Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.

According to TrendForce's latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts takes time as well. Hence, only some tier-2 and -3 foundries were able to immediately respond to the changes in their clients' demand. Also, among them, 8-inch wafer foundries made a more pronounced reduction in their capacity utilization rates. As for the remaining foundries, the downward corrections that they made to their capacity utilization rates did not become noticeable until 4Q22. Hence, in 4Q22, the quarterly total revenue of the global top 10 foundries registered a QoQ decline for the first time after 13 consecutive quarters of positive growth. The quarterly total revenue of the top 10 foundries came to US$33,530 million, reflecting a drop of 4.7% from 3Q22. Moving into 1Q23, TrendForce projects that the quarterly total revenue of the top 10 will show an even steeper drop on account of seasonality and the uncertain macroeconomic situation.

Today, Intel launched Intel Agilex 7 FPGAs with F-Tile, equipped with the fastest field-programmable gate array (FPGA) transceivers available on the market and designed to help customers address challenges across the most bandwidth-intensive areas of the data-centric world, including data centers and high-speed networks. Created with embedded, networking and cloud customers in mind, Intel's new F-Tile-enabled Agilex 7 FPGAs deliver flexible hardware solutions with industry-leading transceiver performance, delivering up to 116 gigabits per second (Gbps) and hardened 400 gigabit Ethernet (GbE) intellectual property (IP).

"Intel's Agilex 7 with F-Tile is loaded with transceivers that deliver more flexibility, bandwidth and data rate performance than any other FPGA on the market today. Together with Intel manufacturing and our supply chain resilience, we're delivering multiple industry-leading products and capabilities that our customers and the industry require to address a broad range of critical business needs," said Shannon Poulin, Intel corporate vice president and general manager of the Programmable Solutions Group.

TrendForce's recent analysis of the foundry market reveals that demand continues to slide for all types of mature and advanced nodes. The major IC design houses have cut wafer input for 1Q23 and will likely scale back further for 2Q23. Currently, foundries are expected to maintain a lower-than-ideal level of capacity utilization rate in the first two quarters of this year. Some nodes could experience a steeper demand drop in 2Q23 as there are still no signs of a significant rebound in wafer orders. Looking ahead to the second half of this year, orders will likely pick up for some components that underwent an inventory correction at an earlier time. However, the state of the global economy will remain the largest variable that affect demand, and the recovery of individual foundries' capacity utilization rates will not occur as quickly as expected. Taking these factors into account, TrendForce currently forecasts that global foundry revenue will drop by around 4% YoY for 2023. The projected decline for 2023 is more severe when compared with the one that was recorded for 2019.

According to TrendForce's research, the total revenue of the global top 10 foundries rose by 6% QoQ to US$35.21 billion for 3Q22 as the release of the new iPhone series during the second half of the year generated significant stock-up activities across Apple's supply chain. However, the global economy shows weak performances, and factors such as China's policy on containing COVID-19 outbreaks and high inflation continue to impact consumer confidence. As a result, peak-season demand in the second half of the year has been underwhelming, and inventory consumption is proceeding slower than anticipated. This situation has led to substantial downward corrections to foundry orders as well. For 4Q22, TrendForce forecasts that the total revenue of the global top 10 foundries will register a QoQ decline, thereby terminating the boom of the past two years—when there was an uninterrupted trend of QoQ revenue growth.

Regarding individual foundries' performances in 3Q22, the group of the top five was led by TSMC, followed by Samsung, UMC, GlobalFoundries, and SMIC. Their collective global market share (in revenue terms) came to 89.6%. Most foundries were directly impacted by clients slowing down their stock-up activities or significantly correcting down their orders. Only TSMC was able to make a notable gain due to Apple's strong stock-up demand for the SoCs deployed in this year's new iPhone models. TSMC saw its revenue rise by 11.1% QoQ to US$20.16 billion, and the corresponding market share expanded to 56.1%. The growth was mainly attributed to the ≤7 nm nodes, whose share in the foundry's revenue had kept climbing and reached 54% in the third quarter. Conversely, Samsung actually experienced a slight QoQ drop of 0.1% in foundry revenue even though it had also benefited from the component demand related to the new iPhone series. Partially impacted by the weakening of the Korean won, Samsung's market share fell to 15.5%.

