News Posts matching #AMD

Return to Keyword Browsing

AMD RDNA 3 GPUs to Support DisplayPort 2.0 UHBR 20 Standard

AMD's upcoming Radeon RX 7000 series of graphics cards based on the RDNA 3 architecture are supposed to feature next-generation protocols all over the board. Today, according to a patch committed to the Linux kernel, we have information about display output choices AMD will present to consumers in the upcoming products. According to a Twitter user @Kepler_L2, who discovered this patch, we know that AMD will bundle DisplayPort 2.0 technology with UHBR 20 transmission mode. The UHBR 20 standard can provide a maximum of 80 Gbps bi-directional bandwidth, representing the highest bandwidth in a display output connector currently available. With this technology, a sample RDNA 3 GPU could display 16K resolution with Display Stream Compression, 10K without compression, or two 8K HDR screens running at 120 Hz refresh rate. All of this will be handled by Display Controller Next (DCN) engine for media.

The availability of DisplayPort 2.0 capable monitors is a story of its own. VESA noted that they should come at the end of 2021; however, they got delayed due to the lack of devices supporting this output. Having AMD's RDNA 3 cards as the newest product to support these monitors, we would likely see the market adapt to demand and few available products as the transition to the latest standard is in the process.

AMD Clarifies Ryzen 7000 "Zen 4" TDP and Power Limits: 170W TDP, 230W PPT

The mention of "170 W" in one of the slides of AMD's Computex 2022 reveal of the upcoming Ryzen 7000 "Zen 4" desktop processors, caused quite some confusion as to what that figure meant. AMD issued a structured clarification on the matter, laying to rest the terminology associated with it. Apparently, there will be certain SKUs of Socket AM5 processors with TDP of 170 W. This would be the same classical definition of TDP that AMD has been consistently using. The package-power tracking (PPT), a figure that translates as power limit for the socket, is 230 W.

This does not necessarily mean that there will be a Ryzen 7000-series SKU with 170 W TDP. AMD plans to give AM5 a similar life-cycle to AM4, which is now spanning five generations of Ryzen processors, and the 170 W TDP and 230 W PPT figures only denote design goals for the socket. AMD, in a statement, explained why it needed to make AM5 capable of delivering much higher power than AM4 could—to enable higher CPU core-counts in the future, more on-package hardware, and for new capabilities like power-hungry instruction-sets (think AVX-512). AMD has been calculating PPT as 1.35 times TDP, since the very first generation of Ryzen chips. For a 105 W TDP processor, this means 140 W PPT, and the same formula continues with Ryzen 7000 series (230 W is 1.35x 170 W).
The AMD statement follows.

Biostar Shows Off X670E Valkyrie at Computex 2022

Biostar is seemingly trying to become more competitive in the consumer motherboard market and although the company has some catching up to do with the tier one motherboard brands, the company has put out some more interesting products in the past couple of years. Its VX670E Valkyrie motherboard seems to sit near the middle of the X670E models that have been announced so far, although it's a little bit hard to tell, as the company only provided partial specs. As this is an AMD X670E based board, the PCIe x16 slot is using PCIe 5.0, although it's multiplexed with the second x16 slot, which means if both slots are used, the bandwidth drops down to eight lanes per slot. The board layout doesn't suggest any PCIe 5.0 M.2 slots, but as this is mandatory on X670E board, we have to presume that the M.2 slot right below the x16 PCIe slot, is the PCIe 5.0 one. The board has a further three M.2 slots, as well as what appears to be an empty M.2 E-keyed slot for a WiFi/Bluetooth module.

Other features listed by Biostar includes 2.5 Gbps Ethernet via a Realtek chip, HDMI and DisplayPort outputs, six SATA 3 ports, one rear and one front header for USB Type-C Gen 3.2 2x2 (20 Gbps) ports, as well as Realtek based audio and a pair of ARGB headers. The board also has a debug LED and a few buttons and switches for resetting the CMOS, and powering the board on. Interestingly, Biostar also provided figures for the memory clock speed, as the company listed support for up to four sticks of DDR5 memory at 5600 MHz plus. AMD has already demoed higher memory clocks of 6000 and even 6400 MHz during its keynote, as supported by the footnotes that went alongside it, suggesting that this might just be a placeholder. Intel officially only supports 4800 MHz DDR5 memory, but speeds in excess of 6000 MHz doesn't appear to be an issue with the right motherboard and CPU combination. We'll have to wait and see what the official figures will be from AMD.

