Intel Corporation today unveiled its 2010 Intel Core vPro processor family to meet the needs of businesses of all sizes for PCs with greater, more flexible performance, theft prevention and cost savings in a rapidly changing business computing environment. These and several other capabilities are at the heart of many new Intel-based business laptop and desktop computers beginning to roll out from computer manufacturers worldwide.

The Intel Core vPro processors arrive as business computing evolves with the emergence of video, Internet telephony, social networking and other heavyweight applications - in many cases running at the same time - making a computer's performance an even bigger priority.

NEC gave its ValueStar W line of all-in-one PCs which it released last year a specifications upgrade. Variants feature Intel's new dual-core processors, with a choice between the Core i5 650 which runs at 3.20 GHz, and the Core i3 530 clocked at 2.93 GHz. Other features include 4 GB of DDR3 memory, 1 TB of storage, Blu-ray disc drive, and Intel integrated graphics. TV tuner and USB 3.0 controllers are also optional. Another major change is the Windows 7 Home Premium operating system, which takes place of Windows Vista, on the specs sheet. The PCs come with bezel colors of red, black and white. They feature screen sizes of 21.5" and 23", both with resolutions of 1920 x 1080 pixels.

Followed by Intel recent 32nm "Clarkdale" Core i5 / i3 processor launch with built-in GPU engine, it is now a brand new page and competition for all-in-one PC. BIOSTAR, a professional manufacturer of motherboards after its top-line H55 motherboards "TH55XE" being released, today we see another main stream board "TH55B HD" in the market remains high quality component design, outstanding over clocking capabilities and new colorful slots. And of course, it also offers more competitive prices.

"TH55B HD" - a member of BIOSTAR famous "T-Series" with Micro ATX form factor design, black color PCB, and supporting latest Intel 32nm "Clarkdale" Core i5 / i3 processor.

Samsung Electronics Co., Ltd., a market leader in consumer electronics and world leader in IT technology, today announced the extension of its R-Series range of notebooks with six ultra-stylish new models - the powerful R780, R580 and R480 and the stylish R730, R530 and R430.

The R780, R580 and R480's built- in Intel Core i5-520M Processor moves faster than you do by automatically allocating processing power where it's needed most. So, whether you're creating high definition (HD) video, composing digital music, editing photos, or playing the coolest PC games, they enable you to multitask with ease and be more productive than ever.

Shuttle, an industry leading designer and manufacturer of high-performance small form factor (SFF) PC solutions and creator of the XPC, today released details and images for the Shuttle models that will be showcased at the 2010 International CES, the world's largest tradeshow for consumer technology, from January 7-10, 2010.

Shuttle will be unveiling its forthcoming XPC models slated for release in the first half of the year, from the new J Series and re-designed All-In-One PC product lines. These models include the latest technology and new features from Intel, including the next-generation Intel Atom platform and the all new Intel Core i3, Intel Core i5, and Intel Core i7 processors.

EVGA introduced its lineup of three motherboards based on the new Intel H55 Express and H57 Express chipsets. These motherboards feature LGA-1156 sockets to support all current LGA-1156 Core i3, Core i5, and Core i7 processors. With the Intel Flexible Display Interface support, the boards let you make use of the integrated GPUs on some dual-core Intel Core i3, Core i5, and Pentium processors. Models include EVGA H57 (123-CD-E637-KR), EVGA H55 (123-CD-E635-KR), and EVGA H55V (111-CD-E630-TR), with the H55V being a micro-ATX model.

The EVGA H55 and EVGA H57 offer a little more than the chipset's feature-set, with Firewire, and additional storage controllers for IDE and two additional SATA 3 Gb/s ports. The two feature nearly identical board layouts with 5+1 phase CPU VRM, DVI and D-Sub for display connectivity, 8-channel audio, and a number of USB 2.0 ports. The EVGA H55 has one set of internal USB headers less, and does away with the PCI-Express x1 slots between the PCI-E 2.0 x16 and PCI-E x16 (x4) slots.