ASUS today announced the opening of its first AI-enabled smart factory. The facility is powered by a variety of AIoT technologies, including a 3D Digital Twin system, an augmented reality (AR) platform, autonomous mobile robots (AMR) for in-factory logistics, as well as an AI-driven defect inspection system. All of this will help achieve ASUS Industry 4.0 goals, increasing manufacturing efficiency and improving ESG outcomes.

Albert Chang, ASUS Corporate Vice President and Co-Head of the AIoT Business Group, explained the importance of the new factory:
"In 2018, our Chairman Jonney Shih started ASUS on a new journey to become a company that transforms and evolves, trusts in radical truth and transparency, embraces idea meritocracy, and fosters collective wisdom. The opening of our first AI-enabled smart factory is a significant milestone in our company transformation and showcases our solid integrated capabilities, from software to hardware, that we offer to our clients and suppliers."

onsemi, a leader in intelligent power and sensing technologies, today celebrated the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech Republic. Multiple guests of honor attended the ribbon cutting ceremony led by Ministry of Industry and Trade Section Chief Zbyněk Pokorný, Governor of the Zlín Region Radim Holiš and City Mayor Jiří Pavlica as well as other local governmental dignitaries, signifying the importance of this event and manufacturing of semiconductors in the Czech Republic.

Starting in 2019, onsemi added SiC polished wafer and SiC epitaxy (EPI) wafer production to its existing silicon polished and epitaxy wafer and die manufacturing in Roznov. Having outgrown the original site, reconstruction of a new building began last year to further expand wafer and SiC EPI manufacturing. Over the next two years, this expansion will increase the site's SiC production capabilities by 16 times and create 200 jobs by the end of 2024. So far onsemi has invested more than $150 million in the Roznov site and plans to spend an additional $300 million through 2023. onsemi was recently awarded the Association for Foreign Investments (AFI) Prize for Significant Contribution in the Field of Investment for its SiC investments in the Czech Republic.

Committed to providing innovative embedded solutions, AAEON has introduced the RBX-I2000, its first autonomous robot controller. The RBX-I2000 utilizes hardware-integrated time synchronization to obtain a substantial improvement on existing outdoor autonomous mobile robot technology, being the first of its kind to do so.

Powering its sophisticated mechanism is the 11th Generation Intel Core i7/i5/i3/Celeron Processor SoC, which boasts 4 cores and 8 threads for accurate algorithmic processing. Such an advanced processing unit means the RBX-I2000 is equipped with the power necessary for hardware-based time synchronization, which is channeled via an I/O featuring four 1PPS and ToD output ports to improve sensor fusion on two connectors.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced the launch of its X1 controller based solid state drive (SSD) platform that delivers the industry's most advanced enterprise SSD solution. Engineered with Phison's technology to meet the evolving demands of faster and smarter global data-center infrastructures, the X1 SSD platform was designed in partnership with Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions. The X1 SSD customizable platform offers more computing with less energy consumption. With a cost-effective solution that eliminates bottlenecks and improves quality of service, the X1 offers more than a 30 percent increase in data reads than existing market competitors for the same power used.

"We combined Seagate's proprietary data management and customer integration capabilities with Phison's cutting-edge technology to create highly customized SSDs that meet the ever-evolving needs of the enterprise storage market," said Sai Varanasi, senior vice president of product and business marketing at Seagate Technology. "Seagate is excited to partner with Phison on developing advanced SSD technology to provide the industry with increased density, higher performance and power efficiency for all mass capacity storage providers."

According to TrendForce, market conditions in 1H22 were chaotic and there was disparate demand for chips of varying functionality. Given the global development of electronic devices and power systems, overall demand for power management ICs (PMIC) is still relatively good. PMICs are used in consumer electronics, communications, computing, industrial control, automotive and other fields. In 2H22, supply and demand gradually diverged and demand for automotive Switching Regulators, Multi Channel PMICs was strongest.

According to TrendForce, there are various specifications and types of PMICs, including Linear Regulators, etc. Even usage scenario dependent products such as Battery Charging & Management, Voltage References, and USB Power Delivery ICs all fall into this category.

Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report. Fab equipment investment in 2023 is expected to remain strong.

"The global semiconductor equipment industry remains on track to cross the $100 billion threshold for the first time as shown in our latest update of the World Fab Forecast,"said Ajit Manocha, president and CEO of SEMI. "This historic milestone puts an exclamation point on the current run of unprecedented industry growth."

Ayar Labs, the leader in chip-to-chip optical connectivity, today announced that the company has secured $130 million in additional financing led by Boardman Bay Capital Management to drive the commercialization of its breakthrough optical I/O solution. Hewlett Packard Enterprise (HPE) and NVIDIA entered this investment round, joining existing strategic investors Applied Ventures LLC, GlobalFoundries, Intel Capital, and Lockheed Martin Ventures. Other new strategic and financial investors participating in the round include Agave SPV, Atreides Capital, Berkeley Frontier Fund, IAG Capital Partners, Infinitum Capital, Nautilus Venture Partners, and Tyche Partners. They join existing investors such as BlueSky Capital, Founders Fund, Playground Global, and TechU Venture Partners.

"As a successful technology-focused crossover fund operating for over a decade, Ayar Labs represents our largest private investment to date," said Will Graves, Chief Investment Officer at Boardman Bay Capital Management. "We believe that silicon photonics-based optical interconnects in the data center and telecommunications markets represent a massive new opportunity and that Ayar Labs is the leader in this emerging space with proven technology, a fantastic team, and the right ecosystem partners and strategy."

As industries compete to capitalize on the abundance of data generated by intelligent, connected devices, implementation of an intelligent data strategy has become even more critical. Edge computing has played an instrumental role to address this demand, but the edge itself has continued to evolve with the ever-growing need for even more demanding, real-time computing. Rugged edge computing enables applications that require real-time, low latency data processing and storage to function reliably in volatile environments that are not friendly to regular systems.

Trends and technologies such as Industry 4.0, AIoT, and 5G are driving the need for improved intelligence at the rugged edge. Businesses and organizations want more computing power at the edge because of the benefits it provides to their operations. NVM Express (NVMe) is an essential enabling technology for rugged edge computing, reducing latency and accelerating data processing to the point where connected devices can operate anywhere to perform machine learning, artificial intelligence, and inference computing. Real-time data access and analytics are turning rugged edge computing into a competitive necessity across all sectors and industries.

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

Marvell (NASDAQ: MRVL) today announced the industry's first 800 Gbps or 8x 100 Gbps multimode platform solution, that enables data center infrastructure to achieve dramatically higher speeds for short-reach optical modules and Active Optical Cable (AOC) applications. As artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications continue to drive greater bandwidth requirements, cloud-optimized solutions are needed that can bring lower power, latency and cost to short-range data center interconnections. The new 800G platform, which includes Marvell's PAM4 DSP with a multimode transimpedance amplifier (TIA) and Driver, enables faster data center speeds scaling to 800 Gbps, using conventional cost-effective vertical-cavity surface-emitting laser (VCSEL) technology while accelerating time-to-market with plug-and-play deployment.

Today's data centers are packed with equipment utilizing optical modules or AOCs connected by multimode optical fiber optimized for communication over short distances within data centers. This 100G per lane multimode fiber provides cost-effective, low-power, short-reach connectivity. To support multi-gigabit transmissions, multimode architectures often use VCSEL transmitters, which offer the cost benefits of reliability, power efficiency and easy deployment.

Kyle Bennett, head of HardOCP, and part of this Industry for several decades has posted an interesting editorial yesterday. While I don't agree with everything, he's making great points that are worth considering. The editorial begins with how and why GPU vendors will abolish the MSRP, because it's bringing nothing but bad press to them. No MSRP would also mean additional flexibility in pricing things—just set the price dynamically—no doubt that also helps to maximize profits.

I am sure both AMD and NVIDIA have marketing managers sitting around watching reviewer after reviewer slamming its company for "fake MSRP" and are now thinking about a solution to that.

