other expansion slot is a PCI-Express 3.0 x1. There are four SATA ports on offer, Display connectivity appears to include HDMI and D-Sub. 6-channel HD audio and a 1 GbE wired network connection make for the rest of it. AMD is expected to begin rolling out cost-effective motherboard based on the A620 later this week.

Thermaltake today launched the ToughAir 710, a premium dual aluminium fin-stack CPU cooler. Measuring 148.6 mm x 146.6 mm x 165 mm (LxWxH), the TA710 is a massive, heavyweight category cooler (with its weight expected to be around the 1 kg-mark). The cooler features a U-type dual fin-stack design. Seven 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU over a base of the same material, with their ends passing through the two fin-stacks. These are ventilated by a pair of 140 mm fans in push-pull configuration, with the second fan nested between the two stacks.

Each of the two included ToughFan 14 spinners turns at speeds of up to 1,400 RPM, pushing up to 81.96 CFM of airflow at 1.81 mm H₂O static pressure, and 23.9 dBA noise output. The fans are rated for 40,000 hours of use. Thermaltake rates the ToughAir 710 as being capable of handling thermal loads of 250 W. Among the CPU socket types supported are LGA1700, LGA2066, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Cost-effective Socket AM5 motherboards are finally on the horizon, as the first marketing pictures emerged of an ASRock-branded motherboard based on the yet-unreleased AMD A620 chipset. A successor to the A520 and A320, the A620 provides the bare-minimum feature-set for the platform, and cuts out certain premium features such as CPU overclocking. The chipset limits the x16 PEG connection from the processor to Gen 4, although motherboard vendors are free to provide just Gen 3 x16. The CPU-attached M.2 NVMe interface, too, is limited to Gen 4. This ASRock motherboard appears to be offering a Gen 3-capped M.2 NVMe slot, going by the "Hyper M.2" branding that ASRock uses for Gen 3 M.2 slots. The board offers an additional M.2 NVMe slot that's wired to the A620 chipset, and interestingly, an M.2 E-key slot for WLAN modules.

The ASRock A620M-HDV/M.2 from the pictures below, is a Micro-ATX motherboard that draws power from a 24-pin ATX and a single 8-pin EPS. It offers the simplest possible 6-phase CPU VRM, with what look like 50 A DrMOS. Besides the two M.2 NVMe slots, the only storage connectivity on offer are two SATA 6 Gbps ports. Display connectivity include DisplayPort and HDMI. We count at least four type-A USB 3.x ports on the rear I/O, besides one USB type-C, and a USB 3.x internal header. 1 GbE wired networking, and 6-channel HD audio using the most basic CODEC, make for the rest of the connectivity. An interesting touch is USB BIOS Flashback, with a button on the rear I/O, which sets even the oldest inventories of this board up for future-generation Socket AM5 Ryzen processors. Motherboards based on the A620 are expected to be priced well under the $100-mark.

Despite the fact that AMD promised that $125 AM5 are coming, there aren't many such motherboards on the market. The newest addition is the Gigabyte B650M K, which is now available at $124.99. Gigabyte's B650M K will be joining the previously available ASRock B650M-HDV/M.2 microATX motherboard, which was the first B650-based motherboard available at $125.

Same as the ASRock motherboard, the Gigabyte B650M K is also a micro-ATX motherboard with the same 8+2+1 VRM, but features four DIMM slots with support for up to 128 GB of DDR5-6400+ memory. Unfortunately, it apparently features two PCIe 4.0 M.2 slots, rather than a PCIe 5.0 x4, and comes with a single PCI-Express 4.0 x16 slot (in addition to the PCIe 3.0 x1). The rest of the specifications include Realtek's Audio, Realtek 2.5 Gb Ethernet, couple of USB 3.2 Gen 2 Type-C, Type-A, and USB 2.0/1.1 ports, as well as DisplayPort 1.4 and HDMI 2.1 outputs. Bear in mind that both of these are $139.99 motherboards, discounted down to $124.99, so hopefully, we'll see more of these $124.99 motherboards soon.

