Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

In a keynote address to a packed crowd at Santa Clara's Computer History Museum, Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America - Memory at Samsung Electronics, along with SangJoon Hwang, Corporate Executive Vice President, Head of DRAM Product and Technology at Samsung Electronics, took the stage to introduce new memory solutions and discuss how Samsung is leading HBM and CXL innovations in the AI era. Joining Samsung on stage was Paul Turner, Vice President, Product Team, VCF Division at VMware by Broadcom and Gunnar Hellekson, Vice President and General Manager at Red Hat to discuss how their software solutions combined with Samsung's hardware technology is pushing the boundaries of memory innovation.

SK hynix is displaying its latest AI memory technologies at NVIDIA's GPU Technology Conference (GTC) 2024 held in San Jose from March 18-21. The annual AI developer conference is proceeding as an in-person event for the first time since the start of the pandemic, welcoming industry officials, tech decision makers, and business leaders. At the event, SK hynix is showcasing new memory solutions for AI and data centers alongside its established products.

Showcasing the Industry's Highest Standard of AI Memory
The AI revolution has continued to pick up pace as AI technologies spread their reach into various industries. In response, SK hynix is developing AI memory solutions capable of handling the vast amounts of data and processing power required by AI. At GTC 2024, the company is displaying some of these products, including its 12-layer HBM3E and Compute Express Link (CXL)1, under the slogan "Memory, The Power of AI". HBM3E, the fifth generation of HBM2, is the highest-specification DRAM for AI applications on the market. It offers the industry's highest capacity of 36 gigabytes (GB), a processing speed of 1.18 terabytes (TB) per second, and exceptional heat dissipation, making it particularly suitable for AI systems. On March 19, SK hynix announced it had become the first in the industry to mass-produce HBM3E.

Cadence's digital and custom/analog flows are certified on the Intel 18A process technology. Cadence design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs. Customers can now begin using the production-ready Cadence design flows and design IP to achieve design goals and speed up time to market.

"Intel Foundry is very excited to expand our partnership with Cadence to enable key markets for the leading-edge Intel 18A process technology," said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. "We will leverage Cadence's world-class portfolio of IP, AI design technologies, and advanced packaging solutions to enable high-volume, high-performance, and power-efficient SoCs in Intel Foundry's most advanced process technology. Cadence is an indispensable partner supporting our IDM2.0 strategy and the Intel Foundry ecosystem."

Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link (CXL) memory operations in a real user environment with open-source software provider Red Hat, leading the expansion of its CXL ecosystem.

Due to the exponential growth of data throughput and memory requirements for emerging fields like generative AI, autonomous driving and in-memory databases (IMDBs), the demand for systems with greater memory bandwidth and capacity is also increasing. CXL is a unified interface standard that connects various processors, such as CPUs, GPUs and memory devices through a PCIe interface that can serve as a solution for limitations in existing systems in terms of speed, latency and expandability.

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

Lightelligence, the global leader in photonic computing and connectivity systems, today announced Photowave, the first optical communications hardware designed for PCIe and Compute Express Link (CXL) connectivity, unleashing next-generation workload efficiency.

Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks. The first public demonstration of Photowave will be at Flash Memory Summit today through Thursday, August 10, in Santa Clara, Calif.

As COMPUTEX once again opens its door, MSI, the world leader in gaming, content creation, business & productivity, and AIoT solutions, is all geared up to dominate the show floor with a full slate of new lineup and its Best Choice Award honorees. "We are thrilled to be back at COMPUTEX," said Sam Chern, MSI Vice President of Marketing. "We expect to see users' tech experiences reinvented and MSI is at the forefront. Our COMPUTEX 2023 lineup showcases the ultimate fusion of breakthrough technology and everlasting aesthetics that surpasses all limits and indulges global users with the best possible experience like never before."

This year, MSI themes its booth around The Leap to Singularity, envisioning a future in which the technological singularity brings forth superintelligence to improve human lives. Among the highlights on display will be the Raider GE78 HX Smart Touchpad, Stealth 16 and Creator Z17 laptops powered by up to 13th Gen Intel Core i9 processors and NVIDIA GeForce RTX 40 Series graphics, making them powerhouses for gamers and creators alike.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its development of the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.

Building on its development of the industry's first CXL 1.1-based CXL DRAM in May of 2022, Samsung's introduction of the 128 GB CXL DRAM based on CXL 2.0 is expected to accelerate commercialization of next-generation memory solutions. The new CXL DRAM supports PCle 5.0 interface (x8 lanes) and provides bandwidth of up to 35 GB per second.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, will showcase its latest cloud server platforms powered by AMD EPYC 9004 Series processors and 4th Gen Intel Xeon Scalable processors for next-generation data centers at CloudFest 2023, Booth #H12 in Europa-Park from March 21-23.

