As we witness Apple's generational updates of the M series of chips, the highly anticipated SKU of the 3rd generation of Apple M series yet-to-be-announced top-of-the-line M3 Ultra chip is growing speculations from industry insiders. The latest round of reports suggests that the M3 Ultra might step away from its predecessor's design, potentially adopting a monolithic architecture without the UltraFusion interconnect technology. In the past, Apple has relied on a dual-chip design for its Ultra variants, using the UltraFusion interconnect to combine two M series Max chips. For example, the second generation M Ultra chip, M2 Ultra, boasts 134 billion transistors across two 510 mm² chips. However, die-shots of the M3 Max have sparked discussions about the absence of dedicated chip space for the UltraFusion interconnect.

While the absence of visible interconnect space on early die-shots is not conclusive evidence, as seen with the M1 Max not having visible UltraFusion interconnect and still being a part of M1 Ultra with UltraFusion, industry has led the speculation that the M3 Ultra may indeed feature a monolithic design. Considering that the M3 Max has 92 billion transistors and is estimated to have a die size between 600 and 700 mm², going Ultra with these chips may be pushing the manufacturing limit. Considering the maximum die size limit of 848 mm² for the TSMC N3B process used by Apple, there may not be sufficient space for a dual-chip M3 Ultra design. The potential shift to a monolithic design for the M3 Ultra raises questions about how Apple will scale the chip's performance without the UltraFusion interconnect. Competing solutions, such as NVIDIA's Blackwell GPU, use a high-bandwidth C2C interface to connect two 104 billion transistor chips, achieving a bandwidth of 10 TB/s. In comparison, the M2 Ultra's UltraFusion interconnect provided a bandwidth of 2.5 TB/s.

Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

With Windows 11 23H2 setting the stage for increased prevalence of AI in client PC use cases, the new hardware battleground between AMD and its rivals Intel, Apple, and Qualcomm, will be in equipping their mobile processors with sufficient AI acceleration performance. AMD already introduced accelerated AI with the current "Phoenix" processor that debuts Ryzen AI, and its Xilinx XDNA hardware backend that provides a performance of up to 16 TOPS. This will see a 2-3 fold increase with the company's 2024-25 mobile processor lineup, according to a roadmap leak by "Moore's Law is Dead."

At the very top of the pile, in a product segment called "ultimate compute," which consists of large gaming notebooks, mobile workstations, and desktop-replacements; the company's current Ryzen 7045 "Dragon Range" processor will continue throughout 2024. Essentially a non-socketed version of the desktop "Raphael" MCM, "Dragon Range" features up to two 5 nm "Zen 4" CCDs for up to 16 cores, and a 6 nm cIOD. This processor lacks any form of AI acceleration. In 2025, the processor will be succeeded with "Fire Range," a similar non-socketed, mobile-friendly MCM that's derived from "Granite Ridge," with up to two 4 nm "Zen 5" CCDs for up to 16 cores; and the 6 nm cIOD. What's interesting to note here, is that the quasi-roadmap makes no mention of AI acceleration for "Fire Range," which means "Granite Ridge" could miss out on Ryzen AI acceleration from the processor. Modern discrete GPUs from both NVIDIA and AMD support AI accelerators, so this must have been AMD's consideration to exclude an XDNA-based Ryzen AI accelerator on "Fire Range" and "Granite Ridge."

Apple today announced a new MacBook Pro lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max. With a next-generation GPU architecture and a faster CPU, the M3 family brings even more performance and remarkable new capabilities to MacBook Pro. The new 14‑inch MacBook Pro with M3 is not only great for everyday tasks, but also delivers phenomenal sustained performance in pro apps and games. Perfect for aspiring creatives, students, and entrepreneurs, it now starts at $1,599. The 14 and 16‑inch MacBook Pro with M3 Pro provides even greater performance and additional unified memory support, enabling more demanding workflows for users like coders, creatives, and researchers. The 14 and 16‑inch MacBook Pro with M3 Max delivers performance and capabilities that push the limits of computing. With a monster GPU and a powerful CPU, along with support for up to 128 GB of unified memory, MacBook Pro with M3 Max enables extreme workflows and multitasking across pro apps for users like machine learning programmers, 3D artists, and video editors. M3 Pro and M3 Max models also now come in space black, a gorgeous dark aluminium finish.

All MacBook Pro models feature a brilliant Liquid Retina XDR display with 20 percent brighter SDR content, a built-in 1080p camera, an immersive six-speaker sound system, and a wide array of connectivity options. With up to 22 hours of battery life, the lineup offers the ultimate in pro portability, delivering the same performance whether plugged in or on battery, so users can take their workflows anywhere. Customers can order the new MacBook Pro starting today, with availability beginning November 7.

Apple today announced M3, M3 Pro, and M3 Max, three chips featuring groundbreaking technologies that deliver dramatically increased performance and unleash new capabilities for Mac. These are the first personal computer chips built using the industry-leading 3-nanometer process technology, allowing more transistors to be packed into a smaller space and improving speed and efficiency. Together, M3, M3 Pro, and M3 Max show how far Apple silicon for the Mac has come since the debut of the M1 family of chips.

The M3 family of chips features a next-generation GPU that represents the biggest leap forward in graphics architecture ever for Apple silicon. The GPU is faster and more efficient, and introduces a new technology called Dynamic Caching, while bringing new rendering features like hardware-accelerated ray tracing and mesh shading to Mac for the first time. Rendering speeds are now up to 2.5x faster than on the M1 family of chips. The CPU performance cores and efficiency cores are 30 percent and 50 percent faster than those in M1, respectively, and the Neural Engine is 60 percent faster than the Neural Engine in the M1 family of chips. And, a new media engine now includes support for AV1 decode, providing more efficient and high-quality video experiences from streaming services. The M3 family of chips continues the tremendous pace of innovation in Apple silicon, and brings massive enhancements and new features to the new MacBook Pro and iMac.