At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.

ZOTAC TECHNOLOGY, a global manufacturer focused on innovation, launches the world's first Mini PC featuring the AirJet Solid-State Active Cooling system, as well as a lineup of ARM-based, lightweight edge computing platforms based on the NVIDIA Jetson system on module (SoM).

ZBOX PI430AJ WITH AIRJET, THE WORLD'S FIRST SOLID-STATE ACTIVE-COOLED MINI-PC
First debuted at COMPUTEX 2023, the ZBOX PI430AJ with AirJet is the first product of its kind to feature revolutionary Solid-State Active Cooling technology. With each unit featuring two AirJet Mini Modules by Frore Systems, these thin, silent modules are capable of removing significant heat through rapid airflow, raising the ZBOX PI430AJ's thermal ceiling without compromising its form factor. Taking advantage of the newfound possibilities enabled by the AirJet, the ZBOX PI430AJ is equipped with an Intel Core i3 processor, 8 GB LPDDR5 memory, M.2 SSD storage slot, and more - all within a system the size of a deck of cards.

Phison Electronics, a global leader in NAND flash and storage solutions, announces a technology demonstration of unique customer-based solutions fully realized through the IMAGIN+ customization service at Flash Memory Summit 2023.

Phison has expanded its IMAGIN+ design service to include AI computational models and AI services solutions. Customers work with specialized Phison teams to design and engineer custom flash deployments that precisely address the data performance and endurance requirements of next generation products including those highly optimized for aiDAPTIV AI+ML workloads. With IMAGIN+ design services, Phison teams work hand-in-hand with customers to deliver AI-boosted SSD solutions that address demanding requirements.

Zotac has displayed a couple of interesting mini PCs at the Computex 2023 show, including the ZBOX Pico PIA430AJ, the world's first solid-state active cooled mini PC, as well as a new Magnus One, packing an NVIDIA RTX 4070 graphics card, and a small Edge mini PCs with AMD's Ryzen 7 7840U APU.

While the new Magnus One ERP74070C looks quite impressive packing a 16-core Intel Core i7-13700 CPU and DLSS 3-capable GeForce RTX 4070 12 GB graphics card, all in 8.33 liters chassis, the star of the show was definitely the small ZBOX Pico. The new ZBOX Pico PI430AJ features the Frore Systems AirJet solid-state active cooling technology. Based on an Intel Core i3-N300 8-core chip, it is cooled by two of these solid-state coolers, allowing Zotac to make the ZBOX Pico even thinner and quieter. The new ZBOX Pico packs 8 GB of LPDDR5 on-board memory, has a single M.2 2280 NVMe PCIe 4 slot, three USB 3.2 Type-C ports, and all the usual connectivity, like the WiFi 6, Bluetooth 5.2, Gigabit LAN, and HDMI 2.0 and DisplayPort 1.4 outputs. Zotac also showcased the new ZBOX Edge MA762 mini PC, which is based on AMD's Phoenix Ryzen 7 7840U 8-core APU with AMD Radeon 780M graphics, all packed in a 0.64 liters chassis. As far as we know, the Ryzen 7 7840U should also feature the XDNA AI Accelerator (Ryzen AI) as well, and it is the fastest Ryzen Phoenix U-series APU with 15-30 W TDP.

Today, ZOTAC Technology launched the ZOTAC ZBOX PI430AJ with AirJet, the first Mini-PC to feature AirJet the world's first solid-state active cooling chip. The ZBOX PI430AJ with AirJet, at a mere 115 mm x 76 mm x 22 mm, now boasts twice the performance thanks to AirJet, making it the most powerful device in its class. AirJet cools devices with breakthrough technology that meets the ever-increasing demands of today's consumers. AirJet's compact size and unique capabilities enable faster, thinner, lighter, silent, and dustproof devices.

Heat is the single biggest problem facing the electronics industry, and until now, manufacturers have used antiquated thermal solutions like mechanical fans or bulky ineffective heat sinks to remove heat. These inadequate thermal solutions cause devices to rapidly overheat, forcing manufacturers to reduce device performance after only a few seconds of operation. This means consumers never really get the full processor performance they pay for.