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel H55 and Intel H57 chipset and leveraging the success of the GIGABYTE Ultra Durable 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6 PC management tools, Dynamic Energy Saver 2 power saving utilities, DualBIOS and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.

"GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices," commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. "Featuring next generation storage capabilities including USB 3.0 and high performance digital DisplayPort connectivity, as well as GIGABYTE's own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system."

MSI G-Series and C-Series of laptop computers have reached a new apex in their evolution. The first NBs equipped with Intel's new generation Calpella platform to be shown at CES 2010, both series come with Intel's most advanced family of New Core processors and Microsoft's Windows 7 operating system. They also come with cinema-class screens coupled with top-end Surround Sound for maximum audiovisual enjoyment.

World-renowned mainboard and graphics card manufacturer, MSI, today officially released H57/H55 Intel chipset products that offer outstanding performance, effective heat dissipation and remarkable power efficiency and stability. After installation of the 32nm Intel Core i5 and Core i3 processors with graphics cores integrated, ultra-strong display performance and outstanding multi-display capability complement MSI's exclusive OC Genie one-second overclocking technology. This enhances 3D performance by up to 45%, allowing smooth BD movie playback, and seize the advantage while gaming.

MSI H57/H55 Series mainboards with built-in industry leading OC Genie auto overclocking technology: Just press the OC Genie button on the mainboard and within one second; enjoy auto overclocking and an optimized processor. Memory module and chipset setting values give overall 3D performance a boost of up to 45%. Whether users want to watch a high bit-rate HD movie or go online for some head-to-head gaming, both can be enjoyed with image performance that is smoother and lag-free.

Support for the latest generation of Intel Core i3, Core i5 and Core i7 takes the ZOTAC H55-ITX WiFi to performance levels previously unattainable by the mini-ITX form factor. The ZOTAC H55-ITX WiFi supports Intel QuickPath technology for lightning-fast communications to high-speed dual-channel DDR3 memory for superior bandwidth and quicker memory access that delivers the chart-topping performance enthusiasts and performance-hungry users desire.

"Since Intel announced its latest generation of Nehalem CPUs, there's been great demand for a mini-ITX platform for the CPUs, unfortunately the power consumption and heat output of the original Intel Core i7 900 series would've been too high for such a small form factor," said Carsten Berger, marketing director, ZOTAC International (MCO), Ltd. "With the latest generation of Intel Core i3, Core i5 and Core i7 processors, greater energy efficiency and improved thermal management, the ZOTAC H55-ITX WiFi is able to deliver a mini-ITX platform capable of accommodating the new high-performance processors with no compromises."

Elitegroup Computer Systems (ECS), a leading motherboard, graphics card, barebone system and notebook manufacturer, today announced the launch of the ECS H57/H55 motherboard family with a lot of options of brand new technologies and unique features to meet the next generation of HTPC.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping the largest HyperX DDR3 memory kits to date. Users of the Intel Core i7 and X58 platforms can now take their systems to the memory extreme with Kingston's 1600MHz 24GB HyperX kit made up of six 4GB modules. For Core i5, P55 chipset enthusiasts, Kingston has released a 1600MHz 16GB kit of four 4GB modules to take full advantage of dual-channel performance.

"We are pleased to make available the largest HyperX memory kits ever for the prosumers, multimedia pro or super enthusiast who wants everything," said Mark Tekunoff, senior technology manager, Kingston. "Users working with the latest operating systems like Windows 7 can keep multiple programs open, run memory intensive video or photo applications, or run numerous virtual machines using 24GB or 16GB of DDR3 HyperX memory and create more efficiency and performance gains than ever before."

KINGMAX, leading manufacturer of DRAM Module and Flash Products, announces the high density solution for DDR3 memory for Intel Core i5 and i7, provide the most stable compatibility for desktop and laptop platforms. These DIMMs are available in single, dual and triple channel configurations and are specifically tuned for Intel CPUs; unleash the best performance for gaming operation.