Team Group's DDR5 Industrial Server Memory Officially in Mass Production

To usher in the new era of DDR5 and satisfy the demands for precise, high-performance, real-time computing, and computer multi-tasking in servers, data centers, and industrial computers, the world-leading memory brand TEAMGROUP is officially announcing today that TEAMGROUP's DDR5 Industrial Server Memory is now in mass production. The DDR5 Industrial Server Memory targets applications in high-end servers and large databases and is integrated with TEAMGROUP's patented technology, welcoming a total upgrade for next-generational servers such as Intel Eagle Stream and AMD Zen 4 Genoa.

TEAMGROUP's DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules can reach speeds of up to 6400MT/s and storage capacities of up to 128 GB, with total energy consumption reduced to 1.1 V. TEAMGROUP has also introduced Row Hammer Protection Technology to support the DFE (Decision Feedback Equalization) function to offer robust support for data storage. The memory is equipped with TEAMGROUP's patented "TRUST technology", which stands for Temperature, Robust, Unique, S.M.A.R.T. technology, and Trusty. With the TRUST technology, the industrial server memory can ensure reliable performance under harsh environments of high temperatures, high humidity, sulfurization, vibration, and shock as well as improving the overall reliability and durability of the product to guarantee that the memory can satisfy the diversified demands of next-gen servers. In addition, the DDR5 Industrial Server Memory has adopted a brand new framework. The greatest difference between the DDR5 and DDR4 server memories is that the power management is now transferred onto the DIMM, in other words, TEAMGROUP has optimized redundant circuit designs on the server, providing its DDR5 products a greater system stability, lower power consumption, better performances, larger capacities, and more stable signals.

GIGABYTE Provides the Perfect Thermal Solution for Socket AM5 Motherboards

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced all AIO liquid coolers lineup and tower fans for multi-platform are attached with brackets for Socket AM5 to support the new coming AMD motherboards, which provides users the optimal CPU heat dissipation and hands-down system upgrade without changing coolers.

Considering the inconvenience of upgrade CPU fans along with platforms, GIGABYTE always takes into account of the platform variation in the initial design stage of Cooler and tower fan. After confirmed the continuity of AM4 brackets on the Socket AM5 platform, GIGABTYE proved that all AIO liquid coolers lineup and tower fans can provide the optimal thermal performance to the new platform through rigorous tests. For users who has bought GIGABYTE coolers or tower fans designed for multi platforms, no change or adjustment will be needed to suffice the new platform.

AMD Expands Confidential Computing Presence on Google Cloud

AMD today announced new Confidential virtual machines (VMs) on the existing the N2D and C2D VMs on Google Cloud, all powered by AMD EPYC processors. These VMs extend the AMD EPYC processor portfolio of Confidential Computing on Google Cloud with the performance of 3rd Gen EPYC processors in compute-optimized VMs.

A key Confidential Computing component provided by AMD EPYC processors is AMD Secure Encrypted Virtualization (SEV), part of AMD Infinity Guard. This advanced hardware-based security feature encrypts full system memory and individual virtual machine memory as well as isolating the VM memory from the hypervisor, without dramatically impacting performance. With the expansion of Confidential Computing in N2D and C2D VMs, Google Cloud customers now have access to advanced hardware enabled security features powered by 3rd Gen AMD EPYC processors that will help protect sensitive, wide-variety workloads.

AMD EPYC "Bergamo" 128-core Processor Based on Same SP5 Socket as "Genoa"

AMD is launching two distinct classes of next-generation enterprise processors, the 4th Generation EPYC "Genoa" with CPU core-counts up to 96-core/192-thread; and the new EPYC "Bergamo" with a massive 128-core/256-thread compute density. Pictures of the "Genoa" MCM are already out in the wild, revealing twelve "Zen 4" CCDs built on 5 nm, and a new-generation sIOD (I/O die) that's very likely built on 6 nm. The fiberglass substrate of "Genoa" already looks crowded with twelve chiplets, making us wonder if AMD needed a larger package for "Bergamo." Turns out, it doesn't.

