Imagination Technologies today unveils the next product in the Catapult CPU IP range, the Imagination APXM-6200 CPU: a RISC-V application processor with compelling performance density, seamless security and the artificial intelligence capabilities needed to support the compute and intuitive user experience needs for next generation consumer and industrial devices.

"The number of RISC-V based devices is skyrocketing with over 16Bn units forecast by 2030, and the consumer market is behind much of this growth" says Rich Wawrzyniak, Principal Analyst at SHD Group. "One fifth of all consumer devices will have a RISC-V based CPU by the end of this decade. Imagination is set to be a force in RISC-V with a strategy that prioritises quality and ease of adoption. Products like APXM-6200 are exactly what will help RISC-V achieve the promised success."

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

EK, the renowned premium liquid cooling gear manufacturer, is proud to unveil its latest accessory that promises to streamline the assembly process for enthusiasts and professionals alike: the EK-Loop Stainless Steel Gauge Card. Crafted from durable stainless steel and designed for simplicity, this handy tool is an essential accessory for anyone involved in water cooling. Its primary function serves to drastically simplify the search for the correct assembly parts, ensuring that users can effortlessly find compatible components. Multifunctional by design yet primarily aimed at enhancing the water cooling experience, the EK-Loop Gauge Card is the accessory you didn't know you needed—until now.

Preventing Assembly Errors Before They Happen
With the Gauge Card, measuring and matching bolt and nut sizes becomes effortless. It accurately determines the bolt size and length for any component, including nut size measurements for M2.5, M3, and M4 nuts. This guarantees compatibility and ease of assembly across a wide range of components. The card also allows for the identification of different screw diameters (M4, M3.5, M3, M2.5, M2) and screw dimensions effortlessly, making it more straightforward to select the right parts for your build. Screw length identification up to 30 mm further ensures precise fitting and optimal security of components, while the tool aids in avoiding the insertion of the wrong bolts in the wrong places - thus preventing potential damage to sensitive PCBs. Moreover, the EK-Loop Gauge Card aids in the determination of Allen key sizes (2, 2.5, 6, 8, 9), simplifying the search for the right tool for the job.

Assassin's Creed Mirage was envisioned as an homage to its franchise—a celebration of how it began and what it accomplished between 2007's Assassin's Creed and 2023's Mirage. Beginning as an idea for a DLC expansion that would take Eivor to the Middle East, it grew into a standalone prequel starring Basim, the enigmatic Hidden One from Valhalla. Developed as a shorter experience by Ubisoft Bordeaux, the return-to-roots game presented a distinctive set of challenges, which are explored in the March 22 GDC talk "Between Legacy and Modernity: Creating an Homage Game to the 15-Year-Old Assassin's Creed Franchise."

During the talk, Creative Director Stéphane Boudon and Lead Producer Fabian Salomon discuss the game's beginnings, its growth into a "remoot"—that is, something between a remake and a reboot - and how a streamlined approach helped them make tough choices and focus the game on the Assassin experience. To find out more, we spoke with Boudon and Salomon about some of the early concepts behind the game, a few features that didn't make the cut, and how Mirage re-introduced and redefined stealth as a gameplay pillar.

Xbox and Fallout fans, rejoice! Today, we are thrilled to announce a striking collaboration between Xbox and new series on Prime Video "Fallout", premiering on April 11. Introducing the Xbox and Fallout Vault Box—a custom collaboration that combines the rugged essence of the Fallout universe with the unparalleled security of a Fort Knox vault. Based on one of the greatest video game series of all time, "Fallout" is the story of haves and have-nots in a world in which there's almost nothing left to have. Two-hundred years after the apocalypse, the gentle denizens of luxury fallout shelters are forced to return to the irradiated hellscape their ancestors left behind—and are shocked to discover an incredibly complex, gleefully weird, and highly violent universe waiting for them.

The series comes from Kilter Films and executive producers Jonathan Nolan and Lisa Joy. Nolan directed the first three episodes. Geneva Robertson-Dworet and Graham Wagner serve as executive producers, writers and co-showrunners. The series stars Ella Purnell (Yellowjackets), Aaron Moten (Emancipation) and Walton Goggins (The Hateful Eight). Athena Wickham of Kilter Films also executive produces along with Todd Howard for Bethesda Game Studios and James Altman for Bethesda Softworks. Amazon MGM Studios and Kilter Films produce in association with Bethesda Game Studios and Bethesda Softworks.

