AAEON (Stock Code: 6579) today announced the release of the UP Xtreme PTL Edge Air, a Panther Lake-powered Mini PC featuring Frore Systems' AirJet solid-state active cooling technology.

With this innovative thermal management, the Mini PC replaces conventional fan-based cooling with ultrasonic-frequency membrane vibration technology to generate high-speed pulsating airflow to provide high-capacity heat dissipation without the added height that comes with a heatsink.

To overcome the thermal barriers limiting AI performance, Frore Systems today unveiled LiquidJet Nexus, a new integrated liquid cooling system designed for the AI era. As AI compute densities surge, heat is emerging as a primary constraint, elevating what experts are calling the "AI Thermal Stack" - the infrastructure responsible for extracting heat from advanced computing systems and rejecting it into the atmosphere. The AI Thermal Stack is increasingly determining the compute density, system efficiency, and overall performance of AI Data Centers.

LiquidJet Nexus is designed for liquid cooling ½ U compute trays like NVIDIA Kyber, directly cooling GPUs, CPUs, DPUs, NICs, DC-DC power converters, and VRs. It integrates multiple multi-stage 3D short-loop jetchannel liquid cooling LiquidJet coldplates into a unified system. LiquidJet Nexus delivers 75% higher heat transfer efficiency, keeps components 8°C cooler, eliminating hoses, connectors, and manifolds, and reducing thermal stack weight by 65%. This unified system addresses the thermal demands of next-generation AI hardware.

Frore Systems has demonstrated the massive increase in performance possible with AirJet solid-state active cooling chips in the new Samsung Galaxy Book4 Edge 14", the thinnest Notebook on the market at just 10.9 mm. The proof-of-concept Samsung Galaxy Book4 Edge 14", upgraded with AirJet, achieves an incredible 50% increase in sustained CPU & AI performance, showing that now, consumers really can demand it all. Frore Systems will be showcasing the upgraded Samsung Notebook in January at CES 2025.

Frore Systems achieved the 50% performance boost in the Samsung Galaxy Book4 Edge 14", from 12 Watts to 18 Watts, by replacing the two large fans currently used in the Notebook with four AirJet chips. This innovative solution reduces the cooling solution footprint by 45% - the fans consuming 8,800 mm² of space vs the AirJet footprint of just 4,800 mm². Therefore, the extremely compact AirJet solution creates additional space inside the Galaxy Book4 Edge 14", potentially allowing for increasing the battery size from the current 55.9 Wh to 64.8 Wh - a 16% increase - improving video runtime from 20 hours to 23.2 hours.

Iodyne, a company dedicated to providing Pro users with the best technology, announced its Pro Mini external solid-state drive sporting unique features like the dual AirJet cooling system. This technology allows the drive to maintain sustained performance without the thermal throttling that plagues other portable SSDs. The Pro Mini can deliver speeds of 3 GB/s, up to two times the sustained throughput of standard professional SSDs, even with active encryption and internal RAID protection.

The drive features a triple-anodized machined aluminum chassis and hardened glass protection with a customizable 2.1" E-paper display. Offered with 4 TB or 8 TB capacities, the iodyne Pro Mini offers versatile connectivity, including a bus-powered USB-C port that automatically detects the connection type and adjusts its speed accordingly, supporting up to 40 Gb/s Thunderbolt connections. Security is another point where this product stands out with the use of Passkeys instead of passwords, along with enterprise-grade encryption and hardware-accelerated RAID-6 data protection. The Pro Mini also incorporates an integrated Bluetooth beacon for location tracking.

At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.

ZOTAC TECHNOLOGY, a global manufacturer focused on innovation, launches the world's first Mini PC featuring the AirJet Solid-State Active Cooling system, as well as a lineup of ARM-based, lightweight edge computing platforms based on the NVIDIA Jetson system on module (SoM).

ZBOX PI430AJ WITH AIRJET, THE WORLD'S FIRST SOLID-STATE ACTIVE-COOLED MINI-PC
First debuted at COMPUTEX 2023, the ZBOX PI430AJ with AirJet is the first product of its kind to feature revolutionary Solid-State Active Cooling technology. With each unit featuring two AirJet Mini Modules by Frore Systems, these thin, silent modules are capable of removing significant heat through rapid airflow, raising the ZBOX PI430AJ's thermal ceiling without compromising its form factor. Taking advantage of the newfound possibilities enabled by the AirJet, the ZBOX PI430AJ is equipped with an Intel Core i3 processor, 8 GB LPDDR5 memory, M.2 SSD storage slot, and more - all within a system the size of a deck of cards.

Phison Electronics, a global leader in NAND flash and storage solutions, announces a technology demonstration of unique customer-based solutions fully realized through the IMAGIN+ customization service at Flash Memory Summit 2023.

Phison has expanded its IMAGIN+ design service to include AI computational models and AI services solutions. Customers work with specialized Phison teams to design and engineer custom flash deployments that precisely address the data performance and endurance requirements of next generation products including those highly optimized for aiDAPTIV AI+ML workloads. With IMAGIN+ design services, Phison teams work hand-in-hand with customers to deliver AI-boosted SSD solutions that address demanding requirements.

Zotac has displayed a couple of interesting mini PCs at the Computex 2023 show, including the ZBOX Pico PIA430AJ, the world's first solid-state active cooled mini PC, as well as a new Magnus One, packing an NVIDIA RTX 4070 graphics card, and a small Edge mini PCs with AMD's Ryzen 7 7840U APU.

While the new Magnus One ERP74070C looks quite impressive packing a 16-core Intel Core i7-13700 CPU and DLSS 3-capable GeForce RTX 4070 12 GB graphics card, all in 8.33 liters chassis, the star of the show was definitely the small ZBOX Pico. The new ZBOX Pico PI430AJ features the Frore Systems AirJet solid-state active cooling technology. Based on an Intel Core i3-N300 8-core chip, it is cooled by two of these solid-state coolers, allowing Zotac to make the ZBOX Pico even thinner and quieter. The new ZBOX Pico packs 8 GB of LPDDR5 on-board memory, has a single M.2 2280 NVMe PCIe 4 slot, three USB 3.2 Type-C ports, and all the usual connectivity, like the WiFi 6, Bluetooth 5.2, Gigabit LAN, and HDMI 2.0 and DisplayPort 1.4 outputs. Zotac also showcased the new ZBOX Edge MA762 mini PC, which is based on AMD's Phoenix Ryzen 7 7840U 8-core APU with AMD Radeon 780M graphics, all packed in a 0.64 liters chassis. As far as we know, the Ryzen 7 7840U should also feature the XDNA AI Accelerator (Ryzen AI) as well, and it is the fastest Ryzen Phoenix U-series APU with 15-30 W TDP.

Today, ZOTAC Technology launched the ZOTAC ZBOX PI430AJ with AirJet, the first Mini-PC to feature AirJet the world's first solid-state active cooling chip. The ZBOX PI430AJ with AirJet, at a mere 115 mm x 76 mm x 22 mm, now boasts twice the performance thanks to AirJet, making it the most powerful device in its class. AirJet cools devices with breakthrough technology that meets the ever-increasing demands of today's consumers. AirJet's compact size and unique capabilities enable faster, thinner, lighter, silent, and dustproof devices.

Heat is the single biggest problem facing the electronics industry, and until now, manufacturers have used antiquated thermal solutions like mechanical fans or bulky ineffective heat sinks to remove heat. These inadequate thermal solutions cause devices to rapidly overheat, forcing manufacturers to reduce device performance after only a few seconds of operation. This means consumers never really get the full processor performance they pay for.