MediaTek and its subsidiary Airoha Technology are jointly showcasing next-generation fixed and wireless broadband connectivity technologies, spanning Wi-Fi, 5G CPE and PON solutions for emerging AI applications and services, at Network X 2026. Having worked closely with the network communications industry ecosystem, MediaTek is one of the world's leading companies at the forefront of Wi-Fi 8 development and commercialization.

At Network X 2026, MediaTek is showcasing next-generation Enterprise-Grade Wi-Fi 8 technology leveraging the Filogic 8800, a high-performance tri-band flagship router platform designed for AI applications. Unlike previous approaches that focused solely on achieving the highest possible speed for a single device, the Wi-Fi 8 technologies showcased by MediaTek place greater emphasis on the connectivity experience in real-world network environments. Both home and enterprise networks must support the long-term coexistence of Wi-Fi 5, Wi-Fi 6, Wi-Fi 7 and the latest Wi-Fi 8 devices. Through cross-generation network optimization, AI-powered dynamic energy saving and smart network diagnostics, Filogic 8800 improves overall system throughput by up to nearly 100% while reducing system power consumption by 50%, even in environments where new and legacy devices are connected.

Fraunhofer IIS and Airoha Technology are presenting a breakthrough multi-channel spatial audio solution for next-generation wireless headsets at Mobile World Congress (MWC) 2026. The collaboration integrates Fraunhofer's industry-leading LC3plus codec and Cingo spatial audio rendering solutions with Airoha's flagship Bluetooth SoC, the AB1595—enabling high-definition, low-latency, and resilient wireless multichannel audio tailored for premium mobile and XR applications.

At the core of this joint solution is a seamless, high-definition multichannel wireless transmission chain designed to meet the evolving demands of mobile devices, extended reality (XR), and immersive media ecosystems. By leveraging Airoha's proprietary High Data-rate Technology (HDT), the AB1595 platform provides the robust bandwidth required to support Fraunhofer's LC3plus codec. This combination delivers high-resolution audio with efficient bitrates and ultra-low latency—essential for scalable, multichannel headset designs that go far beyond traditional stereo limitations.

Airoha Technology today announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process. This is one of the most important R&D achievements of its Bluetooth audio R&D team consisted of hundreds of engineers, who continues to revolutionize the wireless audio end device market. The "flagship" and "professional" series of chipsets support LE audio and Bluetooth 5.3 for multiple applications such as True Wireless Stereo (TWS) earbuds, Bluetooth smart speakers, assistive listening devices, and Bluetooth transmitters. The products are currently being tested by many brand customers and are expected to be available worldwide in the first half of 2023.

"The LE Audio specifications are the most important milestone reached in the Bluetooth audio industry in the past decade. With the support of our strong R&D team consisting of hundreds of engineers who have accumulated nearly a decade of technical expertise, Airoha became one of the world's first certified chip providers. This supports many customers to accelerate the launch of their end devices. The wireless audio innovation brought by the latest Bluetooth LE technology will expedite the process by which consumers and businesses enjoy the convenient and innovative services it brings, fully demonstrating the Airoha's vision and business philosophy." said Yuchuan Yang, Sr. Vice President of Airoha.