In its latest Corporate presentation, AMD reiterated that "Begamo" will be based on the same SP5 (LGA-6096) package as "Genoa." This would mean that the company either made room for more CCDs, or the CCDs themselves are larger in size. AMD states that "Bergamo" CCDs are based on the "Zen 4c" microarchitecture. Details about "Zen 4c" are scarce, but from what we gather, it is a cloud-optimized variant of "Zen 4" probably with the entire ISA of "Zen 4," and power characteristics suited for high-density cloud environments. These chiplets are built on the same TSMC N5 (5 nm EUV) process as the regular "Zen 4" CCDs.

MSI Unveils its New Lineup at COMPUTEX 2022 Online

COMPUTEX 2022 is set to kick off starting from May 24. In addition to the physical show, the hosts simultaneously hold 2 online exhibitions: COMPUTEX DigitalGo and COMPUTEX CYBERWORLD. This year, Taiwan's largest tech expo will revolve around six core themes: Accelerating Intelligence, Connected X-Experience, Digital Resilience, Innovative Computing, Sustainability, and Innovations & Startups.

MSI, is ready to flex its muscles at the tech event. "We are proud to announce Titan GT77, the double winner of COMPUTEX 2022 Best Choice Golden Award and red dot 2022, along with other award-winning products that manifest MSI's continuous innovation and dominance in gaming, content creation, and business & productivity lineups on a global scale, " says Sam Chern, MSI Marketing Vice President.

Hands On with the new Gigabyte X670 Motherboards at Computex 2022

Computex 2022 is what's being referred to as a hybrid show and although most of the motherboard manufacturers chose not to exhibit this year, Gigabyte was at the show and we got to take a closer look at its new AM5 motherboards. Gigabyte was only showing four models, but on the plus side, the staff at the booth was more than happy to share details about the boards with us. The four boards on display were the X670E Aorus Xtreme, the X670E Aorus Master, the X670E Aero D and the X670 Aorus Pro AX. Note that these were early board revision and the E is missing in the model name from three of the models, which suggests that AMD hadn't informed the board makers about this distinction between its chipsets until earlier this month when rumours about it started to appear online.

Gigabyte will have a full lineup of boards coming later this year when AMD launches its AM5 platform, although based on the information we were given, the majority of its boards will be based on the B650 chipset. We should point out that there will be high-end B650 motherboards that will be priced similar to lower-end X670 models, which means that buying AM5 motherboards will be highly dependent on what features you favour. Unfortunately no B650 motherboards were on display and we won't be sharing any details of these models at this time. As for the X670E versus X670 chipsets, as there are of course two per board, it seems like the difference comes down to PCIe 5.0 or PCIe 4.0 for the x16 PCIe slot as the major differentiator between Gigabyte's different SKUs.

AMD Unveils 5 nm Ryzen 7000 "Zen 4" Desktop Processors & AM5 DDR5 Platform

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

ASUS Shows Off the ROG Crosshair X670E Extreme

Although AMD didn't provide too many details during its Computex 2022 keynote speech about the upcoming AM5 platform, the company did announce that there will be at least three chipsets for the platform and showed pictures of some upcoming motherboards. ASUS has kindly filled in some more details about its upcoming ROG Crosshair X670E Extreme, which will be one of its higher-end models. Sadly the pictures posted are kind of tiny and the company didn't provide a shot of the rear I/O. That said, ASUS did point out some of its new features that we can expect to find on the ROG Crosshair X670E Extreme.

For starters, the board will have a pair of PCIe 5.0 x16 slots, although each slot is likely to only have eight lanes each, when both slots are in use, but ASUS doesn't mention any details here. The board has support for up to five M.2 NVMe SSDs, four of which support PCIe 5.0. Only two are onboard, with the other three being via ASUS' proprietary ROG PCIe 5.0 M.2 card and ROG GEN-Z.2 card. ASUS also promises USB4 support, as well as a USB 3.2 Gen 2x2 header with Quick Charge 4+ as well as up to 60 W charging support, for cases with a front USB-C port. On top of the rear I/O is an AniMe Matrix LED display that can be user customised.