ASRock today introduced the Blazing M.2 Gen 5 Fan-Heatsink, an active cooling solution for M.2 Gen 5 SSDs, and meant to be paired with the company's Socket AM5 and LGA1700 motherboards that have Gen 5 M.2 slots. The cooler is a 5 cm-tall hunk of extruded aluminium with a 30 mm fan ventilating it at roughly 5 CFM. There are five types of these coolers, each suitable for a particular type of ASRock motherboards. These coolers have been out since December 2022 as inclusions in motherboards, however, ASRock released the types 3, 4, and 5 (from the table below) today. The cooler is said to significantly lower temperatures of SSD controllers, minimizing performance losses to thermal throttling. These coolers are expected to be priced around $30 a pop.

While Intel 600- and 700-series chipset motherboard already support non-binary memory modules and kits, such support has yet to be implemented on AMD's AM5 motherboard, but, judging from screenshots posted on ASUS ROG forums, AMD motherboard partners are working on it and it should be just around the corner.

The screenshot from ASUS Tech Marketing person, named Raja, which was posted on ASUS ROG forums, shows the ASUS ROG STRIX X670-E motherboard running 192 GB of DDR5 memory. These are four 48 GB Corsair modules running at 2600 MHz (5200 MT/s). The post includes both CPU-Z and task manager screenshots, confirming it boots into Windows. Earlier, it has been reported that AMD motherboards can't boot into Windows with non-binary memory modules and kits, although the motherboard successfully recognizes it. There have also been rumors that AMD is working on an AGESA update that will fix this issue, and now, it looks like it could be coming sooner than we expected.

AMD is working on the AGESA 1.0.0.7 BIOS update that should resolve issues and bring support for 24 GB and 48 GB DDR5 memory modules and kits on the AM5 platform. The latest report, coming from Twitter, suggest that AMD is working hard on the AGESA release, so motherboard manufacturers could push BIOS updates early next month or in May. While Intel's 600- and 700-series motherboards are happily working with 24 GB and 48 GB DDR5 memory modules and kits, allowing users to use up to 192 GB (4x48 GB) of memory in their systems, it comes as a surprise that AMD did not release an official, or even a BETA BIOS update for such modules.

There were already reports that such 24 GB and 48 GB DDR5 modules are having issues on AMD's AM5 platform and while the BIOS can detect the memory, it simply will not boot into Windows. This latest report originally comes from hardware leaker chi11eddog over at Twitter, and suggests that AMD and its motherboard partners are well aware of the issue and the AGESA BIOS firmware v1.0.0.7 should bring full support for so-called "non-binary" 24 GB and 48 GB DDR5 memory modules.

Thermalright introduced the Ryzen Mounting System upgrade kit that lends support for Socket AM5 and AM4 to many of its legacy coolers, letting you orient them the correct way. There are two types of these upgrade kits, that support two different kinds of Thermalright's coolers. The TR-AM5-A kit is meant for TRUE Spirit 90 series, Archon IB-E X2 series, Silver Arrow ITX, TRUE Spirit 140 series, and TRUE Spirit 90 series. The TR-AM5-B kit, on the other hand, is meant for the Silver Arrow SB-E series, AXP-200 R, AXP-200 Macho, Archon SB-E, and Silver Arrow ITX-R. These kits aren't free, and when they go on sale later this month, they will be priced around $9.99.