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

The Semiconductor Industry Association (SIA) today announced Jensen Huang, founder and CEO of NVIDIA and a trailblazer in building accelerated computing platforms, is the 2021 recipient of the industry's highest honor, the Robert N. Noyce Award. SIA presents the Noyce Award annually in recognition of a leader who has made outstanding contributions to the semiconductor industry in technology or public policy. Huang will accept the award at the SIA Awards Dinner on Nov. 18, 2021.

"Jensen Huang's extraordinary vision and tireless execution have greatly strengthened our industry, revolutionized computing, and advanced artificial intelligence," said John Neuffer, SIA president and CEO. "Jensen's accomplishments have fueled countless innovations—from gaming to scientific computing to self-driving cars—and he continues to advance technologies that will transform our industry and the world. We're pleased to recognize Jensen with the 2021 Robert N. Noyce Award for his many achievements in advancing semiconductor technology."

TAITRA (Taiwan External Trade and Development Council) announced today that NVIDIA will be delivering a keynote, entitled "The Transformational Power of Accelerated Computing, from Gaming to the Enterprise Data Center" at COMPUTEX 2021 Hybrid. Jeff Fisher, Senior Vice President of NVIDIA's GeForce Business Unit, will present on June 1 at 1:00 pm Taiwan time on the massive opportunities that GeForce PC gaming represents for the Taiwan ecosystem.

Manuvir Das, Head of Enterprise Computing at NVIDIA, will then address "The Coming Democratization of AI." He will share three shifts driving this trend and explain how enterprises that embrace them can thrive in the coming years.

Since lobbying is both legal and regulated in the US (an attempt to bring attempts of influencing political power by corporations under legal boundaries, as opposed to being done in the dark), it feels like it was only a matter of time before big tech attempted to join under one banner. As such, the Semiconductors in America Coalition (SIAC) has now been put together, and boasts of 64 members including Microsoft, Apple, TSMC, Intel, AMD, NVIDIA, Arm, and Samsung. It seems that all of these companies - which are often at odds with one another when it comes to competing for consumers' choice and money - have found enough similarities to get organized in an attempt to nudge political power in their favor.

SIAC said in a press release that its mission is to "advance federal policies that promote semiconductor manufacturing and research in the U.S. to strengthen America's economy, national security, and critical infrastructure." The first announcement from the SIAC following its foundation was its intention to support the CHIPS for America Act. The Act (supported by The Semiconductor Industry Association (SIA) and President Joe Biden) has already been approved by the House and the Senate as part of the National Defense Authorization Act for 2021 but has not yet been funded. It seems that SIAC's first mission is to get the government to open up its $50 billion-deep pockets.

Worldwide sales of semiconductor manufacturing equipment surged 19% from $59.8 billion in 2019 to a new all-time high of $71.2 billion in 2020, SEMI, the industry association representing the global electronics product design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

For the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion. Sales in Taiwan, the second-largest equipment market, remained flat in 2020 with sales of $17.15 billion after showing strong growth in 2019. Korea registered 61% growth to $16.08 billion to maintain the third position. Annual spending also increased 21% in Japan and 16% in Europe as both regions are recovering from the contraction in 2019. Receipts in North America decreased 20% in 2020 following three years of consecutive growth.

NVIDIA today introduced a new class of NVIDIA-Certified Systems, bringing AI within reach for organizations that run their applications on industry-standard enterprise data center infrastructure. These include high-volume enterprise servers from top manufacturers, which were announced in January and are now certified to run the NVIDIA AI Enterprise software suite—which is exclusively certified for VMware vSphere 7, the world's most widely used compute virtualization platform.

Further expanding the NVIDIA-Certified servers ecosystem is a new wave of systems featuring the NVIDIA A30 GPU for mainstream AI and data analytics and the NVIDIA A10 GPU for AI-enabled graphics, virtual workstations and mixed compute and graphics workloads, also announced today.

The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales were $39.6 billion for the month of February 2021, an increase of 14.7% over the February 2020 total of $34.5 billion, but 1.0% less than the January 2021 total of $40.0 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 98% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

"Global semiconductor sales during the first two months of the year have outpaced sales from early in 2020, when the pandemic began to spread in parts of the world," said John Neuffer, SIA president and CEO. "Sales into the China market saw the largest year-to-year growth, largely because sales there were down substantially early last year."