Game. Create. Anywhere. Introducing the CORSAIR VOYAGER a1600 Gaming & Streaming Laptop AMD Advantage Edition

CORSAIR, a world leader in high-performance gear and systems for gamers, content creators, and PC enthusiasts, today unveiled its innovative first gaming and streaming laptop, the CORSAIR VOYAGER a1600 AMD Advantage Edition. Combining a powerful AMD Ryzen 6000 Series processor, AMD Radeon RX 6800M mobile graphics with CORSAIR and Elgato's vast ecosystem of exclusive software and technologies, the CORSAIR VOYAGER a1600 is a laptop like no other. Whether you're an aspiring content creator, avid gamer, or a full-time streamer, the CORSAIR VOYAGER a1600 AMD Advantage Edition laptop can do everything you need and more.

Packing a wide array of state-of-the-art tech into an impressively thin 19.8 mm form-factor, the CORSAIR VOYAGER a1600 boasts up to an 8-core, 16-thread AMD Ryzen 9 6900HS processor and AMD Radeon RX 6800M mobile graphics to game at maximum settings and cruise through resource-heavy applications like Adobe After Effects or OBS Studio. Moreover, this combination of cutting-edge AMD components unlocks the suite of exclusive AMD smart technologies, such as AMD Smart Access Memory, which helps unlock high performance by providing select AMD Ryzen processors with address to the entire high-speed GDDR6 graphics memory, further enhancing the CORSAIR VOYAGER a1600's high-end performance. The CORSAIR VOYAGER a1600 stays cool thanks to an advanced compact vapor chamber cooling system that evenly spreads heat, achieving lower temperatures with a thinner profile than traditional cooling methods.

GIGABYTE Unveils Gaming Innovations at COMPUTEX 2022

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to present the latest gaming products at COMPUTEX 2022. The innovations include its flagship gaming solutions powered by Intel 12th gen processors. The perfect combination of the IF Design Awarded Z690 AORUS XTREME motherboard, high-end key components, and big size monitors provide remarkable gaming experience. The Project Stealth kit enables an easy and simple assembly experience with special interface and cables hidden design while further enhances the system airflow for optimized cooling effect. Meanwhile, the new gaming PC, Model S delivers powerful, cool, and silent operation even on 3A games with its slick and neat aesthetics.

Moreover, the latest AMD Socket AM5 motherboards including gaming series of X670 AORUS XTREME, MASTER, PRO AX and X670 AERO D for designers will be first exposed in this exhibition as well. Users can take a sneak peek at the advanced design and extensive features of PCIe 5.0 graphics slot, M.2 Gen5 interface, exclusive PCIe/M.2 EZ-latch on GIGABYTE motherboards.

Phison Announces Strategic PCIe Gen5 Relationship with AMD and Micron at Computex 2022

Phison Electronics Corp., a leading provider of NAND controller and flash storage solutions, announced today a strategic collaboration with AMD and Micron to build a cooperative PCIe Gen5 ecosystem of compatible products that elevate the gaming and creator experience. Phison's role includes delivering a class-leading PCie Gen5 SSD controller - PS5026-E26 - that features nearly a 2x performance increase over the previous generation flagship while adhering to the same power limitations of the M.2 form factor.

"We are pleased to announce our cooperative effort with Micron and AMD to advance the technological development of PCIe Gen5 storage offerings, as this validates Phison's commitment to upholding customer-centric values," said Leo Huang, Sr. Director, Product Marketing, Phison. "The E26 controller enables gamers to compete at the highest level and helps content creators to maximize the overall system performance to increase productivity." The need for high-speed storage has increased with the popularity of 5G Wireless availability worldwide. Global markets including desktop PC, notebooks, gaming consoles, cloud servers and even mobile devices will benefit from increased data transfer rates and the bandwidth available for multitask purposes. The ecosystem consisting of AMD's AM5 platform, Phison's PS5026-E26 controller, Micron's DDR5 DRAM and Replacement Gate 3D NAND allow for platform acceleration across the entire system to meet the requirements for today's always-connected lifestyle.

AMD Announces New Ultrathin Notebook Design Wins, New "Mendocino" Mobile Processor

AMD in its Computex 2022 presentation announced several design wins for its Ryzen 6000U line of high-performance processors for ultra-thin notebooks. With configurable TDPs of 15 W and 28 W, these processors feature an 8-core/16-thread "Zen 3" CPU, an iGPU with up to 12 RDNA2 compute units, and a modern I/O that combines DDR5 memory with PCI-Express Gen 4, to bring gaming to ultra-thin form-factors without the need for a discrete GPU. The iGPU meets DirectX 12 Ultimate feature requirements, and AMD leverages technologies such as FidelityFX Super Resolution (FSR), to further improve gaming performance.