Jonsbo today released the HX5230, a mid-range tower-type CPU cooler. The cooler features an all-black tower-type design, Five 6 mm-thick nickel-plated copper heatpipes make indirect contact with the processor over a mirror-finish copper base, conveying heat through the anodized aluminium fin-stack, which is ventilated by a 120 mm fan. The fin-stack is capped by a die-cast aluminium top-plate that has a premium brushed-metal appearance. The included fan features a fluid-dynamic bearing, takes in 4-pin PWM input, and turns at speeds ranging between 700 to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 2.68 mm H₂O static pressure, and up to 37.6 dBA noise output. Jonsbo claims that the HX5230 can handle thermal loads of up to 230 W. With its fan in place, the cooler measures 128 mm x 75 mm x 158 mm (WxDxH), weighing 704 g. Among the socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

Jonsbo today unveiled the HP400S-New, a top-flow, low-profile CPU cooler with a claimed thermal capacity of 140 W, and with a height of just 40 mm. A major revision of the HP400S from February 2022, the "-New" revision uses a thicker fin-stack and a faster fan. The cooler uses a dense aluminium fin-stack heatsink with a C-type design. Four 6 mm-thick nickel-plated copper heatpipes make direct contact with the CPU at the base, conveying heat to an aluminium fin-stack arranged along the plane of the motherboard. This is then ventilated by a 15 mm-thick 90 mm fan that turns between 900—3,000 RPM, with 12.59—38.18 CFM of airflow, and 20.2—34 dBA noise output. With the fan in place, the cooler measures all of 103 mm x 92 mm x 40 mm, weighing 350 g. Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GELID Solutions unveils the new GELID Liquid 240 Ultimate AIO CPU Cooler as a product of the GELID Solutions GAMER product line. The epitome of superior liquid cooling technologies the GELID Liquid 240. Ultimate cooling performance is provided by its premium-class high-density radiator, connected with two 120 mm quiet fans (Smart ARGB PWM control) and high-class water pump with the most demanding modern needs being handled by the integrated cooling.

The low noise water pump includes a temperature display. Further the 2 ARGB PWM Fans provide 750-1800 RPM and low noise level at 29.6dBA, AIO240 is the masterpiece of top-notch liquid cooling technologies. The all-in-one cooling handles the latest requirements, even the most powerful LGA 1700 CPU from Intel( ) and AM5 from AMD, a truely multi compatible All-in-One CPU water cooler. The support of TDP over 240 W makes the GELID Liquid 240 an overkill CPU AIO cooling solution for pro gamers and overclockers.

ASUS began rolling out Beta UEFI firmware updates for its Socket AM5 motherboards encapsulating AGESA 1.0.0.5 patch-C microcode. This exposes several new options to end-users through the UEFI Setup Program, which gives them greater control over the way the processor prioritizes workload among the two CCDs (CPU complex dies) on 12-core and 16-core Ryzen 7000 series processors, including the upcoming 7000X3D processors.

While AMD is working to release Chipset Software updates that include "3D V-cache Optimization driver" components that introduce OS-level awareness of the asymmetric implementation of 3D V-cache on the 7900X3D and 7950X3D where only one of the two CCDs has the additional cache; these firmware-level options give users control on prioritizing one CCD over the other for workload. The firmware-level optimization is OS-agnostic, so pretty much any OS should benefit from 3D V-cache the way it was intended (where less parallelized workloads such as games are prioritized on the CCD with the 3D V-cache.

Dynatron focuses on server/workstation cooling solutions, and developed the A49, a Socket AM5 cooler with a dual aluminium fin-stack heatsink that's designed to work with 4U rackmount cases, although it will fit inside ATX tower cases just fine, with its 130 mm height. Two dense aluminium-alloy fin-stacks are skewered by six 6 mm-thick copper heat pipes that make direct contact with the processor over a high-performance thermal pad. The heatsink is ventilated by a custom 103 mm x 103 mm x 30 mm fan that turns at speeds of up to 1800 RPM, pushing up to 35.03 CFM of airflow at 28.8 dBA noise output, and 1.16 mm H₂O static pressure. Dynatron says the cooler can handle thermal loads of up to 170 W. The cooler measures 95 mm x 95 mm x 130 mm, weighing 710 g.