Altair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design. "As the electronics industry pushes the boundaries of complexity and miniaturization, engineers have struggled with simulations that often compromise on detail for expediency. Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification," said James R. Scapa, founder and chief executive officer, Altair. "Traditional simulation methods often require approximations when analyzing PCB structures due to their complexity. Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities."

Altair SimSolid has revolutionized conventional analysis in its ability to accurately predict complex structural problems with blazing-fast speed while eliminating the complexity of laborious hours of modeling. It eliminates geometry simplification and meshing, the two most time-consuming and expertise-intensive tasks done in traditional finite element analysis. As a result, it delivers results in seconds to minutes—up to 25x faster than traditional finite element solvers—and effortlessly handles complex assemblies. Having experienced fast adoption in the aerospace and automotive industries, two sectors that typically experience challenges associated with massive structures, Altair SimSolid is poised to play a significant role in the electronics market. The initial release, expected in Q2 2024, will support structural and thermal analysis for PCBs and ICs with full electromagnetics analysis coming in a future release.

Our favorite thing about Zau might surprise you. Or, it might be the first thing you noticed. In a recent Discord Q+A (viewable below), ZAU Creative Director Abubakar Salim throws the deceptively simple question to Lead Artist Ackeem Durrant and Lead Designer Zi Peters: what's your favorite thing about our main character? Since our reveal in December, we've been completely floored by how many of you took the leap to pre-order ZAU. We worked hard to give the game a fair price—and a 10% discount to everyone who buys before launch day - plus carefully crafted in-game content that feels special while not detracting from our central vision for the game. We're incredibly grateful for your support. Thank you.

Wield the dance of the shaman. Reclaim your father's spirit
A grieving boy begins to read a Bantu tale written by his late father. Adventure into the beautiful and treacherous lands of Kenzera as Zau, a young shaman who bargains with the God of death to bring his Baba back from darkness. With your cosmic powers and untried courage, you advance into unknown mythological lands. Once bursting with life, Kenzera is now rife with lost ancestral spirits. As Zau advances toward his goal, 3 mighty beings lie in wait, fearsome in their strength yet somehow strangely familiar. Will you embrace the dance of the shaman?

The HPC research projects DEEP-SEA, IO-SEA and RED-SEA are wrapping up this month after a three-year project term. The three projects worked together to develop key technologies for European Exascale supercomputers, based on the Modular Supercomputing Architecture (MSA), a blueprint architecture for highly efficient and scalable heterogeneous Exascale HPC systems. To achieve this, the three projects collaborated on system software and programming environments, data management and storage, as well as interconnects adapted to this architecture. The results of their joint work will be presented at a co-design workshop and poster session at the EuroHPC Summit (Antwerp, 18-21 March, www.eurohpcsummit.eu).

Blink, an Amazon company, today announced the next-generation Blink Mini 2. The new Blink camera packs a punch in a compact, weather-resistant design that can now be used indoors or outdoors with the purchase of the new Blink Weather Resistant Power Adapter (sold as part of a bundle or separately). Blink Mini 2 offers enhanced image quality with improved low light performance, a wider field of view, and a built-in LED spotlight for night view in color. Powered by the company's custom-built chip, Blink Mini 2 utilizes on-device computer vision (CV) to support smart notifications, including person detection, which is available with a Blink Subscription Plan (sold separately).

"It is clear customers love Blink—in fact, the Blink business has grown 5x over the last four years," said Liz Hamren, chief executive officer at Blink. "We are building on this momentum with the addition of Mini 2 to Blink's affordable and easy-to-use suite of devices. Mini 2 was rebuilt from the inside out, keeping everything customers expect from Blink while adding even more utility through features like person detection, all at an incredible price point."

Introducing the newest collection of Xbox Wireless Controllers: the Vapor series in Xbox Design Lab and the Xbox Wireless Controller—Dream Vapor Special Edition. In this collection, each top case features a dynamic pattern that is unique to every controller. If you are familiar with the Xbox Wireless Controller—Stormcloud Vapor Special Edition, you have seen how this misty pattern creates a subtle and textured look that only you can call yours.