Among the new design wins are the ASUS Zenbook S 13 OLED, a 13-inch ultra-thin weighing only 1 kg, and capable of average 60 FPS in "Godfall," taking advantage of FSR. The Lenovo Yoga Slim 7 Pro X is another notebook in this class capable of 1080p gaming, powered by the Ryzen 7 6800HS, with up to 122 FPS in CS:GO, up to 266 FPS in "League of Legends," up to 59 FPS in "Shadow of the Tomb Raider," up to 64 FPS in "Final Fantasy: XIV," and up to 46 FPS in "Deus Ex: Mankind Divided."

ASRock AM5 Motherboard and More Leaked Ahead of Computex

It appears that ASRock got a little bit too excited and posted a Computex video earlier today that contained a brief glimpse of its upcoming X670E Taichi motherboard. The screenshot that was captured by Wccftech doesn't give away too much details, but the board appears to have at least three M.2 slots and a pair of PCIe x16 slots, of which at least one is meant to be of the PCIe 5.0 variety. The rest of the board is covered in heatsinks and various shrouds. The board will feature Realtek's ALC4082 USB attached audio codec, as well as a ESS ES9218 DAC. It is also said to sport a 26-phase VRM setup. The board is also expected to have Thunderbolt 4 support. The video has unfortunately been taken down, so we'll have to wait until next week to find out more details.

In related news, @momomo_us has leaked details of several upcoming AM5 motherboards, of which four models are from ASRock and two from ASUS. The ASRock models are the X670E Taichi mentioned above, the X670 PG Riptide, X670 Phantom Gaming 4 and the X670 Steel Legend. The two ASUS models are the ProArt X670E-Creator WiFi and the ProArt B650-Creator. Finally Gigabyte has revealed that the company will be displaying its X670 Aorus Xtreme, X670 Master, X670 Pro AX and X670 AERO D at Computex next week. The company mentions PCIe 5.0 for both graphics and the M.2 interface, which pretty much cements the earlier rumors about AMD offering PCIe 5.0 support for the M.2 interface on the AM5 platform.

AMD Selects Google Cloud to Provide Additional Scale for Chip Design Workloads

Google Cloud and AMD today announced a technology partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, further extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud's global networking, storage, artificial intelligence, and machine learning capabilities to further improve upon its hybrid and multicloud strategy for these EDA workloads.

Scale, elasticity, and efficient utilization of resources play critical roles in chip design, particularly given that the demand for compute processing grows with each node advancement. To remain flexible and scale easily, AMD will add Google Cloud's newest compute-optimized C2D VM instance, powered by 3rd Gen AMD EPYC processors, to its suite of resources focused on EDA workloads. By leveraging Google Cloud, AMD anticipates being able to run more designs in parallel, giving the team more flexibility to manage short-term compute demands, without reducing allocation on long-term projects.

Russia to Use Chinese Zhaoxin x86 Processors Amidst Restrictions to Replace Intel and AMD Designs

Many companies, including Intel and AMD, have stopped product shipments to Russia amidst the war in Ukraine in the past few months. This has left the Russian state without any new processors from the two prominent x86 designers, thus slowing down the country's technological progress. To overcome this issue, it seems like the solution is embedded in the Chinese Zhaoxin x86 CPUs. According to the latest report from Habr, a motherboard designer called Dannie is embedding Chinese Zhaoxin x86 CPUs into motherboards to provide the motherland with an x86-capable processor. More precisely, the company had designed a BX-Z60A micro-ATX motherboard that embeds Zhaoxin's KaiXian KX-6640MA SoC with eight cores based on LuJiaZui microarchitecture. The SoC is clocked at a frequency range of 2.1-2.7 GHz, carries 4 MB of L2 cache, 16 lanes of PCIe 3.0, and has integrated graphics, all in a 25 Watt TDP.