"With the exponential advancement of technologies like AI and Machine Learning, data centers require robust hardware and infrastructure to handle complex computations while running AI workloads and processing big data," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's cloud server platforms with storage performance and computing capability can support the ever-increasing demand for computational power and data processing."

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

AIC Inc., (from now on referred to as"AIC"), a leading provider in enterprise storage and server solutions, today unveiled its new server systems powered by 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids). The new server platforms are designed to accelerate performance across the most in-demand workloads that businesses rely on including enterprise, storage, AI and HPC.

The newly launched AIC servers, SB102-HK, SB201-HK and HP202-KT, are designed to offer superior processing performance and energy efficiency by leveraging the innovative features of 4th Gen Intel Xeon Scalable processors. With built-in accelerators, the 4th Gen Intel Xeon Scalable processors optimize the utilization of CPU core resources and feature enhanced memory bandwidth with DDR5, advanced I/O with PCIe Gen 5 and Compute Express Link (CXL) 2.0/1.1, and the ability to accelerate PyTorch real-time inference performance by up to 10x using Intel Advanced Matrix Extensions (Intel AMX) compared to the previous generation. The new AIC servers are empowered by advanced security technologies from 4th Gen Intel Xeon Scalable processors, allowing them to protect data and unlock new opportunities for business collaborations.

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel Xeon Scalable processor - the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM's well-established cyber security product line. NSA 7160 is equipped with the latest Intel technologies, featuring eight PCIe Gen5 extension slots for LAN modules, built-in accelerators, CXL1.1 and supports installation of RunBMC module & full-height full-length (FHFL) card.

NEXCOM's NSA 7160 is intended for network security and 5G network applications, with cutting-edge features like multi-core computing performance, high memory capacity, high-speed I/O interface, and improved Intel QuickAssist Technology (Intel QAT) hardware acceleration for both enterprise and telecommunication applications. By leveraging 4th Gen Intel Xeon Scalable processors, NSA 7160 accelerates performance across the fastest-growing workloads and delivers value across multiple applications.

Today, Lenovo unveiled 25 new ThinkSystem and ThinkAgile server and hyperconverged solutions powered by Intel's 4th Generation Xeon Scalable Processors as part of its recently announced Infrastructure Solutions V3 portfolio. Designed to help accelerate global IT modernization for organizations of all sizes, the integrated solutions deliver advanced performance, efficiency and management capabilities specifically optimized for complex workloads, including mission-critical, AI, HPC and containerized applications.

"In today's competitive business climate, modern infrastructure solutions that generate faster insights and more efficiently enable complex workloads from the edge to the cloud are critical across every major industry," said Kamran Amini, Vice President and General Manager of Server & Storage, Lenovo Infrastructure Solutions Group. "With the performance and management improvements of the Intel-based ThinkSystem V3 portfolio, customers can reduce their IT footprint by up to three times to achieve greater ROI and more easily transform their infrastructure with one seamless platform designed for today's AI, virtualization, multi-cloud and sustainable computing demands."

Intel today marked one of the most important product launches in company history with the unveiling of 4th Gen Intel Xeon Scalable processors (code-named Sapphire Rapids), the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Center GPU Max Series (code-named Ponte Vecchio), delivering for its customers a leap in data center performance, efficiency, security and new capabilities for AI, the cloud, the network and edge, and the world's most powerful supercomputers.

Working alongside its customers and partners with 4th Gen Xeon, Intel is delivering differentiated solutions and systems at scale to tackle their biggest computing challenges. Intel's unique approach to providing purpose-built, workload-first acceleration and highly optimized software tuned for specific workloads enables the company to deliver the right performance at the right power for optimal overall total cost of ownership. Additionally, as Intel's most sustainable data center processors, 4th Gen Xeon processors deliver customers a range of features for managing power and performance, making the optimal use of CPU resources to help achieve their sustainability goals.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings its upcoming server platforms powered by 4th Gen Intel Xeon Scalable processors optimized for HPC and storage markets at SC22 on November 14-17, Booth#2000 in the Kay Bailey Hutchison Convention Center Dallas.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue driving the changes in the HPC landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in chip technology coupled with the rise in cloud computing has brought high levels of compute power within reach for smaller organizations. HPC now is affordable and accessible to a new generation of users."

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its PCI Express (PCIe) 6.0 Interface Subsystem comprised of PHY and controller IP. The Rambus PCIe Express 6.0 PHY also supports the latest version of the Compute Express Link (CXL) specification, version 3.0. "The rapid advancement of AI/ML and data-intensive workloads is driving the continued evolution of data center architectures requiring ever higher levels of performance," said Scott Houghton, general manager of Interface IP at Rambus. "The Rambus PCIe 6.0 Interface Subsystem supports the performance requirements of next-generation data centers with premier latency, power, area and security."