KINGMAX high density solution DRAM Module improves the performance of 64 bit OS efficiently. The efficiency would be upturned after adopting KINGMAX high density DRAM Module, while operating video decoding, large image file handling and modifying and performance demanding games.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and high performance solid-state storage, has today released its ultimate DDR3 memory kit. At 2400 MHz CL9 and 2000 MHz CL6, these ultra high frequency memory modules are available in standard 4GB (2GBx2) memory kits and are specifically tailored for Intel's P55 chipset and LGA-1156 CPUs.

The 2,400MHz CL9 memory modules are the fastest commercially available memory product in the world, allowing overclocking enthusiasts to reach unprecedented levels of performance to achieve the ultimate PC. In addition, G.Skill has also announced a series of ultra low latency DDR3 2,000MHz memory kits, including an extreme CL6, followed by CL7, CL8 and CL9, which perfectly match current Intel Core i5 750 and Core i7 860, 870 CPUs.

World class flash memory module manufacturer, Silicon Power announces today the new Xpower DDR3 overclocking series memory module. Complete with dual (2GBx2) and tri-channel (2GBx3) packs, it is available in DDR3-1600, 1800, 2000, 2133 MHz variants. Completely compatible with Intel quad-core Core i5 and Core i7 platforms, Xpower DDR3 modules use "oblique groove manufacturing process" and pure aluminum heat sink to resolve heat dissipation issues. In addition, Xpower DDR3 applies 1.65V to maintain high speed and stability to meet the needs of enthusiasts and gamers.

The oblique groove heat sink design of Silicon Power's Xpower DDR3 overclocking series increases the heat dissipation area of the heat sink and can provide up to twice the heat dissipation ability over standard heat sinks. In addition, the Xpower DDR3 series use 8-layered PCBs and new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer.

ASUS today announces the launch of a new motherboard series based on the Intel H57 and H55 chipsets. The ASUS P7H57D/P7H55 Series supports the new Intel Core i7, Core i5, Core i3, and Pentium processors with feature laden ATX and micro-ATX models to provide the best value and performance on the new LGA1156 platform. Featuring exclusive GPU Boost technology, the series delivers a rich visual experience and smooth video performance with Intel's latest HD capable integrated graphics capable processors. Built with Xtreme Design features, the P7H57D/P7H55 Series delivers optimized performance while being very energy-efficient. The ATX based P7H57D-V EVO also supports next-generation USB 3.0 and SATA 6 Gb/s technology for faster data throughput and better storage performance.

EVGA seems to be ready with two of its first motherboards based on the Intel H55 Express and H57 Express chipsets, supporting processors in the LGA-1156 package, along with support for Intel Flexible Display Interface to make use of the iGPU embedded in some dual-core Pentium, Core i3, and Core i5 processors. The two look nearly similar - infact seem to have the same PCB layout. The LGA-1156 socket is wired to four DDR3 DIMM slots for dual-channel memory support. There are two PCI-Express slots (x16, x4), and three PCI slots. The EVGA H57 model further packs two PCI-Express x1 slots.

The H55/H57 chipset provides six SATA 3 Gb/s ports, all of which are assigned as internal ports. A JMicron-made storage controller provides additional two SATA 3 Gb/s ports, along with an IDE connector to support two devices. Display connectivity on both models includes DVI and D-Sub. Other features include 8-channel audio, gigabit Ethernet, Firewire, and a number of USB 2.0 ports. The H55 model has two internal ports less, along with other internal features that the chipset lacks, such as Remote PC Assist, and Rapid Storage Technology. More details will be out soon.

Intel today gave a go ahead for the media to publish reviews of its brand new dual-core processors under the Core i5 6xx and Core i5 6x1 series. The processors are based on the new "Clarkdale" processor die, and make use of the company's 32 nm next generation HKMG manufacturing process. Unlike conventional processor packages based on the Nehalem/Westmere architecture, the new processors move the northbridge component of the system onto the processor package, only that it is based on a separate 45 nm die within the package. The 32 nm processor die houses two processor cores along with up to 4 MB of L3 cache, while it is wired to a larger iGPU die which houses the dual-channel DDR3 memory controller, a graphics core, PCI-Express root complex, along with other components traditionally found on northbridge chips.

