Qualcomm announced today that it is officially licensing technology from Chinese technology giant Huawei. In a deal estimated to be worth $6.9 billion upon completion, Qualcomm will license various technologies from Huawei to integrate across its product portfolio. According to official releases, these technologies include computing, AI, networking, and more. Bloomberg reports that the deal also covers Huawei's latest LogicFolding silicon design. This is a significant win for Huawei, whose R&D teams have spent years designing a way to bypass sanctions and overcome manufacturing technology limits. By stacking silicon vertically across two sheets, LogicFolding dramatically reduces the distance between compute elements, increases efficiency, and significantly improves transistor density. The result is a 55% increase in transistor density and a 41% boost in power efficiency.

Update, 06:30 UTC, October 6: Qualcomm issued a statement that dismantles rumors that the company is licensing LogicFolding technology.

QualcommQualcomm and Huawei entered into a multi-year, broad patent license agreement that includes cross-licenses across a range of technology fields. The terms are confidential, but reports characterizing Qualcomm as a net payor on the license agreement are incorrect. In addition, assertions that the agreement is related to LogicFold are not accurate. Separately, Qualcomm has agreed to purchase certain Huawei non-cellular U.S. patents across multiple technology areas.