As far as the motherboard is concerned, it supports two DDR4 memory slots, two PCIe x16 connectors, M.2-2280 and M.2-2230 slots, and three SATA III connectors for storage. For I/O you have USB ports, DisplayPort, HDMI, VGA/D-Sub, GbE, 3.5-mm audio, and additional PS/2 ports. This is a pretty decent selection; however, we don't know the pricing structure. A motherboard with KaiXian KX-6640MA SoC like this is certainly not cheap, so we are left to wonder if this will help Russian users deal with the newly imposed restriction on importing US tech.

AMD "Navi 31" Rumored to Feature 384-bit GDDR6 Memory Interface

AMD has historically thrown brute memory bus width at solving memory-management problems in its graphics architectures, but the Infinity Cache technology launched with RDNA2 proved to be a game changer, as GPUs with narrow 256-bit memory interfaces could compete with NVIDIA's offerings that have 384-bit wide memory interfaces and faster GDDR6X memory types. It looks like the competition between NVIDIA "Ada" and AMD RDNA3 graphics architectures is about to heat up, as rumors are emerging of AMD giving its biggest next-gen ASIC, the "Navi 31," a 384-bit wide memory interface.

This 50 percent increase in memory bus width, runs in concert with two associated rumors—one, that the company will use faster 20 Gbps GDDR6 memory chips; and two, that AMD may increase the size of the on-die Infinity Cache memory. Samsung is already mass-producing 20 Gbps and 24 Gbps GDDR6 memory chips. These are regular GDDR6 memory chips with JEDEC-standard signaling, and not GDDR6X, an exclusive memory type innovated by NVIDIA and Micron Technology, which leverages PAM4 signaling to increase data-rates. A theoretical "Navi 31" with 20 Gbps GDDR6 memory speeds would enjoy 960 GB/s of memory bandwidth, a massive 87.5 percent bandwidth increase over the RX 6900 XT. The on-die Infinity Cache operates at speeds measured in several TB/s. The increased bus width could also signal an increase in memory sizes, with the RX 6950 XT successor featuring at least 24 GB of memory.

Acer Refreshes TravelMate P4, TravelMate Spin P4 and TravelMate P2 Series Business Laptops

Acer today announced its refreshed range of TravelMate business laptops for SMB (Small- and Medium- Sized Businesses) and hybrid workers, offering them a wider choice of mobility and performance. Each of the durable Acer TravelMate P4, TravelMate Spin P4 and TravelMate P2 laptops offer workers at the office, home or on the move a highly refined experience with larger touchpads and quieter key presses with a comfortable 1.55 mm travel distance. These durable laptops are designed to deliver powerful performance throughout the work day, enhanced security, advanced connectivity and military-grade durability. They are engineered to handle real life situations such as being bumped through an airport security checkpoint or accidentally dropped, and meet MIL-STD 810H specifications, meaning they can withstand drops, humidity and water spills.

The Acer TravelMate P2, TravelMate P4, and TravelMate Spin P4 laptops provide business-grade security and productivity. These Microsoft Secured-core PCs deliver advanced security down to the firmware level. A SecureBio fingerprint reader and IR camera with a privacy shutter support Windows Hello for secure logins. All models offer advanced connectivity with Wi-Fi 6 to ensure a smoother wireless experience, and optional LTE support so business travelers can enjoy immediate connectivity to local networks.

AMD and Qualcomm Collaborate to Optimize FastConnect Connectivity Solutions for AMD Ryzen Processors

AMD and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced a collaboration to optimize the Qualcomm FastConnect connectivity system for AMD Ryzen processor-based computing platforms, starting with AMD Ryzen PRO 6000 Series processors and the Qualcomm FastConnect 6900. With the FastConnect 6900 system, the latest AMD Ryzen processor-powered business laptops feature Wi-Fi 6 and 6E connectivity, including advanced wireless capabilities enabled with Windows 11.

In collaboration with Microsoft, next-generation Windows 11 PCs, such as the Lenovo ThinkPad Z Series and HP EliteBook 805 Series, can harness the full potential of Windows 11 Wi-Fi Dual Station through Qualcomm 4-Stream Dual Band Simultaneous. Multiple Wi-Fi bands outperform traditional single band connections for improved video conferencing experiences, reduced latency, and enhanced connection robustness. Leveraging the 6 GHz band, next-gen laptop users can take full advantage of its bandwidth and speed improvements without competing with any non-6E devices.