The Rambus PCIe 6.0 Interface Subsystem delivers data rates of up to 64 Gigatransfers per second (GT/s) and has been fully optimized to meet the needs of advanced heterogenous computing architectures. Within the subsystem, the PCIe controller features an Integrity and Data Encryption (IDE) engine dedicated to protecting the PCIe links and the valuable data transferred over them. On the PHY side, full support for CXL 3.0 is available to enable chip-level solutions for cache-coherent memory sharing, expansion and pooling.

SMART Modular Technologies, Inc. a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new Compute Express Link (CXL) Memory Module, the XMM CXL memory module. SMART's new DDR5 XMM CXL modules helps boost server and data center performance by enabling cache coherent memory to be added behind the CXL interface, further expanding big data processing capabilities beyond the current 8-channel/12-channel limitations of most servers.

The industry adoption of composable serial-attached memory architecture enables a whole new era for the memory module industry. Serial-attached memory adds capacity and bandwidth capabilities beyond main memory DIMM modules. Servers with XMM CXL modules can be dynamically configured for different applications and workloads without being shut down. Memory can be shared across nodes to meet throughput and latency requirements.

JEDEC Solid State Technology Association and Compute Express Link (CXL) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The agreement outlines the formation of a joint work group to provide a forum that facilitates communication and sharing of information, requirements, recommendations and requests with the intent that this exchange of information will help standards developed by each organization augment one another.

"The MOU between JEDEC and CXL Consortium will establish a framework for ongoing communication to align future efforts between the two organizations. The joint work group will collaborate on useful solutions for form factors, management, security, and DRAM and other memory technologies," said Siamak Tavallaei, CXL Consortium President.

Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held at the Santa Clara (California) Convention Center, Aug. 2-4. In a keynote titled "Memory Innovations Navigating the Big Data Era," Samsung spotlighted four areas of technological advancement driving the big data market—data movement, data storage, data processing and data management—and revealed its leading-edge memory solutions addressing each field.

To maximize data center efficiency in an increasingly data-driven world, Samsung introduced a next-generation storage technology, "Petabyte Storage." The new solution will allow a single server unit to pack more than one petabyte of storage, enabling server manufacturers to sharply increase their storage capacity within the same floor space with a minimal number of servers. High server utilization will also help to lower power consumption.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage announces its new Compute Express Link (CXL) Memory Module, the XMM CXL memory module. SMART's new DDR5 XMM CXL modules helps boost server and data center performance by enabling cache coherent memory to be added behind the CXL interface, further expanding big data processing capabilities beyond the current 8-channel/12-channel limitations of most servers.

The industry adoption of composable serial-attached memory architecture enables a whole new era for the memory module industry. Serial-attached memory adds capacity and bandwidth capabilities beyond main memory DIMM modules. Servers with XMM CXL modules can be dynamically configured for different applications and workloads without being shut down. Memory can be shared across nodes to meet throughput and latency requirements.

The CXL Consortium, an industry standards body dedicated to advancing Compute Express Link (CXL) technology, today announced the release of the CXL 3.0 specification. The CXL 3.0 specification expands on previous technology generations to increase scalability and to optimize system level flows with advanced switching and fabric capabilities, efficient peer-to-peer communications, and fine-grained resource sharing across multiple compute domains.

"Modern datacenters require heterogenous and composable architectures to support compute intensive workloads for applications such as Artificial Intelligence and Machine Learning - and we continue to evolve CXL technology to meet industry requirements," said Siamak Tavallaei, president, CXL Consortium. "Developed by our dedicated technical workgroup members, the CXL 3.0 specification will enable new usage models in composable disaggregated infrastructure."

The industry has been undergoing significant changes in computing. Application specific hardware acceleration is becoming commonplace and new memory technologies are influencing the economics of computing. To address the need for an open architecture to allow full industry participation, the OpenCAPI Consortium (OCC) was founded in 2016. The architecture that was defined allowed any microprocessor to attach to coherent user-level accelerators, advanced memories, and was agnostic to the processor architecture. In 2021, OCC announced the Open Memory Interface (OMI). Based on OpenCAPI, OMI is a serial attached near memory interface that provides low latency and high bandwidth connections for main memory.

In 2019, the Compute Express Link (CXL) Consortium was launched to deliver an industry-supported cache-coherent interconnect for processors, memory expansion, and accelerators. In 2020, the CXL and Gen-Z Consortiums announced plans to implement interoperability between their respective technologies, and in early 2022, Gen-Z transferred its specifications and assets to the CXL Consortium.