Following Monday's blockbuster announcements of the "Blackwell" architecture and NVIDIA's B100, B200, and GB200 AI GPUs, all eyes are now on its client graphics derivatives, or the GeForce RTX GPUs that implement "Blackwell" as a graphics architecture. Leading the effort will be the new GB202 ASIC, a successor to the AD102 powering the current RTX 4090. This will be NVIDIA's biggest GPU with raster graphics and ray tracing capabilities. The GB202 is rumored to be followed by the GB203 in the premium segment, the GB205 a notch lower, and the GB206 further down the stack. Kopite7kimi, a reliable source with NVIDIA leaks, says that the GB202 silicon will be built on the same TSMC 4N foundry node as the GB100.

TSMC 4N is a derivative of the company's mainline N4P node, the "N" in 4N stands for NVIDIA. This is a nodelet that TSMC designed with optimization for NVIDIA SoCs. TSMC still considers the 4N as a derivative of the 5 nm EUV node. There is very little public information on the power- and transistor density improvements of the TSMC 4N over TSMC N5. For reference, the N4P, which TSMC regards as a 5 nm derivative, offers a 6% transistor-density improvement, and a 22% power efficiency improvement. In related news, Kopite7kimi says that with "Blackwell," NVIDIA is focusing on enlarging the L1 caches of the streaming multiprocessors (SM), which suggests a design focus on increasing the performance at an SM-level.

Samsung, SK hynix, and Micron are considered to be the top manufacturing sources of High Bandwidth Memory (HBM)—the HBM3 and HBM3E standards are becoming increasingly in demand, due to a widespread deployment of GPUs and accelerators by generative AI companies. Taiwan's Commercial Times proposes that there is an ongoing shortage of HBM components—but this presents a growth opportunity for smaller manufacturers in the region. Naturally, the big name producers are expected to dive in head first with the development of next generation models. The aforementioned financial news article cites research conducted by the Gartner group—they predict that the HBM market will hit an all-time high of $4.976 billion (USD) by 2025.

This estimate is almost double that of projected revenues (just over $2 billion) generated by the HBM market in 2023—the explosive growth of generative AI applications has "boosted" demand for the most performant memory standards. The Commercial Times report states that SK Hynix is the current HBM3E leader, with Micron and Samsung trailing behind—industry experts believe that stragglers will need to "expand HBM production capacity" in order to stay competitive. SK Hynix has shacked up with NVIDIA—the GH200 Grace Hopper platform was unveiled last summer; outfitted with the South Korean firm's HBM3e parts. In a similar timeframe, Samsung was named as AMD's preferred supplier of HBM3 packages—as featured within the recently launched Instinct MI300X accelerator. NVIDIA's HBM3E deal with SK Hynix is believed to extend to the internal makeup of Blackwell GB100 data-center GPUs. The HBM4 memory standard is expected to be the next major battleground for the industry's hardest hitters.

NVIDIA is reported to be on next year's 3 nm-class order book at TSMC, with the Blackwell GB100 data-center GPU marked down as an important production project. A DigiTimes insider piece proposes that Team Green has signed up for orders in the second half of 2024, giving TSMC some wiggle room to iron out alleged advanced packaging issues—but it is implied that Apple is already ahead in the queue. Inside sources have not spotted an Intel request for TSMC's advanced 3 nm process (still utilizing FinFET). Industry experts reckon that NVIDIA could be granted access to a customized node for its Blackwell product line, given their VIP status and special relationship with the leading Taiwanese foundry.

DigiTimes believes that the Blackwell GB100 (sporting a chiplet design) will be targeting a Q4 2024 launch window, therefore arriving before any competing next-gen technologies: "For NVIDIA, which monopolizes more than 80% of the AI GPU market, the next generation B100 will use TSMC's 3 nm...It will seize AI deployment business opportunities while the iron is hot and suppress AMD, Intel and other challengers." Team Red, MediaTek and Qualcomm could be next in the procession—it is claimed that unspecified next-gen EPYC server chips are due in 3 nm form.