AMD Robotics Starter Kit Kick-Starts the Intelligent Factory of the Future

Today AMD announced the Kria KR260 Robotics Starter Kit, the latest addition to the Kria portfolio of adaptive system-on-modules (SOMs) and developer kits. A scalable and out-of-the-box development platform for robotics, the Kria KR260 offers a seamless path to production deployment with the existing Kria K26 adaptive SOMs. With native ROS 2 support, the standard framework for robotics application development, and pre-built interfaces for robotics and industrial solutions, the new SOM starter kit enables rapid development of hardware-accelerated applications for robotics, machine vision and industrial communication and control.

"The Kria KR260 Robotics Starter Kits builds on the success of our Kria SOMs and KV260 Vision AI Starter Kit for AI and embedded developers, providing roboticists with a complete, out-of-the-box solution for this rapidly growing application space," said Chetan Khona, senior director of Industrial, Vision, Healthcare and Sciences Markets at AMD. "Roboticists will now be able to work in their standard development environment on a platform that has all the interfaces and capabilities needed to be up and running in less than an hour. The KR260 Starter Kit is an ideal platform to accelerate robotics innovation and easily take ideas to production at scale."

Alphacool Unveils Water Blocks for RX 6950 XT and RX 6750 XT

Just in time for the official launch of the new AMD graphics card generation, Alphacool can already offer the first compatible Eisblock water coolers for Radeon RX 6750 XT & 6950 XT GPUs. Alphacool is checking other cards for possible compatibility. The latest compatibility list is available for download in the online shop. With the help of the graphics card configurator, you can easily find the right cooler for your existing graphics card. Smart and efficient.

AMD Claims Higher FPS/$ Radeon GPU Value Over NVIDIA Offerings

Frank Azor, Chief Architect of Gaming Solutions & Marketing at AMD, has posted an interesting slide on Twitter, claiming that AMD Radeon products possess higher FPS/$ value than NVIDIA's graphics offerings. According to the slide, AMD Radeon graphics cards are the best solutions for gamers looking at performance per dollar ratings and performance per watt. This means that AMD claims that Radeon products are inherently higher-value products than NVIDIA's offerings while also more efficient. As the chart shows, which you can see below, some AMD Radeon cards are offering up to 89% better FPS/$ value with up to 123% better FPS/Watt metric. This highest rating is dedicated to Radeon RX 6400 GPU; however, there are all GPUs included in comparison with up to the latest Radeon RX 6950 XT SKU.

Compared to TechPowerUp's own testing of AMD's Radeon cards and multiple reviews calculating the performance per dollar metric, we could not see numbers as high as AMD's. This means that AMD's marketing department probably uses a different selection of games that may perform better on AMD Radeon cards than NVIDIA GeForce RTX. Of course, as with any company marketing material, you should take it with a grain of salt, so please check some of our reviews for a non-biased comparison.

Intel XeSS Launches on May 20, with "Dolmen"

The ambitious performance enhancement by Intel Graphics rivaling NVIDIA DLSS and AMD FSR, the Intel XeSS (Xe Super Sampling,) will debut on May 20, 2022, with a patch for "Dolmen," developer Massive Work Studio announced. This matches our report from March 2022 that referenced an "early Summer" debut. This would mean Intel Graphics has a driver release planned very soon, for its Xe LP-based iGPUs and Iris Xe MAX discrete GPU; as well as the first round of Arc 3 "Alchemist" mobile graphics, which will launch with XeSS support.

Much like FSR and DLSS, XeSS works with a supported game to render raster 3D scenes at a lower resolution than the display resolution, and upscales them using a sophisticated algorithm that minimizes image quality loss, with a net gain in frame-rates. XeSS will play a particularly big role in Intel's plans to grab a slice of the gaming graphics market with its Arc "Alchemist" discrete GPUs. XeSS appears to work similar to AMD FSR 2.0, with its upscaler using motion-vectors and temporal data from the game engine to reconstruct details in the outbound frames. Also, much like FSR, XeSS will be open to GPUs from other brands.

Update May 17th: The Dolmen Twitter handle just put out an update that XeSS support is coming "this Summer," implying that it will not release on May 20 as earlier reported.
Return to Keyword Browsing
May 26th, 2022 22:09 EDT change timezone

New Forum Posts

Popular Reviews

Controversial News Posts