The first three models in the new Core i5 series are the 3.20 GHz Core i5 650, 3.33 GHz Core i5 660 and 661 (latter has a faster iGPU), and 3.46 GHz Core i5 670. These processors have the LGA-1156 package and are compatible with existing P55 Express chipset (albeit without the iGPU feature), along with the company's new H55 Express and H57 Express chipsets that support the Flexible Display Interface that provides connectivity to the processors' iGPUs. The new processors feature HyperThreading Technology, with which it provides the operating system with four logical CPUs (threads) to deal with, TurboBoost technology which powers down a core and overclocks the other when the task load is low. Pricing and availability will surface when the processors are formally announced, a little later this month. Meanwhile, motherboard manufacturers are ready with boatloads of new motherboard models based on Intel's two new chipsets. A compilation of links to major reviews on the internet can be found in the day's reviews list on the homepage.

After giving its socket LGA-1156 quad-core processors a flying start, Intel is poised to release not just a couple of more processors in Q1-2010, but as many as 17 new models on January 7 alone, reports suggest. Among these are chips based on the company's new 32 nm manufacturing technology, which gives the manufacturer headroom to up features and performance, while maintaining low thermal and energy footprints.

This is when the company completes its triad of new generation Core family processors, with the Core i3 series of entry-level thru lower-mainstream processors. This triad starts with Core i3 as an entry-point for "smart performance", with Core i5 in the middle delivering "smart performance with Turbo Boost Technology", and Core i7 at the top, delivering "the ultimate in smart performance".

Transcend Information Inc., a worldwide leader in the manufacture of high-performance memory modules, today launched 4GB aXeRam DDR3-2000 memory kits for use with Intel's LGA1156 Core i5 and Core i7 platforms. The XMP-ready DDR3 kits are designed to operate at a blazing-fast clock frequency of 2000 MHz with an exceptionally low voltage of just 1.65V.

Featuring memory bandwidth up to an incredible 32GB/s, Transcend's new aXeRam dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i5 platform to the next level of memory overclocking performance. The Core i5, based on Intel's new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

Corsair, a worldwide leader in high-performance computer and flash memory products, today announced a 24GB Dominator triple-channel DDR3 memory kit designed for high-performance desktop and workstation computing applications.

Corsair's 24GB Dominator DDR3 memory kit has been rigorously tested in high-performance platforms based on the Intel X58 motherboard chipset for Intel Core i7 [Bloomfield] processors. It comprises six 4GB DDR3 DIMMs that operate at a frequency of 1333MHz, at latency timings of 9-9-9-27, with 1.65V VDIMM. The 24GB Dominator memory kit also features Corsair's patented DHX+ heatsink technology for optimal cooling and reliability. The modules, equipped with signature American Racing Blue heatsink fins, are found on select Corsair Dominator DDR3 memory for Intel Core i5 and Core i7 platforms in 8GB and 12GB kits.

Noctua today officially introduced its new NH-C12P SE14 premium cooler. Building on the proven basis of the successful NH-C12P, the NH-C12P SE14 now comes with Noctua's new, already award winning NF-P14 140mm fan for further improved quiet cooling performance and adds support for LGA1156 as well as LGA1366 via the latest SecuFirm2 multi-socket mounting system.

"Ever since its introduction last year, our NH-C12P has been a very popular choice among customers who seek excellent cooling performance close to our signature NH-U12P series at much lower height", says Mag. Roland Mossig, Noctua CEO. "More than 100 awards and recommendations from the international press are a testimony to the NH-C12P's broad appeal, so we've decided to issue a special edition that adds compatibility with the latest Intel sockets and further improves the coolers renowned cooling efficiency by using our new NF-P14 fan."

