Following in the wake of an earthquake that struck on April 3rd, TrendForce undertook an in-depth analysis of its effects on the DRAM industry, uncovering a sector that has shown remarkable resilience and faced minimal interruptions. Despite some damage and the necessity for inspections or disposal of wafers among suppliers, the facilities' strong earthquake preparedness of the facilities has kept the overall impact to a minimum.

Leading DRAM producers, including Micron, Nanya, PSMC, and Winbond had all returned to full operational status by April 8th. In particular, Micron's progression to cutting-edge processes—specifically the 1alpha and 1beta nm technologies—is anticipated to significantly alter the landscape of DRAM bit production. In contrast, other Taiwanese DRAM manufacturers are still working with 38 and 25 nm processes, contributing less to total output. TrendForce estimates that the earthquake's effect on DRAM production for the second quarter will be limited to a manageable 1%.

On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

Intel has recently revealed a security vulnerability named Downfall (CVE-2022-40982) that impacts multiple generations of Intel processors. The vulnerability is linked to Intel's memory optimization feature, exploiting the Gather instruction, a function that accelerates data fetching from scattered memory locations. It inadvertently exposes internal hardware registers, allowing malicious software access to data held by other programs. The flaw affects Intel mainstream and server processors ranging from the Skylake to Rocket Lake microarchitecture. The entire list of affected CPUs is here. Intel has responded by releasing updated software-level microcode to fix the flaw. However, there's concern over the performance impact of the fix, potentially affecting AVX2 and AVX-512 workloads involving the Gather instruction by up to 50%.

Phoronix tested the Downfall mitigations and reported varying performance decreases on different processors. For instance, two Xeon Platinum 8380 processors were around 6% slower in certain tests, while the Core i7-1165G7 faced performance degradation ranging from 11% to 39% in specific benchmarks. While these reductions were less than Intel's forecasted 50% overhead, they remain significant, especially in High-Performance Computing (HPC) workloads. The ramifications of Downfall are not restricted to specialized tasks like AI or HPC but may extend to more common applications such as video encoding. Though the microcode update is not mandatory and Intel provides an opt-out mechanism, users are left with a challenging decision between security and performance. Executing a Downfall attack might seem complex, but the final choice between implementing the mitigation or retaining performance will likely vary depending on individual needs and risk assessments.

MSI suffered a massive data breach at the start of April and the Taiwanese electronics company promptly alerted its customers about the cyberattack on its "information systems." A few days later it emerged that a relatively young ransomware group "Money Message" was behind the hacking effort - these cybercriminals stated that they had infiltrated MSI's internal network. Gang members proceeded to acquire sensitive company files, database information and source code. At the time, Money Message demanded that MSI pay them a ransom of $4 million, with the added threat of stolen data getting leaked to the general public on the internet (in the event of MSI failing to pay up).

Money Message has this week claimed that MSI has refused to meet their demands - as a result, an upload of stolen data started on Thursday with files appearing on the group's own website, and spreading to the dark web soon after. Binarly, a cybersecurity firm, has since analyzed the leaked files and discovered the presence of many private code signing keys within the breached data dump. Alex Matrosov, Binarly's CEO states via Twitter: "Recently, MSI USA announced a significant data breach. The data has now been made public, revealing a vast number of private keys that could affect numerous devices. FW Image Signing Keys: 57 products (and) Intel Boot Guard BPM/KM Keys: 166 products." Binary has provided a list of affected MSI devices (gaming laptops & mobile workstations) on their GitHub page.

On the evening of September 17, an earthquake with a magnitude of 6.4 on the Richter scale occurred in Guanshan Township, Taitung. Yesterday (9/18) afternoon, an earthquake with a magnitude of 6.8 on the Richter scale occurred in Chishang Township, Taitung. Following up on these recent powerful earthquakes, TrendForce's investigation into their impact on Taiwan's semiconductor and panel industries is as follows:

In terms of foundries, due to shock-absorbing plant designs, earthquake vibrations inside fabs are one level of magnitude less than outside. In terms of equipment manufacturers, currently there are no reports of substantial factory damage. In the worst case, some machinery required initialization after crashing. In terms of memory, Nanya Technology has already carried out a shutdown inspection. If there was any wafer damage, Nanya maintains sufficient inventory to compensate. Micron recalled engineers to inspect equipment and has confirmed no losses. Thus, the capacity utilization rate of these two companies has not been affected nor has supply.

Microsoft Corp. today announced the following results for the quarter ended June 30, 2022, as compared to the corresponding period of last fiscal year:

• Revenue was $51.9 billion and increased 12% (up 16% in constant currency)
• Operating income was $20.5 billion and increased 8% (up 14% in constant currency)
• Net income was $16.7 billion and increased 2% (up 7% in constant currency)
• Diluted earnings per share was $2.23 and increased 3% (up 8% in constant currency)

"We see real opportunity to help every customer in every industry use digital technology to overcome today's challenges and emerge stronger," said Satya Nadella, chairman and chief executive officer of Microsoft. "No company is better positioned than Microsoft to help organizations deliver on their digital imperative - so they can do more with less."

Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce's investigations. Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues. In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated. Circumstances as a whole will continue affecting shipments of related whole devices. Only the PC category is expected to emerge largely unscathed in 1Q22.

Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market's supply situation is expected to be approximately the same as in 4Q21. However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking.

HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

Due to the impact of the coronavirus on semiconductor supply and demand, worldwide semiconductor revenue is forecast to decline 0.9% in 2020, according to Gartner, Inc. This is down from the previous quarter's forecast of 12.5% growth.

"The wide spread of COVID-19 across the world and the resulting strong actions by governments to contain the spread will have a far more severe impact on demand than initially predicted," said Richard Gordon, research practice vice president at Gartner. "This year's forecast could have been worse, but growth in memory could prevent a steep decline."

Bitspower today unveiled its Mono Block for the ASUS ROG Crosshair VIII Impact X570 motherboard. It is designed to cool the socket AM4 processor and CPU VRM of the Crosshair VIII Impact, with precisely-laid base-plate contact points for the board's 8+2 phase VRM and the processor. The block's primary material is nickel-plated copper, with mirror-finish at its base-plate contact points. It features a clear acrylic top with provision for an ARGB LED light strip. A micro-fin lattice is located over the CPU for heat-dissipation. The block measures 115 mm x 98 mm x 28 mm, and features standard G1/4" fittings. Available now, it is priced at USD $140.

The following analysis shows TrendForce's investigations of key component and other downstream technology industries, under the impact of the COVID-19 outbreak, with the latest data as of February 14, 2020.

Semiconductors
Compared to the OSAT industry, the foundry industry has a much higher degree of fab automation and thus is less impacted by the outbreak. But because most workers at semiconductor manufacturing sites in China come from out of town, labor shortages and traffic restrictions will lower work resumption rates at foundries more than expected. In the short term, fab utilization rates may not make a full recovery. As a result, given that the outbreak has not yet been effectively contained, TrendForce is projecting a possible decline in shipment for the Chinese foundry industry in 1Q20, in turn affecting downstream Chinese OSAT companies. The industry's overall performance recovery remains to be seen.

TSMC today provided an update on the Company's computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan. The degree of infection varied by fab. TSMC contained the problem and found a solution, and as of 14:00 Taiwan time, about 80% of the company's impacted tools have been recovered, and the Company expects full recovery on August 6.

TSMC expects this incident to cause shipment delays and additional costs. We estimate the impact to third quarter revenue to be about three percent, and impact to gross margin to be about one percentage point. The Company is confident shipments delayed in third quarter will be recovered in the fourth quarter 2018, and maintains its forecast of high single -digit revenue growth for 2018 in U.S. dollars given on July 19, 2018. Most of TSMC's customers have been notified of this event, and the Company is working closely with customers on their wafer delivery schedule.

Denuvo's impact on gaming performance has been spoken of immensely - as always has been the case for any and all DRM solution that finds its way into games. However, evidence always seemed to be somewhat anecdotal on whether or not Denuvo really impacted performance - for a while, the inability to test games with Denuvo implemented and officially removed (which, unsurprisingly, isn't the same as it being cracked) was a grand stopgap to any sort of serious testing.

Now, courtesy of Overlord's YouTube channel, we can see whether or not Denuvo impacts performance. In a total of seven games tested on a platform with an Intel Core i7 2600K stock CPU (for adequate testing of whether Denuvo really impacts more the CPU than any other system component) paired with a stock clocked 1080 ti. You really should take a look at the video; it's a short, informative one, but the gist of is this: Some games revealed performance improvements with Denuvo being removed: Mass Effect: Andromeda saw a huge boost from an average of 57 FPS all the way to 64 FPS due to the removal of the DRM solution; and Mad Max saw a more meager 54 to 60 FPS increase. The other games (which included Hitman, Abzu, and others, didn't see any performance difference.

HyperX, the gaming division of Kingston Technology Company, Inc., today announced the addition of higher frequency memory modules to the HyperX FURY DDR4 DIMM and HyperX Impact DDR4 SODIMM product lines. FURY DDR4 DIMMs and Impact DDR4 SODIMMs both offer automatic Plug N Play overclocking functionality. FURY DDR4 is now available up to 3466 MHz and Impact DDR4 is now available up to 3200 MHz. Both product lines are available as single modules and as various kits configurations from 8 GB to 64 GB.

HyperX FURY DDR4 is a cost-efficient high-performance upgrade for Intel and AMD's latest platforms for faster video editing, 3D rendering, gaming and AI processing. It features Plug N Play which enables automatic memory overclocking at standard DDR4 1.2V settings. The new FURY DDR4 additions are available in black, red and white low-profile heat spreader colour options that feature the stylish signature FURY asymmetrical heat spreader design with black PCB.