TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

Amazon's AWS division has been making Graviton processors for a few years now, and the company recently announced its Graviton3 design will soon to available in the cloud. Today, we are witnessing a full launch of the Graviton3 CPUs with the first instances available in the AWS Cloud. In theC7g instances, AWS customers can now scale their workloads across 1-64 vCPU instance variants. Graviton3's 64 cores run at 2.6 GHz clock speed, 300 GB/sec maximum memory bandwidth, DDR5 memory controller, 64 cores, seven silicon die chiplet-based design, 256-bit SVE (Scalable Vector Extension), all across 55 billion transistors. Paired with up to 128 GiB of DDR5 memory, these processors are compute-intensive solutions. AWS noted that the company used a monolithic computing and memory controller logic design to reduce latency and improve performance.

One interesting thing to note is the motherboard that AWS hosts Graviton3 processors in. Usually, server motherboards can be single, dual, or quad-socket solutions. However, AWS decided to implement a unique solution with three sockets. This tri-socket setup is designed to see each CPU as an independent processor, managed by a Nitro Card, which can handle exactly three CPUs. The company notes that the CPU is now in general availability with C7g instances and you can see it below.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to introduce new models to the customer-beloved Toughpower PF1 series - the Toughpower PF1 1050 W/1200 W TT Premium Edition, at the 2022 Thermaltake EXPO January Virtual Exhibition.

Delivering 80 PLUS Platinum-certified efficiency, the Toughpower PF1 1050 W/1200 W levels up in cooling performance by featuring a 120 mm High Static Pressure Fan which can perform at a maximum operating speed up to 2500 RPM. The second-generation hydraulic bearing, exceptional fan blades, and anti-vibration mounting system of the fan also helps to offer superb cooling performance.

As Amazon is continuing to grow its AWS business, both with new instances powered by AMD's third generation of EPYC processors and it's new EC2 C5g instances powered by its current Graviton2 processors and Nvidia's T4G tensor core GPUs. However, the company is also opening up its first EC2 C7g preview instances using its brand new Graviton3 processors, which the company claims offer vastly improved performance over the Graviton2 on specific workloads.

EC2 stands for Elastic Compute Cloud and judging by the fact that the Graviton3 is said to have up to twice as past FPU performance for scientific workloads and being twice as fast for cryptographic workloads and up to three times faster for machine learning workloads, you can guess who these new EC2 instances are intended for. Amazon didn't reveal much in terms of technical details about the Graviton3, but it'll utilize DDR5 memory, which makes it one of the first, if not the first server CPU to use DDR5. It's also said to use up to 60 percent less energy than the Graviton2, while delivering up to 25 percent more compute performance. It's implied that it uses the Arm v9 architecture and the Neoverse N2 Arm cores, although this hasn't been officially announced.

Last year Samsung and AMD announced their collaboration which promises to deliver smartphone chips with AMD RDNA 2 graphics at its heart. This collaboration is set to deliver first products sometime at the beginning of 2021 when Samsung will likely utilize new SoCs in their smartphones. In previous leaks, we have found that the GPU inside this processor is reportedly beating the competition form Qualcomm, where the AMD GPU was compared to Adreno 650. However, today we have obtained more information about the new SoC which is reportedly called "Ryzen C7" smartphone SoC. A new submission to a mobile phone leaks website called Slash Leaks has revealed a lot of new details to us.

The SoC looks like a beast. Manufactured on TSMC 5 nm process, it features two Gaugin Pro cores based on recently announced Arm Cortex-X1, two Gaugin cores based on Arm Cortex-A78, and four cores based on Arm Cortex-A55. This configuration represents a standard big.LITTLE CPU typical for smartphones. Two of the Cortex-X1 cores run at 3 GHz, two of Cortex-A78 run at 2.6 GHz, while four little cores are clocked at 2 GHz frequency. The GPU inside this piece of silicon is what is amazing. It features four cores of custom RDNA 2 based designs that are clocked at 700 MHz. These are reported to beat the Adreno 650 by 45% in performance measurements.

Intel is expected to finally refresh its mainstream desktop platform with the introduction of the 14 nm "Comet Lake-S" processors, in Q2-2020. This sees the introduction of the new LGA1200 socket and Intel 400-series chipsets, led by the Z490 Express at the top. Platform maps of these PCI-Express gen 3.0 based chipsets make them look largely similar to current 300-series platform, with a few changes. For starters, Intel introducing its biggest ACPI change since C6/C7 power states that debuted with "Haswell;" with the introduction of C10 and S0ix Modern Standby power-states, which give your PC an iPad-like availability while sipping minimal power. This idea is slightly different from Smart Connect, in that your web-connected apps and processor work at an extremely low-power (fanless) state, rather than waking your machine up from time to time for the apps to refresh. 400-series chipset motherboards will also feature updated networking interfaces, such as support for 2.5 GbE wired LAN with an Intel i225-series PHY, 802.11ax WiFi 6 WLAN, etc.

HyperThreading will play a big role in making Intel's processor lineup competitive with AMD's given that the underlying microarchitecture offers an identical core design to "Skylake" circa 2015. The entry-level Core i3 chips will be 4-core/8-thread, Core i5 6-core/12-thread, Core i7 8-core/16-thread; and leading the pack will be the Core i9-10900K, a 10-core/20-thread processor. According to a WCCFTech report, this processor will debut in April 2020, which means at CES 2020 in January, we'll get to see some of the first socket LGA1200 motherboards, some even based on the Z490. The platform also mentions an interesting specification: "enhanced core and memory overclocking." This could be the secret ingredient that makes the i9-10900K competitive with the likes of the Ryzen 9 3900X. The LGA1200 platform could be forwards-compatible with "Rocket Lake," which could herald IPC increases on the platform by implementing "Willow Cove" CPU cores.

Not content with presenting their Frostbit M.2 cooling solution (even if it's as exotic as it is), Cryorig took the opportunity at COMPUTEX to present would-be consumers with part of their product portfolio. The H7 Quad Lumi CPU cooler is the company's flagship offering, featuring a total of four 6 mm high-end copper heatpipes, NZXT CAM Powered Lumi Lighting System as well as a new QF120 1.600 RPM LED fan. The H7 Quad Lumi also incorporates an RGB controller into its design, making it not just a cooling solution, but the centerpiece for a given rig's RGB chops.

The company's C7 Cu full-copper cooler also made a showing, with its expensive, all-copper solution. The thrice-more-expensive-than-aluminum copper offers only double the thermal conductivity of the former, which is why it gives diminishing returns in cooling performance. However, in the SFF builds this low-profile cooler will more likely be used, all performance gains matter so as to allow for a small, silent solution that nonetheless dissipates copious amounts of heat.

Ahead of Computex 2018 CRYORIG announces new M.2 cooler Frostbit and RGB enhanced C7 RGB CPU Cooler. CRYORIG's Frostbit is not only the industry first aftermarket M.2 NVMe SSD cooler with dual heatpipes, it allows full adjustment of the Secondary Heatpipe and large volume Heatsink. The C7 RGB is based on CRYORIG's award winning ITX cooler C7, with a 12v RGB lighting enhanced 92 mm fan. Both products will be shown at CRYORIG's Computex booth at Nangang Exhibition Hall I0527.