The Vapor series with Xbox Design Lab brings some of the most unique controller designs available for your customization, offering six top case options with swirling color patterns. If green is your thing, the Electric Vapor top case merges the bold Electric Volt and the iconic Velocity Green, while the Nocturnal Vapor top case draws you in with its Dark Green and Grey swirl. Feel the heat with the Fire Vapor top case, featuring a fiery red and orange swirl, or opt for the cool and collected Stormcloud Vapor, with a sleek blue swirl design. If pink and purple are your power colors, look no further than the Cyber Vapor top case, showcasing a lively pink and purple swirl, or enter in the dreamy hues of the Dream Vapor top case with its soft pink and soft purple swirl.

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

LG Electronics (LG) is set to unveil its latest lineup of UltraGear OLED gaming monitors, designed to provide superior gaming experiences. The expanded lineup includes the highly anticipated 32-inch 4K gaming monitor (model 32GS95UE), which boasts a 240 Hz refresh rate, an ultra-fast 0.03 ms Gray-to-Gray (GtG) response time, and LG's Dual-Hz feature and Pixel Sound technology. The company is also introducing stellar 39- and 34-inch models with ultra-wide curved screens: the 39GS95QE and the CES 2024 Innovation Award-winning 34GS95QE.

The groundbreaking 32GS95UE is the first UltraGear monitor equipped with the new Dual-Hz feature, allowing users to switch between 4K (3,840 x 2,160) at 240 Hz and Full-HD (1,920 x 1,080) at 480 Hz with one simple click. This time-saving innovation, easily managed via a hotkey or joystick's directional switch, lets users instantly apply the optimal combination of screen resolution and refresh rate for the genre of game they're playing. For fast-paced action titles and shooting games, users can select FHD 480 Hz, while visually rich story-driven games can be enjoyed in 4K 240 Hz.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

NZXT, a leader in PC gaming hardware and services, today announces the H6 Flow and H6 Flow RGB, a compact dual chamber mid-tower ATX case. The H6 Flow offers a harmonious blend of performance and visual appeal for PC enthusiasts. Designed for an expansive and uninterrupted view, the H6 Flow is adorned with consistent tempered glass on the front and sides, granting a panoramic peek into the insides of your build. Leveraging its dual chamber architecture, the new angel front panel directs the airflow from the three pre-included 120 mm fans (or 120 mm RGB fans for the H6 Flow RGB version) and two 140 mm fans at the base of the case allow you to cool your heat generating components. The revamped perforated panels come with a design fine-tuned for optimal airflow and superior performance. While all being easy to build with the H6 Flow facilitates generous cable-routing channels and straps, ensuring organized cable management.

A research paper released this week describes ways generative AI can assist one of the most complex engineering efforts: designing semiconductors. The work demonstrates how companies in highly specialized fields can train large language models (LLMs) on their internal data to build assistants that increase productivity.

Few pursuits are as challenging as semiconductor design. Under a microscope, a state-of-the-art chip like an NVIDIA H100 Tensor Core GPU (above) looks like a well-planned metropolis, built with tens of billions of transistors, connected on streets 10,000x thinner than a human hair. Multiple engineering teams coordinate for as long as two years to construct one of these digital mega cities. Some groups define the chip's overall architecture, some craft and place a variety of ultra-small circuits, and others test their work. Each job requires specialized methods, software programs and computer languages.

Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, today announced it will take over the manufacture and sale of Intel's current Silicon Photonics-based pluggable optical transceiver ("module") product lines and the development of future generations of such modules.

"This deal better positions Jabil to cater to the needs of our valued customers in the data center industry, including hyperscale, next-wave clouds, and AI cloud data centers. These complex environments present unique challenges, and we are committed to tackling them head-on and delivering innovative solutions to support the evolving demands of the data center ecosystem," stated Matt Crowley, Senior Vice President of Cloud and Enterprise Infrastructure at Jabil. "This deal enables Jabil to expand its presence in the data center value chain."

Socionext today announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2 nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of- network markets.

The engineering samples are targeted to be available in 1H2025. This advanced CPU chiplet proof-of-concept using Arm Neoverse CSS technology is designed for single or multiple instantiations within a single package, along with IO and application-specific custom chiplets to optimize performance for a variety of end applications.