The third motherboard vendor in the league to be ready with products based on the Intel H5x Express chipset is ASRock, whose first wave consists of one ATX, and two micro-ATX form-factor motherboards, based on the H55 Express chipset. The H55 Express chipset is known to bring along the Flexible Display Interface, which handles the connectivity of the embedded graphics processors Intel's upcoming Core i3 and Core i5 "Clarkdale" processors feature, completing Intel's portfolio of processors based on the Nehalem/Westmere architectures across all segments. H55 Express is a toned-down version of the H57 Express chipset, it lacks support for technologies such as Remote PC Assist, Rapid Storage, and has slightly lesser number of USB 2.0 ports and lesser PCI-Express lanes in its local hub.

The two micro-ATX motherboards from ASRock are the H55M Pro and H55M. These boards are nearly same, in having 4+1 phase CPU VRM, display connectivity that includes DVI, D-Sub, and HDMI, expansion slots which include a PCI-Express 2.0 x16, a PCI-Express x16 (electrical x4), and one each of PCI-Express x1 and PCI. Both feature high-grade DuraCap solid-state capacitors, 8-channel audio, gigabit Ethernet, and eSATA. The two differ with the H55M Pro being slightly broader to accommodate four DDR3 DIMM slots, while the H55M has two, the H55M Pro has five out of six SATA 3 Gbps ports from its PCH assigned as internal ports, with one eSATA, and features FireWire, while the H55M has four internal SATA 3 Gbps ports, two ports are assigned as eSATA, and FireWire is absent.

Over a month ahead of its launch, the first wave of Intel's 32 nm based Core i3 and Core i5 series dual-core processors have been listed on German online store HPM-Computer. The pricing and specifications disclosed by these listing confirm the information that surfaced as early as in July, this year. The series starts with Core i3 500 series processors whose clock speeds range between 2.93 to 3.06 GHz, and continue with Core i5 600 series dual-core processors ranged between 3.20 GHz and 3.43 GHz. While both series feature HyperThreading Technology to give the operating system four logical processors (threads) to work with, the Core i3 processors lack the Turbo Boost feature which the Core i5 chips have.

According to the new listing in which the chips are priced in Euros, the 2.93 GHz Core i3 530 processor is priced at 103.90 EUR, and 3.06 GHz Core i3 540 at 120.90 EUR. The Core i5 600 series lineup includes the 3.20 GHz Core i5 650 priced at 160.90 EUR, 3.33 GHz Core i5 660 and 661 priced at 175.90 EUR, and lead by the 3.43 GHz Core i5 670 priced at a premium 252.90 EUR point. All prices include a 19% applicable tax. The IGP clock speed (750 MHz vs. 900 MHz), differentiates Core i5 660 from 661. It is likely that the price of one of those seems to have entered incorrectly. With these processors, Intel may also introduce the Intel H57 Express chipset, and motherboards by various vendors will soon follow. These processors, however, have the same LGA-1156 socket the "Lynnfield" quad-core processors have, which are currently in the market. They may run on existing P55 Express based motherboards too, according to a recent report.

Following Intel's launch of the new socket LGA-1156 platform with quad-core Intel Core i5, Core i7 "Lynnfield", and the P55 Express chipset to drive the platform, Intel is preparing to drop another chalk in Q1 2010, with dual-core socket LGA-1156 processors that use the Core i3 and Core i5 brand identifiers. A feature unique to these processors is the integration of a graphics controller into the processor package. On the platform side, core-logic must support the Intel Flexible Display technology, which handles connectivity for that graphics controller. The chipset which will drive this would be Intel's upcoming H57 Express chipset, codenamed "Eagle Lake".

Motherboards based on the H57 chipset typically feature display connectors such as DVI, D-Sub, or HDMI. While intended to cover the mainstream segment, H57 can also be used to drive high-grade motherboards, as is shown by ASUS with its newest motherboard based on the chipset - the P7PH57D-V EVO. The ATX motherboard resembles the P7P55D Deluxe in many design aspects. It supports all the high-end features its cousin does, including support for SATA 6 Gb/s and USB 3.0 along with full-bandwidth PCI-Express 2.0 interfaces for the controllers.