Synopsys today announced it has expanded its collaboration with Arm to provide optimized IP and EDA solutions for the newest Arm technology, including the Arm Neoverse V2 platform and Arm Neoverse Compute Subsystem (CSS). Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai full-stack AI-driven EDA suite, and Synopsys Interface, Security, and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions. The expanded partnership builds on three decades of collaboration to enable mutual customers to quickly develop specialized silicon at lower cost, with less risk and faster time to market.

"With Arm Total Design, our aim is to enable rapid innovation on Arm Neoverse CSS and engage critical ecosystem expertise at every stage of SoC development," said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business at Arm. "Our deep technical collaboration with Synopsys to deliver pre-integrated and validated IP and EDA tools will help our mutual customers address the industry's most complex computing challenges with specialized compute."

Today, Logitech G, in collaboration with Lucasfilm Ltd., announced the release of a special edition Return of the Jedi - inspired collection in honor of the 40th anniversary of the hit movie. Designed to celebrate the Star Wars legacy, the collection includes an officially licensed G502 X PLUS Millennium Falcon Edition Gaming Mouse and G840 XL Cloth Gaming Mouse Pad in Battle of Endor and Darth Vader Editions.

The G502 X PLUS Millennium Falcon Edition Gaming Mouse features pro-grade LIGHTSPEED wireless and all-new LIGHTFORCE switch technology for achieving higher levels of speed and reliability during gameplay. Built with custom Millennium Falcon-inspired thruster animations and graphics, the gaming mouse features 8-LED full-spectrum RGB lighting.

Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced today that it selected Samsung Foundry to bring Tenstorrent's next generation of AI chiplets to market. Tenstorrent builds powerful RISC-V CPU and AI acceleration chiplets, aiming to push the boundaries of compute in multiple industries such as data center, automotive and robotics. These chiplets are designed to deliver scalable power from milliwatts to megawatts, catering to a wide range of applications from edge devices to data centers.

To ensure the highest quality and cutting-edge manufacturing capabilities for its chiplet, Tenstorrent has selected Samsung's Foundry Design Service team, known for their expertise in silicon manufacturing. The chiplets will be manufactured using Samsung's state-of-the-art SF4X process, which boasts an impressive 4 nm architecture.

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC's 3DFabric technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process for seamless die-to-die connectivity.

"TSMC has been working closely with Synopsys to deliver differentiated solutions that address designers' most complex challenges from early architecture to manufacturing," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our long history of collaboration with Synopsys benefits our mutual customers with optimized solutions for performance and power efficiency to help them address multi-die system design requirements for high-performance computing, data center, and automotive applications."

Whether it's the ultimate sound system in the home or a single point of sound, Beolab 8 can be used as a system speaker to create an immersive home cinema setup using the latest high-end Bang & Olufsen speakers or even heritage speakers dating back to 1984. Stereo pair two Beolab 8 speakers to create powerful and precise stereo sound for a high-fidelity music experience. Beolab 8 is also a stand-alone speaker delivering depth with an intense bass for its size.

"Our goal is to create powerful and immersive listening experiences for our customers. Beolab 8 provides exactly this. It is a scalable speaker that is all about flexibility, performance, and innovation", says Michael Henriksson, Vice President of Product Marketing at Bang & Olufsen and continues: "Drawing inspiration from the high-end Beolab range, our aim for Beolab 8 was to distil the acoustic essence of these impressive speakers into a compact offering that maintains the directivity and sound beam control for optimal sound reproduction in any environment. Bringing immersive experiences for every moment".

GIGABYTE, the world's leading computer hardware brand, featured its AORUS 17X laptop in two influential AI-content-focused Youtubers by Hugh Hou and MDMZ. Both Youtubers took the new AORUS 17X laptop to the AI image and AI video generation test and found the great potential of how the laptops benefit their workflow. The AORUS 17X laptop is powered by NVIDIA GeForce RTX 40 series GPUs to unlock new horizons for creativity and become the go-to choice for art and tech enthusiasts.

Hugh Hou: Unleashing the Power of AI Arts with the AORUS 17X Laptop
Hugh Hou's journey into AI arts, powered by Stable Diffusion XL, garnered viral success. The AORUS 17X laptop emerged as a game-changer with up to 16G of VRAM, enabling local AI photo and video generation without bearing hefty cloud-rendering costs. It empowers creators and outperforms competitors in AI-assisted tasks and enhances AI artistry.